Infineon Technologies - CYNCP80192-BGC

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CYNCP80192-BGC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CYNCP80192-BGC
Description Microprocessors; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
Datasheet CYNCP80192-BGC Datasheet
In Stock429
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microprocessors
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 388
Qualification: Not Qualified
Package Equivalence Code: BGA388,26X26,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B388
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 2.5,3.3
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