Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
170 mA |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
3 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
QFP52,.7SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
35 mA |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
10 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
QFP52,.7SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
35 mA |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
10 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR |
INDUSTRIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
24 |
GRID ARRAY |
4.5 V |
85 Cel |
-40 Cel |
PERPENDICULAR |
NO |
16 |
CMOS |
5 V |
FIXED POINT |
S-CPGA-P68 |
10 rpm |
YES |
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Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
16 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
60 mA |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
YES |
64 |
125 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
250 rpm |
YES |
e3 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
128 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
FLATPACK, HEAT SINK/SLUG |
HQFP128,1.2SQ,32 |
3.135 V |
85 Cel |
6 |
-40 Cel |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
100 MHz |
28 mm |
CMOS |
1200 mA |
3.3 V |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
200 rpm |
YES |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
176 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA176,15X15 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
240 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P176 |
Not Qualified |
25 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1500 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
50 rpm |
e0 |
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|
Renesas Electronics |
MICROPROCESSOR, RISC |
BALL |
352 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.6 V |
32 |
GRID ARRAY, FINE PITCH |
1.4 V |
TIN SILVER COPPER |
BOTTOM |
1.8 mm |
23 mm |
YES |
32 |
33.33 MHz |
20 |
260 |
23 mm |
CMOS |
1.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B352 |
3 |
Not Qualified |
100 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
TQFP80,.55SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
180 mA |
Microprocessors |
.5 mm |
S-PQFP-G80 |
Not Qualified |
20 rpm |
e0 |
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|
Renesas Electronics |
MICROPROCESSOR, RISC |
3 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.465 V |
0 |
26 |
32 |
FLATPACK, FINE PITCH |
3.135 V |
70 Cel |
5 |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
0 |
27.69 mm |
YES |
32 |
50 MHz |
27.69 mm |
CMOS |
270 mA |
3.3 V |
4 |
2 |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
Not Qualified |
25 rpm |
NO |
e0 |
||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
5 |
GRID ARRAY |
PGA68,11X11 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P68 |
Not Qualified |
10 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
TIN LEAD |
PERPENDICULAR |
CMOS |
2400 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-PPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
NO LEAD |
59 |
LGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
2.7 V |
64 |
64 |
GRID ARRAY |
2.5 V |
70 Cel |
0 Cel |
BOTTOM |
4.19 mm |
47.5 mm |
YES |
64 |
300 MHz |
47.5 mm |
MOS |
2.6 V |
1.27 mm |
FLOATING POINT |
S-CBGA-N59 |
Not Qualified |
300 rpm |
NO |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
6 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.6 V |
75 Cel |
-20 Cel |
TIN LEAD |
QUAD |
3.56 mm |
28 mm |
YES |
64 |
34 MHz |
28 mm |
CMOS |
1.8 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
167 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5/3.3 |
FLATPACK |
QFP160,1.0SQ,20 |
85 Cel |
-40 Cel |
TIN BISMUTH |
QUAD |
10 |
260 |
CMOS |
160 mA |
Microprocessors |
.5 mm |
S-PQFP-G160 |
3 |
Not Qualified |
143 rpm |
e6 |
|||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
26 |
32 |
1.8,3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
1.6 V |
75 Cel |
-20 Cel |
TIN LEAD |
QUAD |
3.56 mm |
28 mm |
YES |
64 |
34 MHz |
28 mm |
CMOS |
1.8 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
167 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
1.5,3.3 |
GRID ARRAY |
1.35 V |
75 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.1 mm |
27 mm |
YES |
32 |
34 MHz |
27 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
YES |
64 |
90 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
180 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
26 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3.15 V |
75 Cel |
-20 Cel |
Tin/Bismuth (Sn/Bi) |
QUAD |
1.7 mm |
20 mm |
32 |
100 MHz |
20 |
260 |
20 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
3 |
Not Qualified |
100 rpm |
YES |
e6 |
||||||||||||||||||||||||||||||
Renesas Electronics |
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|
Renesas Electronics |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
320 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
26 |
32 |
GRID ARRAY |
1.14 V |
125 Cel |
-40 Cel |
BOTTOM |
YES |
32 |
CMOS |
1.2 V |
FLOATING POINT |
S-PBGA-B320 |
3 |
450 rpm |
YES |
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Renesas Electronics |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
3.3 |
FLATPACK |
QFP128,1.2SQ,32 |
3.135 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
100 MHz |
30 |
225 |
27.69 mm |
CMOS |
450 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
100 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
3.465 V |
0 |
64 |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
3.135 V |
85 Cel |
2 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
0 |
52.324 mm |
CACHE COHERENCY |
YES |
64 |
100 MHz |
52.324 mm |
CMOS |
3.3 V |
0 |
0 |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P447 |
Not Qualified |
100 rpm |
NO |
e0 |
||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
16 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
340 mA |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
264 |
LFBGA |
SQUARE |
UNSPECIFIED |
YES |
YES |
1.7 V |
26 |
32 |
1.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA264,17X17,32 |
1.4 V |
75 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
15 mm |
YES |
64 |
34 MHz |
20 |
260 |
15 mm |
CMOS |
1.5 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-XBGA-B264 |
3 |
Not Qualified |
133 rpm |
YES |
e1 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
110 mA |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
12.5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
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|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, FINE PITCH |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
NO |
64 |
75 MHz |
28 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
150 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
1900 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
FLATPACK |
QFP52,.8SQ,40 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
16 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
FLATPACK |
QFP52,.8SQ,40 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
80 mA |
5 V |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
8 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
2,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
1.8 V |
75 Cel |
-20 Cel |
TIN LEAD |
BOTTOM |
2.1 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.95 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
200 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
32 |
64 |
3.3 |
FLATPACK |
QFP128,1.2SQ,32 |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.86 mm |
27.69 mm |
NO |
32 |
100 MHz |
30 |
225 |
27.69 mm |
CMOS |
450 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
100 rpm |
YES |
e0 |
|||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP208,1.2SQ,20 |
3.135 V |
85 Cel |
6 |
-40 Cel |
QUAD |
4.1 mm |
28 mm |
YES |
64 |
90 MHz |
28 mm |
CMOS |
1200 mA |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
180 rpm |
YES |
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Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
5 |
GRID ARRAY |
HPGA179,18X18 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2900 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P179 |
Not Qualified |
67 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
120 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
26 |
32 |
FLATPACK, THIN PROFILE, FINE PITCH |
3 V |
75 Cel |
-20 Cel |
QUAD |
1.2 mm |
14 mm |
NO |
16 |
45 MHz |
14 mm |
CMOS |
3.3 V |
.4 mm |
FIXED POINT |
S-PQFP-G120 |
Not Qualified |
45 rpm |
NO |
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Renesas Electronics |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
20 |
8 |
CHIP CARRIER |
4.5 V |
85 Cel |
-40 Cel |
QUAD |
4.6 mm |
24.2 mm |
NO |
8 |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
24.2 mm |
CMOS |
5 V |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
10 rpm |
YES |
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Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
144 mA |
Microprocessors |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
16 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC |
YES |
MIL-STD-883 Class S (Modified) |
8 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
10 mA |
5 V |
Microprocessors |
1.27 mm |
S-XQCC-N44 |
Not Qualified |
2 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
20 mA |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
4 rpm |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.