LBGA Microprocessors 664

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
GCIXP1200FB	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel	0 Cel		BOTTOM	1.67 mm		40 mm		YES	32	200 MHz			40 mm	CMOS	2 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B432	1	Not Qualified	200 rpm	NO
GCIXP1200FC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel	0 Cel		BOTTOM	1.67 mm		40 mm		YES	32	232 MHz			40 mm	CMOS	2 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B432	1	Not Qualified	232 rpm	NO
GCIXP1200GC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel	0 Cel		BOTTOM	1.67 mm		40 mm		YES	32	232 MHz	NOT SPECIFIED	NOT SPECIFIED	40 mm	CMOS	2 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B432		Not Qualified	232 rpm	NO
GCIXP1250BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	520	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel		BOTTOM	1.7 mm		40 mm		YES	32	232 MHz	NOT SPECIFIED	NOT SPECIFIED	40 mm	CMOS	2 V			1.27 mm	FIXED POINT	S-PBGA-B520		Not Qualified	232 rpm	NO
KMPC8255ACVVMHBB	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	40	260	37.5 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO	e1
MPC8250ACZUMHBB	Motorola	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32	1.7/2.1,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.9 V	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	1.65 mm		37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64				37.5 mm	CMOS			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B480		Not Qualified	266 rpm		e0
MPC8347VVAJF	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.69 mm		35 mm		YES	32	66 MHz	40	260	35 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e1
MPC8250ACZUMHBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V				BOTTOM	1.65 mm		37.5 mm	REQUIRES 3.3V SUPPLY FOR I/O	YES	64		30	220	37.5 mm	CMOS	2 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	266 rpm	NO
MCF5232CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF54450VM240	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS	1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MPC8255AVVMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	40	260	37.5 mm	CMOS				1.27 mm	FLOATING POINT	S-PBGA-B480	3		266 rpm	NO	e1
MPC8270ZUUPEA	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA480,29X29,50	1.45 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	100 MHz	40	260	37.5 mm	CMOS	1.5 V		Other uPs/uCs/Peripheral ICs	1.27 mm	FLOATING POINT	S-PBGA-B480	4	Not Qualified	100 rpm	NO	e0
MPC8358CVVAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.14 V			TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS	1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	400 rpm	YES	e2
MPC8360VVAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		32	32	1.8/2.5,3.3	GRID ARRAY, LOW PROFILE	BGA740,37X37,40	1.15 V			TIN SILVER	BOTTOM	1.69 mm		37.5 mm		YES	32	66.67 MHz	40	260	37.5 mm	CMOS	1.3 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e2
ADSP-CM409CBCZ-AF	Analog Devices	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	212	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.47 V	16	24	32		GRID ARRAY, LOW PROFILE	BGA212,18X18,40	3.13 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	196608	19 mm		YES	16	60 MHz	30	260	19 mm	CMOS	3.3 V	17		1 mm	FLOATING POINT	S-PBGA-B212	3		240 rpm	YES
XPC8255CZUIFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V			TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
SCF5235F4CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3		150 rpm	YES	e1
XPC8260CZUHFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V			TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e0
XPC8260CVVIHBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
XPC8260CVVIFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
SCF5250VM120	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		25	32		GRID ARRAY, LOW PROFILE		1.08 V	85 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.86 MHz	40	260	15 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B196	3		120 rpm	YES
XPC8255ZUIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
XPC8260CZUIHBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V			TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
XPC8255VVIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
XPC8240LVV200E	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	200 rpm	YES	e1
XPC8260CZUIFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V				BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO
XPC8260VVIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
XPC8240RVV250E	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		35 mm		YES	32	66 MHz	30	245	35 mm	CMOS	2.5 V			1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	250 rpm	YES	e1
XPC8260VVHFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e1
XPC8260ZUIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	TIN LEAD SILVER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e0
XPC8260ZUIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel		BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	220	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO
XPC8240RZU250E	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.75 V		32	32		GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2.5 V	105 Cel	0 Cel		BOTTOM	1.65 mm		35 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	66 MHz			35 mm	CMOS	2.625 V			1.27 mm	FLOATING POINT	S-PBGA-B352			250 rpm	YES
XPC8260ZUHFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz			37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e0
XPC8260CVVHFBC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V			Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	166 rpm	NO	e1
XPC8260VVIFBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		37.5 mm		YES	64	66.66 MHz	30	245	37.5 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
MCF5234CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel		BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MCF5274LVF166	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3		166 rpm	YES	e0
MCF54450CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	40	260	17 mm	CMOS	1.5 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCF5274CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF5232CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MCF5274LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
MCF5271CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MCF54450VM180	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	UNSPECIFIED	YES	YES	1.65 V		32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	70 Cel	0 Cel		BOTTOM	1.6 mm		17 mm		YES	32	60 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS	1.5 V		Microprocessors	1 mm	FIXED POINT	S-XBGA-B256		Not Qualified	180 rpm	YES
MCF5234CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
MCF54450AVM240	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	16		40	260	17 mm	CMOS			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF54450ACVM180	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES			14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm		YES	16		40	260	17 mm	CMOS			Microprocessors	1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCF5270CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES
MCF5233CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.