Renesas Electronics - UPD70216HGF-20-3B9

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UPD70216HGF-20-3B9 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD70216HGF-20-3B9
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR;
Datasheet UPD70216HGF-20-3B9 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 20 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 16
Maximum Supply Current: 180 mA
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Terminals: 80
Qualification: Not Qualified
Package Equivalence Code: QFP80,.7X.9,32
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G80
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
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