Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
24 |
16 |
IN-LINE, SHRINK PITCH |
4.75 V |
70 Cel |
0 Cel |
DUAL |
5.08 mm |
19.05 mm |
NO |
16 |
8 MHz |
57.6 mm |
CMOS |
5 V |
1.778 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
8 rpm |
YES |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2400 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
+-5,12 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
3 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
DUAL |
CMOS |
170 mA |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
5 rpm |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
YES |
64 |
100 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.625 V |
32 |
32 |
2.5,3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
4.1 mm |
28 mm |
YES |
32 |
75 MHz |
30 |
225 |
28 mm |
CMOS |
2.5 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G208 |
3 |
Not Qualified |
150 rpm |
YES |
e0 |
||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
QFP80,.7X.9,32 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
180 mA |
Microprocessors |
.8 mm |
R-PQFP-G80 |
Not Qualified |
20 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
QFP80,.7X.9,32 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
144 mA |
Microprocessors |
.8 mm |
R-PQFP-G80 |
Not Qualified |
16 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
179 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
3.3 |
GRID ARRAY |
PGA179,18X18 |
TIN LEAD |
PERPENDICULAR |
CMOS |
2800 mA |
3.3 V |
Microprocessors |
2.54 mm |
S-PPGA-P179 |
Not Qualified |
75 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.7 V |
26 |
32 |
FLATPACK, FINE PITCH |
1.4 V |
75 Cel |
-20 Cel |
QUAD |
3.56 mm |
28 mm |
YES |
64 |
34 MHz |
28 mm |
CMOS |
1.5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
128 rpm |
YES |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
120 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.5 V |
32 |
64 |
3.3 |
FLATPACK |
QFP120,1.2SQ,32 |
3 V |
85 Cel |
0 Cel |
TIN BISMUTH |
QUAD |
3.5 mm |
28 mm |
YES |
32 |
66.7 MHz |
10 |
260 |
28 mm |
MOS |
690 mA |
3.3 V |
Microprocessors |
.8 mm |
FLOATING POINT |
S-PQFP-G120 |
4 |
Not Qualified |
133 rpm |
NO |
e6 |
||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
YES |
64 |
125 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
250 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
TIN BISMUTH |
e6 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MIL-STD-883 Class B (Modified) |
12 |
IN-LINE |
DIP40,.6 |
125 Cel |
-55 Cel |
DUAL |
CMOS |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
2.5 rpm |
||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
YES |
64 |
90 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
Not Qualified |
180 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
MIL-STD-883 |
24 |
GRID ARRAY |
4.5 V |
125 Cel |
-55 Cel |
PERPENDICULAR |
NO |
16 |
CMOS |
5 V |
FIXED POINT |
S-CPGA-P68 |
10 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2.07 V |
26 |
32 |
GRID ARRAY |
1.8 V |
75 Cel |
-20 Cel |
BOTTOM |
2.5 mm |
27 mm |
YES |
64 |
34 MHz |
27 mm |
CMOS |
1.95 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B256 |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
PIN/PEG |
179 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
64 |
64 |
GRID ARRAY |
3.135 V |
85 Cel |
0 Cel |
MATTE TIN |
PERPENDICULAR |
5.207 mm |
47.244 mm |
NO |
64 |
67 MHz |
47.244 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P179 |
Not Qualified |
133 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
30 mA |
Microprocessors |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
6 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
CERAMIC |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
2200 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-XPGA-P447 |
Not Qualified |
67 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
144 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA144,15X15 |
70 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
CMOS |
500 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P144 |
Not Qualified |
12.5 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
2.5/3.3,1.5 |
GRID ARRAY |
BGA272,21X21,50 |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-PBGA-B272 |
Not Qualified |
300 rpm |
|||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
132 |
PGA |
SQUARE |
CERAMIC |
NO |
16 |
3.3/5 |
GRID ARRAY |
PGA132,14X14 |
Tin/Lead (Sn/Pb) |
PERPENDICULAR |
CMOS |
Microprocessors |
2.54 mm |
S-XPGA-P132 |
Not Qualified |
10 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
16 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
YES |
64 |
100 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
Tin/Lead (Sn/Pb) |
QUAD |
670 mA |
3.3 V |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
80 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
64 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE, SHRINK PITCH |
SDIP64,.75 |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
20 mA |
5 V |
Microprocessors |
1.78 mm |
R-PDIP-T64 |
Not Qualified |
4 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
5 |
FLATPACK |
QFP80,.7X.9,32 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
90 mA |
5 V |
Microprocessors |
.8 mm |
R-PQFP-G80 |
Not Qualified |
8 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
FLATPACK |
QFP52,.8SQ,40 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
12 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
30 mA |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
6 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
120 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
FLATPACK |
QFP120,.87SQ,20 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
136.4 mA |
5 V |
Microprocessors |
.5 mm |
S-PQFP-G120 |
Not Qualified |
16 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.465 V |
0 |
32 |
32 |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
3.135 V |
70 Cel |
6 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
4.57 mm |
0 |
29.2862 mm |
BURST BUS; 5 PIPELINE STAGES |
NO |
32 |
33.33 MHz |
30 |
225 |
29.2862 mm |
CMOS |
130 mA |
3.3 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
1 |
Not Qualified |
16.67 rpm |
NO |
e0 |
|||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
64 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
19 |
8 |
IN-LINE, SHRINK PITCH |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
5.08 mm |
19.05 mm |
NO |
8 |
20 MHz |
57.6 mm |
CMOS |
5 V |
1.778 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
10 rpm |
YES |
e0 |
||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.25 V |
20 |
16 |
IN-LINE |
4.75 V |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
NO |
16 |
8 MHz |
CMOS |
5 V |
FIXED POINT |
R-CDIP-T40 |
Qualified |
8 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
QFP52,.7SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
43.75 mA |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
12.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL EXTENDED |
BALL |
292 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.6 V |
26 |
32 |
GRID ARRAY, FINE PITCH |
1.35 V |
75 Cel |
-20 Cel |
BOTTOM |
2 mm |
17 mm |
YES |
32 |
34 MHz |
17 mm |
CMOS |
1.5 V |
.8 mm |
FLOATING POINT |
S-PBGA-B292 |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
MICROPROCESSOR, RISC |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
16 |
5 |
FLATPACK |
QFP80,.7X.9,32 |
70 Cel |
-10 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
90 mA |
5 V |
Microprocessors |
.8 mm |
R-PQFP-G80 |
Not Qualified |
8 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
43.75 mA |
Microprocessors |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
12.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
TQFP80,.55SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
90 mA |
Microprocessors |
.5 mm |
S-PQFP-G80 |
Not Qualified |
10 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
30 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3.135 V |
85 Cel |
6 |
0 Cel |
QUAD |
1.6 mm |
20 mm |
YES |
32 |
67 MHz |
20 mm |
CMOS |
250 mA |
3.3 V |
.5 mm |
FIXED-POINT |
S-PQFP-G144 |
133 rpm |
YES |
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Renesas Electronics |
MICROPROCESSOR, RISC |
PIN/PEG |
447 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
3.3 |
GRID ARRAY |
SPGA447,39X39 |
TIN LEAD |
PERPENDICULAR |
CMOS |
2000 mA |
3.3 V |
Microprocessors |
1.27 mm |
S-PPGA-P447 |
Not Qualified |
50 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
GULL WING |
208 |
QFP |
SQUARE |
METAL |
YES |
64 |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
1350 mA |
5 V |
Microprocessors |
.5 mm |
S-MQFP-G208 |
Not Qualified |
133 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MICROPROCESSOR, RISC |
OTHER |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
64 |
64 |
FLATPACK |
3.135 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
YES |
64 |
100 MHz |
CMOS |
3.3 V |
FLOATING POINT |
S-PQFP-G128 |
3 |
Not Qualified |
200 rpm |
YES |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
QFP52,.7SQ,40 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
56 mA |
Microprocessors |
1 mm |
S-PQFP-G52 |
Not Qualified |
16 rpm |
e0 |
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Renesas Electronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
+-5,12 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
2 rpm |
e0 |
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|
Renesas Electronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
5.25 V |
64 |
64 |
FLATPACK, FINE PITCH |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4.1 mm |
28 mm |
64 |
125 MHz |
28 mm |
CMOS |
5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
267 rpm |
YES |
e3 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.