Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Broadcom |
MICROPROCESSOR, RISC |
MILITARY |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
100 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
20 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
85 Cel |
-40 Cel |
QUAD |
CMOS |
200 mA |
3.3 V |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
MILITARY |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
100 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
15 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
METAL |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
495 mA |
5 V |
Microprocessors |
.635 mm |
S-MQFP-G160 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
175 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA175,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
800 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P175 |
Not Qualified |
33.3 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
552 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
207 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
32 |
5 |
GRID ARRAY |
PGA207,17X17 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
500 mA |
5 V |
Microprocessors |
2.54 mm |
S-PPGA-P207 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
800 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
700 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
16.7 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
MILITARY |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
100 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
OTHER |
BALL |
399 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.12 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
17 mm |
YES |
32 |
12 MHz |
17 mm |
CMOS |
1.22 V |
.8 mm |
FLOATING POINT |
S-PBGA-B399 |
Not Qualified |
400 rpm |
YES |
||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
590 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
40 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
MILITARY |
PIN/PEG |
175 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA175,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P175 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
600 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
MILITARY |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
16.7 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
MILITARY |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
495 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
800 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
33 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
900 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
40 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
700 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
25 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
3.3 V |
Microprocessors |
.5 mm |
S-PQFP-G100 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
207 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
32 |
5 |
GRID ARRAY |
PGA207,17X17 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
500 mA |
5 V |
Microprocessors |
2.54 mm |
S-PPGA-P207 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
MILITARY |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
100 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
MILITARY |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
5 |
GRID ARRAY |
PGA144,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
100 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
20 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
INDUSTRIAL |
NO |
3.6 V |
32 |
32 |
2.7 V |
85 Cel |
-40 Cel |
TIN LEAD |
YES |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
3 V |
FIXED POINT |
Not Qualified |
NO |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
MILITARY |
PIN/PEG |
155 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA155,15X15 |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
552 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P155 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
0 |
32 |
GRID ARRAY |
1.6 V |
65 Cel |
-20 Cel |
BOTTOM |
1.97 mm |
NO |
0 |
14.7456 MHz |
CMOS |
1.8 V |
1 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
METAL |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
510 mA |
5 V |
Microprocessors |
.635 mm |
S-MQFP-G160 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA179,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
200 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P179 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
345 mA |
5 V |
Microprocessors |
.635 mm |
S-PQFP-G160 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
207 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA207,17X17 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
500 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P207 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
299 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
32 |
32 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
6.7564 mm |
52.324 mm |
NO |
64 |
30 |
225 |
52.324 mm |
MOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P299 |
Not Qualified |
66 rpm |
NO |
e0 |
|||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
GULL WING |
160 |
QFP |
SQUARE |
METAL |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
700 mA |
5 V |
Microprocessors |
.635 mm |
S-MQFP-G160 |
Not Qualified |
25 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
METAL |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
50 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
765 mA |
5 V |
Microprocessors |
.635 mm |
S-MQFP-G160 |
Not Qualified |
50 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
179 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
32 |
5 |
GRID ARRAY |
PGA179,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
5 V |
Microprocessors |
2.54 mm |
S-PPGA-P179 |
Not Qualified |
25 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.45 V |
32 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3.15 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
70 MHz |
30 |
240 |
14 mm |
MOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
70 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
175 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA175,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P175 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Broadcom |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
207 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA207,17X17 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P207 |
Not Qualified |
40 rpm |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.