NXP Semiconductors - MPC8379VRAGG

The Texas Instruments AM5728BABCX microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and automotive electronics.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

XPC860SRZP50C1 by Motorola is a 32-bit RISC microprocessor with a clock frequency of 50 MHz. It operates at a supply voltage range of 3.135V to 3.465V, making it suitable for high-speed computing applications requiring low power consumption in compact devices. With a grid array package style and ball terminal form, this processor is ideal for surface mount designs with limited space constraints.

ADSP-21488KSWZ-4B1 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 25 MHz, making it suitable for applications requiring high-speed processing in commercial temperature environments. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

MCIMX6U6AVM08AC by NXP is a 64-bit microprocessor with 16-bit address bus, operating at max 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, supporting boundary scan technology. With a temp range of -40 to 125 °C, this CMOS processor has a terminal pitch of 0.8 mm and package style in grid array format.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

NXP Semiconductors' MPC8343ZQADDB microprocessor features 32-bit address and external data bus width, with integrated cache and max clock frequency of 66 MHz. Ideal for low power applications, it operates b/w 0-105°C, in a square grid array package with 620 terminals.

Intel TN80C188XL12 is a 16-bit microprocessor with 20-bit address bus, operating at max 25 MHz. Suitable for industrial applications, it features low power mode and supports external data bus width of 8 bits. With a package style of chip carrier and quad terminal position, it offers high performance in embedded systems.

The NXP Semiconductors MPC8347VVAJFB is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and low profile, this processor is ideal for space-constrained designs where power efficiency is crucial.

MC8640DTHX1250HC by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 166.66 MHz. Ideal for industrial applications, it features low power mode and boundary scan capability, with a package style of grid array and terminal finish of Tin/Lead (Sn/Pb).

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;