Analog Devices - ADSP-CM409CBCZ-AF

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ADSP-CM409CBCZ-AF by Analog Devices

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Manufacturer Analog Devices
Manufacturer's Part Number ADSP-CM409CBCZ-AF
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 212; Package Code: LBGA; Package Shape: SQUARE;
Datasheet ADSP-CM409CBCZ-AF Datasheet
In Stock482
NAME DESCRIPTION
Minimum Supply Voltage: 3.13 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.7 mm
Surface Mount: YES
On Chip Data RAM Width: 16
No. of Terminals: 212
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE
No. of DMA Channels: 17
Address Bus Width: 24
Technology: CMOS
RAM Words: 196608
JESD-30 Code: S-PBGA-B212
Maximum Clock Frequency: 60 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Speed: 240 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.47 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA212,18X18,40
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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