625 Multi-functional Peripherals 12

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
LS1024ASN7JLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	900 MHz	30	250	21 mm	CMOS	1400 mA	1.1 V		.8 mm	S-PBGA-B625	3
66AK2G12ABYQ100	Texas Instruments		AUTOMOTIVE	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	1M	21 mm	YES	32		30	260	21 mm	CMOS		1 V	CAN; ETHERNET; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B625	3	e1	212
X66AK2G12ABY60	Texas Instruments	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel	0 Cel		BOTTOM	1.56 mm	1M	21 mm	YES	32				21 mm	CMOS		.9 V	CAN; ETHERNET; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B625			212
X66AK2G12ABY100	Texas Instruments	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel		BOTTOM	1.56 mm	1M	21 mm	YES	32				21 mm	CMOS		1 V	CAN; ETHERNET; I2C; PCI; SPI; UART; USB	.8 mm	S-PBGA-B625			212
M86261G12	NXP Semiconductors		COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	26	GRID ARRAY, FINE PITCH		1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm	32768	21 mm	YES	32	650 MHz	30	250	21 mm	CMOS		1.1 V	I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B625	3		64
M86201G12	NXP Semiconductors		COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.164 V	26	GRID ARRAY, FINE PITCH		1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm	32768	21 mm	YES	32	1200 MHz	30	250	21 mm	CMOS		1.13 V	I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B625	3		64
M86292G12	NXP Semiconductors		COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	26	GRID ARRAY, FINE PITCH		1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm	32768	21 mm	YES	32	900 MHz	30	250	21 mm	CMOS		1.1 V	I2C, PCI, SPI, UART, USB	.8 mm	S-PBGA-B625	3		64
LS1024ASE7JLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	900 MHz	30	250	21 mm	CMOS	1400 mA	1.1 V		.8 mm	S-PBGA-B625	3
LS1024ASN7MLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.164 V	26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	1200 MHz	30	250	21 mm	CMOS	1500 mA	1.13 V		.8 mm	S-PBGA-B625	3
LS1024ASE7MLA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.164 V	26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.096 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	1200 MHz	30	250	21 mm	CMOS	1500 mA	1.13 V		.8 mm	S-PBGA-B625	3
LS1024ASE7ELA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	650 MHz	30	250	21 mm	CMOS	1200 mA	1.1 V		.8 mm	S-PBGA-B625	3
LS1024ASN7ELA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	COMMERCIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	26	GRID ARRAY, FINE PITCH	BGA625,25X25,32	1.045 V	70 Cel	-10 Cel		BOTTOM	2.67 mm		21 mm	YES	0	650 MHz	30	250	21 mm	CMOS	1200 mA	1.1 V		.8 mm	S-PBGA-B625	3

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.