Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
MICROPROCESSOR |
NO LEAD |
1156 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
0.65/1.4 |
GRID ARRAY |
LGA1156,40X40,36 |
BOTTOM |
CMOS |
110000 mA |
Microprocessors |
.9 mm |
S-PBGA-N1156 |
Not Qualified |
2660 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
40 |
260 |
25 mm |
CMOS |
1 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
800 rpm |
YES |
|||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
1156 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
0.65/1.4 |
GRID ARRAY |
LGA1156,40X40,36 |
BOTTOM |
CMOS |
110000 mA |
Microprocessors |
.9 mm |
S-PBGA-N1156 |
Not Qualified |
2800 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.2 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
LGA360,19X19,50 |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1400 MHz |
30 |
245 |
25 mm |
CMOS |
1.15 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
1400 rpm |
YES |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
40 |
260 |
25 mm |
CMOS |
1 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
1000 rpm |
YES |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
40 |
260 |
25 mm |
CMOS |
1.1 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
1250 rpm |
YES |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.1 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1267 MHz |
40 |
260 |
25 mm |
CMOS |
1.05 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
1267 rpm |
YES |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.2 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1400 MHz |
40 |
260 |
25 mm |
CMOS |
1.15 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
1400 rpm |
YES |
|||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1366 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
0.75/1.35 |
GRID ARRAY |
LGA1366,41X43,40 |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
100000 mA |
Microprocessors |
1 mm |
R-PBGA-N1366 |
Not Qualified |
1730 rpm |
|||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
1150 |
LGA |
SQUARE |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
S-XBGA-N1150 |
2700 rpm |
NO |
|||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
775 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
1.2 |
GRID ARRAY |
LGA775,30X33,46/43 |
BOTTOM |
CMOS |
75000 mA |
1.2 V |
Microprocessors |
1.1 mm |
R-PBGA-N775 |
Not Qualified |
1600 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1155 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
YES |
64 |
0.25/1.52 |
GRID ARRAY |
LGA1155,40X40,36 |
BOTTOM |
CMOS |
112000 mA |
Microprocessors |
.9 mm |
S-XBGA-N1155 |
Not Qualified |
3900 rpm |
||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
775 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
GRID ARRAY |
LGA775,30X33,46/43 |
BOTTOM |
CMOS |
75000 mA |
Microprocessors |
1.1 mm |
R-PBGA-N775 |
Not Qualified |
2800 rpm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
771 |
LGA |
RECTANGULAR |
PLASTIC |
YES |
64 |
0.85/1.35 |
GRID ARRAY |
LGA771,30X33,46/43 |
BOTTOM |
CMOS |
48000 mA |
Microprocessors |
1.1 mm |
R-PBGA-N771 |
Not Qualified |
2130 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
771 |
LGA |
RECTANGULAR |
PLASTIC |
YES |
64 |
0.85/1.35 |
GRID ARRAY |
LGA771,30X33,46/43 |
BOTTOM |
CMOS |
102000 mA |
Microprocessors |
1.1 mm |
R-PBGA-N771 |
Not Qualified |
2830 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
1366 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
0.75/1.35 |
GRID ARRAY |
LGA1366,41X43,40 |
BOTTOM |
CMOS |
150000 mA |
Microprocessors |
1 mm |
R-PBGA-N1366 |
Not Qualified |
3060 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
1366 |
LGA |
PLASTIC/EPOXY |
YES |
32 |
1.5,1.8 |
GRID ARRAY |
LGA1366(UNSPEC) |
BOTTOM |
CMOS |
145000 mA |
Microprocessors |
Not Qualified |
2660 rpm |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
2011 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
YES |
64 |
0.65/1.4 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
Microprocessors |
FIXED POINT |
S-XBGA-N2011 |
Not Qualified |
2000 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
3647 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
CMOS |
2200 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
3647 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
CMOS |
3400 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1155 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
0.25/1.52 |
GRID ARRAY |
LGA1155,40X40,36 |
BOTTOM |
CMOS |
75000 mA |
Microprocessors |
.9 mm |
S-PBGA-N1155 |
Not Qualified |
3300 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1155 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
0.25/1.52 |
GRID ARRAY |
LGA1155,40X40,36 |
BOTTOM |
CMOS |
75000 mA |
Microprocessors |
.9 mm |
S-PBGA-N1155 |
Not Qualified |
2900 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1155 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
0.25/1.52 |
GRID ARRAY |
LGA1155,40X40,36 |
BOTTOM |
CMOS |
112000 mA |
Microprocessors |
.9 mm |
S-PBGA-N1155 |
Not Qualified |
3100 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1151 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
FIXED POINT |
S-XBGA-N1151 |
3600 rpm |
NO |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
775 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
32 |
1.2 |
GRID ARRAY |
LGA775,30X33,46/43 |
BOTTOM |
CMOS |
1.2 V |
Microprocessors |
1.1 mm |
R-PBGA-N775 |
Not Qualified |
3200 rpm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR, RISC |
NO LEAD |
775 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
32 |
1.2 |
GRID ARRAY |
LGA775,30X33,46/43 |
GOLD |
BOTTOM |
CMOS |
1.2 V |
Microprocessors |
1.1 mm |
R-PBGA-N775 |
Not Qualified |
3200 rpm |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Intel |
MICROPROCESSOR |
NO LEAD |
1366 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
64 |
0.75/1.35 |
GRID ARRAY |
LGA1366,41X43,40 |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
150000 mA |
Microprocessors |
1 mm |
R-PBGA-N1366 |
Not Qualified |
2400 rpm |
|||||||||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
2011 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-XBGA-N2011 |
2100 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.75 V |
0 |
16 |
2.5,2.5/3.3 |
GRID ARRAY |
LCC48,.27SQ,20 |
2.25 V |
85 Cel |
CR16C |
-40 Cel |
NICKEL GOLD |
BOTTOM |
262144 |
YES |
0 |
12 MHz |
30 |
260 |
10240 |
CMOS |
15 mA |
2.5 V |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PBGA-N48 |
4 |
Not Qualified |
24 rpm |
YES |
e4 |
|||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.2 V |
36 |
32 |
GRID ARRAY |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.15 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.1 V |
0 |
32 |
GRID ARRAY |
1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1267 MHz |
25 mm |
CMOS |
1.05 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1267 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.25 V |
36 |
32 |
GRID ARRAY |
1.15 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.2 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1420 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
667 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
667 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.32 V |
36 |
32 |
GRID ARRAY |
1.25 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1700 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.2 V |
0 |
32 |
GRID ARRAY |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1400 MHz |
25 mm |
CMOS |
1.15 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1400 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.25 V |
36 |
32 |
GRID ARRAY |
1.15 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
LOW POWER TAKEN FROM SLEEP MODE |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.2 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1420 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.