Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.2 V |
36 |
32 |
GRID ARRAY |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
LOW POWER TAKEN FROM SLEEP MODE |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.15 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.3 V |
36 |
32 |
GRID ARRAY |
1.2 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
LOW POWER TAKEN FROM SLEEP MODE |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.25 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1600 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1267 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1267 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
667 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.3 V |
36 |
32 |
GRID ARRAY |
1.2 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.25 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1267 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1267 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
667 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC |
YES |
32 |
1.8,1.8/3.3 |
GRID ARRAY |
LGA360,19X19,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-XBGA-N360 |
Not Qualified |
450 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC |
YES |
32 |
1.8,1.8/3.3 |
GRID ARRAY |
LGA360,19X19,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-XBGA-N360 |
Not Qualified |
500 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC |
YES |
32 |
1.8,1.8/3.3 |
GRID ARRAY |
LGA360,19X19,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-XBGA-N360 |
Not Qualified |
500 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC |
YES |
32 |
1.8,1.8/3.3 |
GRID ARRAY |
LGA360,19X19,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-XBGA-N360 |
Not Qualified |
450 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC |
YES |
32 |
1.8,1.8/3.3 |
GRID ARRAY |
LGA360,19X19,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-XBGA-N360 |
Not Qualified |
400 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC |
YES |
32 |
1.8,1.8/3.3 |
GRID ARRAY |
LGA360,19X19,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-XBGA-N360 |
Not Qualified |
400 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
1.3,1.8/2.5 |
GRID ARRAY |
BGA360,19X19,50 |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
40 |
260 |
25 mm |
CMOS |
1 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
1 |
Not Qualified |
867 rpm |
YES |
|||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
4.89 mm |
47.5 mm |
47.5 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
180 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
4.89 mm |
47.5 mm |
47.5 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
150 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
4.89 mm |
47.5 mm |
47.5 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
133 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
MICROPROCESSOR, RISC |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
64 |
GRID ARRAY |
TIN LEAD |
BOTTOM |
4.89 mm |
47.5 mm |
47.5 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
100 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
NO LEAD |
447 |
LGA |
SQUARE |
CERAMIC |
YES |
64 |
5 |
GRID ARRAY |
LGA447,39X39 |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
2300 mA |
5 V |
Microprocessors |
2.54 mm |
S-XBGA-N447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.7 V |
64 |
64 |
GRID ARRAY |
2.5 V |
70 Cel |
0 Cel |
BOTTOM |
4.19 mm |
47.5 mm |
YES |
64 |
250 MHz |
47.5 mm |
MOS |
2.6 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
250 rpm |
NO |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.7 V |
64 |
64 |
GRID ARRAY |
2.5 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
4.19 mm |
47.5 mm |
YES |
64 |
225 MHz |
47.5 mm |
MOS |
2.6 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
225 rpm |
NO |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.7 V |
64 |
64 |
GRID ARRAY |
2.5 V |
70 Cel |
0 Cel |
BOTTOM |
4.19 mm |
47.5 mm |
YES |
64 |
300 MHz |
47.5 mm |
MOS |
2.6 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
300 rpm |
NO |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
70 Cel |
0 Cel |
BOTTOM |
4.19 mm |
47.5 mm |
YES |
64 |
200 MHz |
47.5 mm |
MOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
200 rpm |
NO |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
NO LEAD |
448 |
LGA |
SQUARE |
CERAMIC |
YES |
64 |
5 |
GRID ARRAY |
HLGA448-1,39X39 |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
2300 mA |
5 V |
Microprocessors |
2.54 mm |
S-XBGA-N448 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
70 Cel |
0 Cel |
BOTTOM |
4.19 mm |
47.5 mm |
YES |
64 |
180 MHz |
47.5 mm |
MOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
180 rpm |
NO |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.