NXP Semiconductors - MPC8358ECZQAGDGA

MPC8358ECZQAGDGA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8358ECZQAGDGA
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 668; Package Code: HBGA; Package Shape: SQUARE; Qualification: Not Qualified;
Datasheet MPC8358ECZQAGDGA Datasheet
In Stock1,391
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.46 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 668
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B668
Maximum Clock Frequency: 66.67 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 29 mm
Moisture Sensitivity Level (MSL): 3
Speed: 400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.26 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e0
Qualification: Not Qualified
Length: 29 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
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