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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | MCIMX6U5EVM10AB |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH; |
Datasheet | MCIMX6U5EVM10AB Datasheet |
In Stock | 746 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.5 mm |
Sub-Category: | Graphics Processors |
Surface Mount: | YES |
Maximum Supply Current: | 2200 mA |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 2240 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B2240 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | LFBGA |
Width: | 21 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1000 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
JESD-609 Code: | e1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA624,25X25,32 |
Length: | 21 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Power Supplies (V): | 1.05/1.5 |