Broadcom - L64831GC-40

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;

QU80386EXTC33 by Intel is a 32-bit microprocessor with an address bus width of 26 bits and external data bus width of 16 bits. Operating at a max clock frequency of 25 MHz, it features low power mode and boundary scan capabilities. Ideal for applications requiring high-speed processing in compact systems with limited power consumption.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA357,19X19,50;

NXP Semiconductors' MPC860TCZQ50D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for applications requiring low power mode, such as embedded systems and networking devices.

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

NXP Semiconductors' MPC8309CVMAGDCA is a 32-bit microprocessor with integrated cache, operating at up to 66.67 MHz. Ideal for industrial applications, it features low power mode and boundary scan capability. Package style: GRID ARRAY, LOW PROFILE, FINE PITCH; Technology: CMOS; Supply Voltage: 0.95V - 1.05V.

Texas Instruments SMOMAPL138BGWTA3R is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating-point format processing. With a terminal pitch of 0.8 mm and 361 terminals, it offers high performance in a compact package style.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

The NXP Semiconductors P2010NXN2KFC microprocessor features a 64-bit external data bus width, 16-bit address bus width, and operates at a max clock frequency of 100 MHz. It is commonly used in applications requiring low power consumption and high processing speeds, such as embedded systems and IoT devices.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

AM3352BZCE30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. The package style is grid array, making it ideal for compact designs in various electronic devices.

MICROPROCESSOR, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;

MICROPROCESSOR;

Z84C0010PEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 10 MHz. It has a supply voltage range of 4.5-5.5 V and temp range of -40 to 100 °C. Ideal for industrial applications requiring low power consumption and fixed-point processing in a compact IN-LINE package style.