Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
650 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
550 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
12.5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
700 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
90 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
630 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
630 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
630 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
90 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
16.67 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
PIN/PEG |
175 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA175,15X15 |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
650 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P175 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Microprocessors |
.635 mm |
S-PQFP-G160 |
Not Qualified |
20 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
16.67 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
550 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
12.5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
90 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
650 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
700 mA |
5 V |
Microprocessors |
.635 mm |
S-PQFP-G160 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
650 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
PGA179,18X18 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P179 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
700 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
PIN/PEG |
175 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA175,15X15 |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
700 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P175 |
Not Qualified |
33 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
5 |
FLATPACK |
QFP160,1.2SQ |
80 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
650 mA |
5 V |
Microprocessors |
.635 mm |
S-PQFP-G160 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
SPGA447,39X39 |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
FLAT |
172 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL172,1.2SQ,25 |
90 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
650 mA |
5 V |
Microprocessors |
.635 mm |
S-XQFP-F172 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
90 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
630 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
16.7 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
PGA179,18X18 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1820 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P179 |
Not Qualified |
50 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
MILITARY |
THROUGH-HOLE |
52 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
5 |
IN-LINE |
DIP52,.9 |
125 Cel |
-55 Cel |
DUAL |
CMOS |
173 mA |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T52 |
Not Qualified |
13.3 rpm |
|||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5,3.3 |
GRID ARRAY |
BGA388,26X26,50 |
70 Cel |
0 Cel |
BOTTOM |
Microprocessors |
1.27 mm |
S-PBGA-B388 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
170 mA |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
3 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR |
OTHER |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
24 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.1 mm |
24.3 mm |
NO |
16 |
25 MHz |
24.3 mm |
NMOS |
600 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
12.5 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.1 mm |
24.3 mm |
PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS |
NO |
16 |
16 MHz |
24.3 mm |
NMOS |
550 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
8 rpm |
NO |
e0 |
|||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
600 mA |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
16 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA68,11X11 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P68 |
Not Qualified |
8 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
NO LEAD |
68 |
QCCN |
SQUARE |
CERAMIC |
YES |
16 |
5 |
CHIP CARRIER |
LCC68A,.95SQ |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
500 mA |
5 V |
Microprocessors |
1.27 mm |
S-XQCC-N68 |
Not Qualified |
6 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA68,11X11 |
85 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P68 |
Not Qualified |
12.5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA68,11X11 |
55 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
600 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P68 |
Not Qualified |
8 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
5.1 mm |
24.3 mm |
PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS |
NO |
8 |
20 MHz |
24.3 mm |
NMOS |
550 mA |
5 V |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
10 rpm |
NO |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.