Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
24 |
16 |
5 |
GRID ARRAY |
PGA68,10X10 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
4.86 mm |
0 |
26.92 mm |
NO |
16 |
8 MHz |
26.92 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
372 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
32 |
32 |
GRID ARRAY |
1.8 V |
85 Cel |
-40 Cel |
BOTTOM |
2.6 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
27 MHz |
27 mm |
CMOS |
1.87 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B372 |
Not Qualified |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
16 |
16 |
IN-LINE |
4.75 V |
70 Cel |
3 |
0 Cel |
DUAL |
4.445 mm |
0 |
15.24 mm |
NO |
16 |
10 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
10 rpm |
YES |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
16 mm |
YES |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
600 rpm |
NO |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
PIN/PEG |
168 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
32 |
32 |
GRID ARRAY |
85 Cel |
0 Cel |
PERPENDICULAR |
4.57 mm |
44.45 mm |
NO |
32 |
33.33 MHz |
44.45 mm |
CMOS |
5 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P168 |
Not Qualified |
66 rpm |
YES |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
24 |
16 |
5 |
IN-LINE |
DIP64,.9 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
DUAL |
5.59 mm |
0 |
22.86 mm |
NO |
16 |
8 MHz |
81.535 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
296 |
IPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.7 V |
32 |
64 |
GRID ARRAY, INTERSTITIAL PITCH |
3.15 V |
70 Cel |
0 Cel |
PERPENDICULAR |
4.7 mm |
49.595 mm |
NO |
64 |
40 MHz |
49.595 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P296 |
Not Qualified |
80 rpm |
YES |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
PIN/PEG |
168 |
PGA |
SQUARE |
PLASTIC/EPOXY |
YES |
NO |
32 |
32 |
GRID ARRAY |
85 Cel |
0 Cel |
PERPENDICULAR |
4.57 mm |
44.45 mm |
NO |
32 |
37.5 MHz |
44.45 mm |
CMOS |
5 V |
2.54 mm |
FLOATING POINT |
S-PPGA-P168 |
Not Qualified |
75 rpm |
YES |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
PIN/PEG |
168 |
PGA |
SQUARE |
PLASTIC/EPOXY |
YES |
NO |
32 |
32 |
GRID ARRAY |
85 Cel |
0 Cel |
PERPENDICULAR |
4.57 mm |
44.45 mm |
NO |
32 |
25 MHz |
44.45 mm |
CMOS |
5 V |
2.54 mm |
FLOATING POINT |
S-PPGA-P168 |
Not Qualified |
75 rpm |
YES |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
CMOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
24 |
16 |
5 |
GRID ARRAY |
PGA68,10X10 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
PERPENDICULAR |
4.86 mm |
0 |
26.92 mm |
NO |
16 |
12.5 MHz |
26.92 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
S-CPGA-P68 |
Not Qualified |
12.5 rpm |
NO |
e0 |
||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
16 |
16 |
IN-LINE |
4.75 V |
85 Cel |
3 |
-40 Cel |
DUAL |
3.6 mm |
0 |
15.24 mm |
NO |
16 |
10 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
10 rpm |
YES |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
32 |
32 |
FLATPACK, FINE PITCH |
85 Cel |
0 Cel |
QUAD |
3.8 mm |
28 mm |
NO |
32 |
33.33 MHz |
28 mm |
CMOS |
5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
100 rpm |
YES |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
16 |
IN-LINE |
4.75 V |
70 Cel |
3 |
0 Cel |
DUAL |
3.73 mm |
0 |
15.24 mm |
NO |
16 |
10 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-CDIP-T48 |
Not Qualified |
10 rpm |
YES |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
5.5 V |
16 |
16 |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.72 mm |
15.24 mm |
16 |
6 MHz |
CMOS |
5 V |
2.54 mm |
R-XDIP-T48 |
6 rpm |
||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
3.3 |
GRID ARRAY |
BGA388,26X26,50 |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
CMOS |
3.3 V |
Microprocessors |
1.27 mm |
S-PBGA-B388 |
Not Qualified |
100 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
5.5 V |
16 |
16 |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.72 mm |
15.24 mm |
16 |
10 MHz |
CMOS |
5 V |
2.54 mm |
R-XDIP-T48 |
10 rpm |
||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
PIN/PEG |
84 |
PGA |
SQUARE |
CERAMIC |
NO |
32 |
5 |
GRID ARRAY |
PGA84,10X10 |
70 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
CMOS |
210.5 mA |
5 V |
Microprocessors |
2.54 mm |
S-XPGA-P84 |
Not Qualified |
20 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
32 |
32 |
3.45 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ |
3.3 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.8 mm |
28 mm |
NO |
32 |
33 MHz |
28 mm |
CMOS |
850 mA |
3.45 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
66 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
TIN SILVER |
30 |
260 |
3 |
e2 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
FLAT |
84 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL84,1.1SQ |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
CMOS |
5 V |
Microprocessors |
1.27 mm |
S-XQFP-F84 |
Not Qualified |
20 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
3.6 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
2.5 MHz |
NMOS |
150 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
2.5 rpm |
NO |
e0 |
|||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
PIN/PEG |
296 |
IPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.7 V |
32 |
64 |
3.3 |
GRID ARRAY, INTERSTITIAL PITCH |
SPGA296,37X37 |
3.15 V |
70 Cel |
0 Cel |
TIN LEAD |
PERPENDICULAR |
4.7 mm |
49.595 mm |
NO |
64 |
55.55 MHz |
49.595 mm |
CMOS |
5800 mA |
3.3 V |
Microprocessors |
2.54 mm |
FLOATING POINT |
S-CPGA-P296 |
Not Qualified |
110 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
16 |
16 |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
3.6 mm |
15.24 mm |
NO |
16 |
6.06 MHz |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
6 rpm |
NO |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
5.25 V |
0 |
16 |
8 |
5 |
IN-LINE, WINDOW |
DIP40,.6 |
4.75 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
DUAL |
5.72 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
4 MHz |
52.195 mm |
NMOS |
200 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-GDIP-T40 |
Not Qualified |
4 rpm |
NO |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
16 |
8 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.75 V |
70 Cel |
2 |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
16.5862 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
4 MHz |
16.5862 mm |
NMOS |
200 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
Not Qualified |
4 rpm |
NO |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
16 |
16 |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
16 |
10 MHz |
CMOS |
5 V |
R-CDIP-T40 |
10 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
372 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
32 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA372,20X20,50 |
1.65 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
2.6 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
27 MHz |
27 mm |
CMOS |
1.8 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B372 |
Not Qualified |
166 rpm |
YES |
e0 |
|||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
5 |
FLATPACK |
QFP208,1.2SQ,20 |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
1850 mA |
5 V |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
100 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
PIN/PEG |
168 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
32 |
32 |
GRID ARRAY |
85 Cel |
0 Cel |
PERPENDICULAR |
4.57 mm |
44.45 mm |
NO |
32 |
50 MHz |
44.45 mm |
CMOS |
5 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P168 |
Not Qualified |
100 rpm |
YES |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
26 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BOTTOM |
1.4 mm |
14 mm |
YES |
0 |
19.2 MHz |
14 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PBGA-B26 |
Not Qualified |
264 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA388,26X26,50 |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.38 mm |
35 mm |
NO |
32 |
14.3 MHz |
35 mm |
CMOS |
3.3 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B388 |
Not Qualified |
75 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
MOS |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
16 |
16 |
IN-LINE |
4.75 V |
85 Cel |
-40 Cel |
DUAL |
4.445 mm |
15.24 mm |
NO |
16 |
6.06 MHz |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
6 rpm |
NO |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
MILITARY |
FLAT |
84 |
QFF |
SQUARE |
CERAMIC |
YES |
32 |
5 |
FLATPACK |
QFL84,1.1SQ |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Microprocessors |
1.27 mm |
S-XQFP-F84 |
Not Qualified |
17.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
32 |
32 |
3.3 |
GRID ARRAY |
BGA388,26X26,50 |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
2.38 mm |
35 mm |
NO |
64 |
120 MHz |
35 mm |
CMOS |
3.3 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B388 |
Not Qualified |
120 rpm |
YES |
e0 |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
16 |
16 |
IN-LINE |
4.75 V |
85 Cel |
3 |
-40 Cel |
DUAL |
4.445 mm |
0 |
15.24 mm |
NO |
16 |
6 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
6 rpm |
YES |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
PIN/PEG |
168 |
PGA |
SQUARE |
PLASTIC/EPOXY |
YES |
NO |
3.6 V |
32 |
32 |
GRID ARRAY |
3.3 V |
85 Cel |
0 Cel |
PERPENDICULAR |
4.57 mm |
44.45 mm |
NO |
32 |
22 MHz |
44.45 mm |
CMOS |
3.45 V |
2.54 mm |
FLOATING POINT |
S-PPGA-P168 |
Not Qualified |
66 rpm |
YES |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
32 |
32 |
3.45 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ |
3.3 V |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.8 mm |
28 mm |
NO |
32 |
40 MHz |
28 mm |
CMOS |
950 mA |
3.45 V |
Microprocessors |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
80 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
24 |
16 |
5 |
IN-LINE |
DIP64,.9 |
4.75 V |
70 Cel |
7 |
0 Cel |
TIN LEAD |
DUAL |
5.59 mm |
0 |
22.86 mm |
NO |
16 |
16.7 MHz |
81.535 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
16.7 rpm |
NO |
e0 |
||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
0 |
22 |
16 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.75 V |
85 Cel |
7 |
-40 Cel |
TIN LEAD |
QUAD |
5.08 mm |
0 |
19.1262 mm |
NO |
8 |
8 MHz |
19.1262 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J52 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
32 |
32 |
FLATPACK, FINE PITCH |
85 Cel |
0 Cel |
QUAD |
3.8 mm |
28 mm |
NO |
32 |
60 MHz |
28 mm |
CMOS |
5 V |
.5 mm |
FLOATING POINT |
S-PQFP-G208 |
Not Qualified |
120 rpm |
YES |
||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
16 |
16 |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
4.445 mm |
15.24 mm |
NO |
16 |
6.06 MHz |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
6 rpm |
NO |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
GULL WING |
208 |
FQFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
32 |
5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
TIN LEAD |
QUAD |
3.5 mm |
28 mm |
28 mm |
CMOS |
5 V |
Microprocessors |
.5 mm |
S-CQFP-G208 |
Not Qualified |
20 rpm |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.