Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
0 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
70 Cel |
0 Cel |
QUAD |
.9 mm |
4 mm |
NO |
0 |
4 mm |
CMOS |
3.3 V |
.4 mm |
FIXED POINT |
S-PQCC-N32 |
NO |
|||||||||||||||||||||||||||||||||||||
Intel |
MICROPROCESSOR |
NO LEAD |
2011 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
YES |
64 |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
FIXED POINT |
R-XBGA-N2011 |
2100 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
2.75 V |
22 |
16 |
CHIP CARRIER |
2.25 V |
85 Cel |
-40 Cel |
QUAD |
1.1 mm |
7 mm |
YES |
16 |
7 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-XQCC-N48 |
24 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
LGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.75 V |
0 |
16 |
2.5,2.5/3.3 |
GRID ARRAY |
LCC48,.27SQ,20 |
2.25 V |
85 Cel |
CR16C |
-40 Cel |
NICKEL GOLD |
BOTTOM |
262144 |
YES |
0 |
12 MHz |
30 |
260 |
10240 |
CMOS |
15 mA |
2.5 V |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PBGA-N48 |
4 |
Not Qualified |
24 rpm |
YES |
e4 |
|||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
2.75 V |
22 |
16 |
CHIP CARRIER |
2.25 V |
85 Cel |
-40 Cel |
QUAD |
1.1 mm |
7 mm |
YES |
16 |
7 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-XQCC-N48 |
24 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR |
COMMERCIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
5.25 V |
0 |
24 |
32 |
CHIP CARRIER |
LCC68,.95SQ |
4.75 V |
70 Cel |
2 |
0 Cel |
QUAD |
0 |
NO |
32 |
10 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
NMOS |
300 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-CQCC-N68 |
Not Qualified |
10 rpm |
NO |
|||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
2.75 V |
22 |
16 |
CHIP CARRIER |
2.25 V |
85 Cel |
-40 Cel |
QUAD |
1.1 mm |
7 mm |
YES |
16 |
7 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-XQCC-N48 |
24 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
2.75 V |
22 |
16 |
CHIP CARRIER |
2.25 V |
85 Cel |
-40 Cel |
QUAD |
1.1 mm |
7 mm |
YES |
16 |
7 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-XQCC-N48 |
24 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
2.75 V |
22 |
16 |
CHIP CARRIER |
2.25 V |
85 Cel |
-40 Cel |
QUAD |
1.1 mm |
7 mm |
YES |
16 |
7 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-XQCC-N48 |
24 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
NO |
YES |
2.75 V |
22 |
16 |
CHIP CARRIER |
2.25 V |
85 Cel |
-40 Cel |
QUAD |
1.1 mm |
7 mm |
YES |
16 |
7 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-XQCC-N48 |
24 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
NO LEAD |
88 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
1.15 V |
1 |
AEC-Q100 |
24 |
40 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC88,.47SQ,20 |
1.05 V |
125 Cel |
3 |
-40 Cel |
QUAD |
.9 mm |
5242880 |
12 mm |
YES |
16 |
12 mm |
CMOS |
500 mA |
1.1 V |
65 |
.5 mm |
FLOATING POINT |
S-XQCC-N88 |
400 rpm |
NO |
|||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
NO LEAD |
88 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
1.15 V |
1 |
24 |
40 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC88,.47SQ,20 |
1.05 V |
115 Cel |
3 |
0 Cel |
QUAD |
.9 mm |
5242880 |
12 mm |
YES |
16 |
12 mm |
CMOS |
500 mA |
1.1 V |
65 |
.5 mm |
FLOATING POINT |
S-XQCC-N88 |
400 rpm |
NO |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
16 |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
4 MHz |
CMOS |
5 V |
S-CQCC-N44 |
4 rpm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC |
YES |
8 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
MOS |
5 V |
Microprocessors |
1.27 mm |
S-XQCC-N44 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
NO LEAD |
52 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
16 |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
4 MHz |
CMOS |
5 V |
S-CQCC-N52 |
4 rpm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
16 |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
10 MHz |
CMOS |
5 V |
S-CQCC-N44 |
10 rpm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
NO LEAD |
52 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
16 |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
10 MHz |
CMOS |
5 V |
S-CQCC-N52 |
10 rpm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
MOS |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-N44 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
MOS |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-N44 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
MOS |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-N44 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
16 |
16 |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
6 MHz |
CMOS |
5 V |
S-CQCC-N44 |
6 rpm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC |
YES |
8 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
MOS |
5 V |
Microprocessors |
1.27 mm |
S-XQCC-N44 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.2 V |
36 |
32 |
GRID ARRAY |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.15 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.1 V |
0 |
32 |
GRID ARRAY |
1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1267 MHz |
25 mm |
CMOS |
1.05 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1267 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.25 V |
36 |
32 |
GRID ARRAY |
1.15 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.2 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1420 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
867 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
867 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
667 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
667 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.32 V |
36 |
32 |
GRID ARRAY |
1.25 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.3 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1700 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.2 V |
0 |
32 |
GRID ARRAY |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1400 MHz |
25 mm |
CMOS |
1.15 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1400 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.25 V |
36 |
32 |
GRID ARRAY |
1.15 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
LOW POWER TAKEN FROM SLEEP MODE |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.2 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1420 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1250 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1250 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.2 V |
36 |
32 |
GRID ARRAY |
1.1 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
LOW POWER TAKEN FROM SLEEP MODE |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.15 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.3 V |
36 |
32 |
GRID ARRAY |
1.2 V |
105 Cel |
0 Cel |
BOTTOM |
1.8 mm |
25 mm |
LOW POWER TAKEN FROM SLEEP MODE |
YES |
64 |
200 MHz |
25 mm |
CMOS |
1.25 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N360 |
Not Qualified |
1600 rpm |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1000 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.15 V |
0 |
32 |
GRID ARRAY |
1.05 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
1267 MHz |
25 mm |
CMOS |
1.1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
1267 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
800 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
360 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
1.05 V |
0 |
32 |
GRID ARRAY |
.95 V |
105 Cel |
0 Cel |
BOTTOM |
2.8 mm |
25 mm |
NO |
0 |
600 MHz |
25 mm |
CMOS |
1 V |
1.27 mm |
FIXED POINT |
S-CBGA-N360 |
Not Qualified |
600 rpm |
YES |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.