STMicroelectronics - EF6808EM

STM32MP151AAB3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 724992 RAM words, 26-bit address bus width, and low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.

AM3352BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

The Intel FH8065301567313SR1X9 microprocessor features 64-bit architecture, 1170 terminals in a grid array package, and operates at speeds up to 1330 rpm. Ideal for industrial applications requiring high processing power and temperature resilience.

The NXP Semiconductors MIMXRT1052DVL6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power mode, it offers 29 serial I/Os and 32 DMA channels for efficient data transfer. With a compact square package style and integrated cache, it is suitable for embedded systems in various industries.

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

Microchip Technology's AT97SC3205T-H3M4C10B is an 8-bit RISC microprocessor with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a nominal voltage of 3.3V and CMOS technology. Ideal for industrial applications requiring a compact, surface-mount solution with very thin profile and no-lead terminal form.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn/Pb);

MICROPROCESSOR, RISC;

Intel FH8066802980002SR2YB is a 64-bit microprocessor with integrated cache, operating at 2400 rpm. Featuring 1296 terminals in a grid array package, it is ideal for high-performance computing applications requiring fixed-point processing and CMOS technology.

AM3703CUSD100 by Texas Instruments is a 32-bit microprocessor with 423 terminals, operating at up to 54 MHz. It features an integrated cache, 8-bit data RAM width, and 26-bit address bus width. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Microchip AT91SAM9X25-CU-999 is a 32-bit microprocessor with 8-bit RAM, 26-bit address bus, and 32-bit external data bus. It operates at up to 16 MHz clock frequency for industrial applications. With integrated cache and low power mode, it offers high performance in a compact square package.

MICROPROCESSOR;

The NXP Semiconductors MPC8314VRAGDA is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and heat sink/slug, this processor is ideal for use in various embedded systems where space efficiency is crucial.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Surface Mount: YES;