MICROPROCESSOR Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8544ECVTALFA	NXP Semiconductors	MICROPROCESSOR		BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V					BOTTOM	3.38 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MC8641HX1000KC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.97 mm	33 mm	ALSO REQUIRIED 1.05 VDD CORE1	YES	64	166.66 MHz			33 mm	CMOS		.95 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1000 rpm	YES
MPC8315ECVRAGD	NXP Semiconductors	MICROPROCESSOR		BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15			GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.46 mm	29 mm		YES	32				29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B620			400 rpm	YES
MPC8313EVRAGD	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	YES	e1
MC8610TPX800GZ	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.7 mm	29 mm		YES	64				29 mm	CMOS		1 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	800 rpm	YES
MPC8349EVVAGFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8378ECVRAJFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32	1,1.8/2.5,2.5/3.3	GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	64	66.66 MHz	40	260	31 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B689	3	Not Qualified	533 rpm	YES	e2
MPC8349ZUAJDA	NXP Semiconductors	MICROPROCESSOR		BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V					BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	533 rpm	YES
MPC8343EVRADDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8349CZUAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e0
MPC8544ECVTAQGA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V					BOTTOM	2.8 mm	29 mm		YES	32	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
MPC8377VRAGFA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MC8641VU1000JC	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm	ALSO REQUIRIED 1.05 VDD CORE1	YES	64	166.66 MHz			33 mm	CMOS		.95 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1000 rpm	YES
MPC8378VRAND	NXP Semiconductors	MICROPROCESSOR																														CMOS
MPC8349ECZUAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MPC8347EVVAGDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8347EVRADDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8313EZQAGDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	YES	e0
MPC8377CVRAGFA	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	15	32		GRID ARRAY, HEAT SINK/SLUG	BGA689,29X29,40	.95 V	125 Cel	8	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS	.03 mA	1 V	4		1 mm	FLOATING POINT	S-PBGA-B689			400 rpm	YES
MPC8349EZUAJFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8347ECZQADDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e0
MC9328MX21VMR2	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	YES	32	32 MHz	40	260	17 mm	CMOS		1.5 V			.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
MPC8245ARZU466D	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.2 V		32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	2 V	85 Cel		0 Cel		BOTTOM	1.65 mm	35 mm					30	220	35 mm	CMOS		2.1 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	466 rpm	YES
MPC8533CVTAQJA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	64	32		GRID ARRAY		.95 V	90 Cel		0 Cel	TIN SILVER	BOTTOM	2.8 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES	e2
MPC8347CZUAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	400 rpm	YES	e0
MPC8347ZUAJDA	NXP Semiconductors	MICROPROCESSOR		BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V					BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	533 rpm	YES
MPC8533EVJARJA	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			1067 rpm	YES
MPC8313CZQAFFC	NXP Semiconductors	MICROPROCESSOR		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32		GRID ARRAY		.95 V				TIN LEAD	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516	3		333 rpm	YES	e0
MPC8347EZQAGFB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	400 rpm	YES
MPC5200BV400	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V	32			GRID ARRAY		1.42 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS		1.5 V			1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC8349ZUALDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		0 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8379VRAGG	NXP Semiconductors	MICROPROCESSOR																														CMOS
MPC8349ECVVALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8315EVRADDA	NXP Semiconductors	MICROPROCESSOR		BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32	1,1.8/2.5,3.3	GRID ARRAY	BGA620,28X28,40	.95 V				TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	266 rpm	YES	e2
MPC8347VVALFA	NXP Semiconductors	MICROPROCESSOR		BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V					BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8313VRAGDA	NXP Semiconductors	MICROPROCESSOR		BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32		GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	2.55 mm	27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	YES	e1
MPC8314CVRAFDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8378CVRAJDA	NXP Semiconductors	MICROPROCESSOR		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	32		GRID ARRAY		.95 V					BOTTOM	2.46 mm	31 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B689		Not Qualified	266 rpm	YES
MPC8540CVT833JC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V			1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8377CVRANF	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		-40 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MC8641DVU1500NB	NXP Semiconductors	MICROPROCESSOR		BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.15 V	16	32		GRID ARRAY		1.05 V	105 Cel		0 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.1 V			1 mm	FLOATING POINT	S-CBGA-B1023		Not Qualified	1500 rpm	YES
MPC8343EACZQADDB	NXP Semiconductors	MICROPROCESSOR																														CMOS
MPC8377EVRANDA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	689	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	15			GRID ARRAY, HEAT SINK/SLUG		1 V	125 Cel		0 Cel		BOTTOM	2.46 mm	31 mm		YES	64				31 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			800 rpm	YES
MPC8349ZUAGDA	NXP Semiconductors	MICROPROCESSOR		BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V					BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8347ZQALDB	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		0 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES
MPC8533EVTALJ	NXP Semiconductors	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY, HEAT SINK/SLUG		.95 V	90 Cel		0 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MC8640VU1000HC	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	32	32		GRID ARRAY		1 V	105 Cel		0 Cel	TIN SILVER	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V			1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1000 rpm	YES	e2
P1013SSN2LHB	NXP Semiconductors	MICROPROCESSOR																			TIN SILVER								40	260		CMOS								3				e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.