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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LS1024ASE7MLA |
| Description | MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | LS1024ASE7MLA Datasheet |
| In Stock | 902 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.096 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.13 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.67 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 1500 mA |
| No. of Terminals: | 625 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B625 |
| Maximum Clock Frequency: | 1200 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | FBGA |
| Width: | 21 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
| Maximum Supply Voltage: | 1.164 V |
| Boundary Scan: | YES |
| External Data Bus Width: | 0 |
| Minimum Operating Temperature: | -10 Cel |
| Package Equivalence Code: | BGA625,25X25,32 |
| Length: | 21 mm |
| Peak Reflow Temperature (C): | 250 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
