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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | P1022NXN2HFB |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm; |
Datasheet | P1022NXN2HFB Datasheet |
In Stock | 1,738 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 2.46 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER |
No. of Terminals: | 689 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B689 |
Maximum Clock Frequency: | 133 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 800 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Length: | 31 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |