RECTANGULAR Multi-functional Peripherals 233

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C4245FNI-483T

Infineon Technologies

INDUSTRIAL

BALL

68

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

8192

3.52 mm

NO

0

24 MHz

3.91 mm

CMOS

1.8 V

I2C; SPI; UART

.4 mm

R-PBGA-B68

1

e1

36

CY8C3245PVA-134

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

DUAL

2.794 mm

2048

7.5057 mm

YES

33 MHz

15.875 mm

262144 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

e4

29

CY8C3446PVA-076

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

DUAL

2.794 mm

4096

7.5057 mm

YES

33 MHz

15.875 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

e3

32

CY8C4244PVI-442

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

2048

5.3 mm

NO

48 MHz

30

260

10.2 mm

CMOS

13.8 mA

3.3 V

2

I2C; IDE; IRDA; LIN; SPI; UART

.65 mm

R-PDSO-G28

3

Not Qualified

e4

24

CY8C3665PVA-007

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

2.794 mm

2048

7.5057 mm

YES

33 MHz

30

260

15.875 mm

CMOS

3.3 V

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

e3

31

CY8C3244PVI-133T

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

DUAL

2.794 mm

1024

7.505 mm

YES

0

33 MHz

15.875 mm

131072 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

.635 mm

R-PDSO-G48

3

Not Qualified

e4

25

CY8C3444PVE-118

Infineon Technologies

AUTOMOTIVE

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

125 Cel

-40 Cel

MATTE TIN

N

DUAL

2.794 mm

1024

7.5057 mm

YES

33 MHz

15.875 mm

131072 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

e3

29

CY8C3665PVA-080

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

2.794 mm

2048

7.5057 mm

YES

33 MHz

30

260

15.875 mm

CMOS

3.3 V

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

e3

29

CY8C4013SXI-411

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

16

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, LOW PROFILE

SOP16,.25

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1.721 mm

1024

3.898 mm

NO

16 MHz

30

260

9.893 mm

CMOS

4.5 mA

3.3 V

I2C

1.27 mm

R-PDSO-G16

3

e4

13

CY8C5688FNI-LP211

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

33 MHz

5.94 mm

CMOS

1.8 V

I2C; USB

.5 mm

R-PBGA-B99

62

CY8C4124FNI-443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA35,5X7,16

1.71 V

85 Cel

-40 Cel

BOTTOM

.55 mm

2048

2.1 mm

NO

0

24 MHz

3.23 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.4 mm

R-PBGA-B35

31

CY8C4A24FNI-443

Infineon Technologies

INDUSTRIAL

BALL

45

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.482 mm

2048

1.975 mm

NO

0

16 MHz

3.68 mm

CMOS

3.3 V

I2C; SPI; UART; LPC; LIN; IRDA; IDE

.38 mm

R-PBGA-B45

38

CY8C3246PVA-147

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

DUAL

2.794 mm

4096

7.5057 mm

YES

33 MHz

15.875 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

e4

31

CY8C20546A-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

8

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

16384

1024

7.505 mm

NO

0

25.2 MHz

20

260

15.875 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.635 mm

R-PDSO-G48

3

Not Qualified

25.2 rpm

e4

34

CY8C4128FNI-BL563T

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

.55 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

3.3 V

I2C; SPI; UART; IRDA; IDE; LIN

.4 mm

R-PBGA-B76

1

e4

36

CY8C4A25PVI-481

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

DUAL

2 mm

2048

5.3 mm

NO

0

16 MHz

10.2 mm

CMOS

3.3 V

I2C; SPI; UART; LPC; LIN; IRDA; IDE

.65 mm

R-PDSO-G28

19

CY8C28413-24PVXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

16384

1024

5.3 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

20

260

10.2 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

I2C, IRDA, SPI, UART, USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C4A25PVI-471

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

DUAL

2 mm

2048

5.3 mm

NO

0

16 MHz

10.2 mm

CMOS

3.3 V

I2C; SPI; UART; LPC; LIN; IRDA; IDE

.65 mm

R-PDSO-G28

19

CY8C22213-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

SMALL OUTLINE, SHRINK PITCH

4.75 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

256

5.3 mm

NO

0

24.24 MHz

7.2 mm

CMOS

5 V

.65 mm

R-PDSO-G20

3

Not Qualified

e3

16

CY8C4A45PVI-471

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

DUAL

2 mm

2048

5.3 mm

NO

0

16 MHz

10.2 mm

CMOS

3.3 V

I2C; SPI; UART; LPC; LIN; IRDA; IDE

.65 mm

R-PDSO-G28

19

CY8C4A45FNI-473

Infineon Technologies

INDUSTRIAL

BALL

45

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.482 mm

2048

1.975 mm

NO

0

16 MHz

3.68 mm

CMOS

3.3 V

I2C; SPI; UART; LPC; LIN; IRDA; IDE

.38 mm

R-PBGA-B45

38

CY8C3666PVA-180

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

2.794 mm

4096

7.5057 mm

YES

33 MHz

30

260

15.875 mm

CMOS

3.3 V

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

e3

29

CY8C20234-12SXIT

Infineon Technologies

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

8

2.7/5

SMALL OUTLINE

SOP16,.25

2.4 V

85 Cel

M8C

-40 Cel

PURE TIN

DUAL

1.727 mm

8192

512

3.8985 mm

NO

12.06 MHz

9.893 mm

512

CMOS

2.5 mA

3 V

Microcontrollers

FLASH

I2C; USB

1.27 mm

R-PDSO-G16

3

Not Qualified

12 rpm

13

CY8C4128FNI-BL583T

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

.55 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

1.8 V

I2C; SPI; UART

.4 mm

R-PBGA-B76

1

e4

36

CY8C4245FNI-483

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA35,5X7,16

1.71 V

105 Cel

-40 Cel

BOTTOM

.55 mm

2048

2.1 mm

NO

48 MHz

3.23 mm

CMOS

13.8 mA

3.3 V

3

I2C; IDE; IRDA; LIN; SPI; UART

.4 mm

R-PBGA-B35

31

CY8C22345-24PVXA

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

AEC-Q100

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

16384

512

5.3 mm

IT ALSO OPERATES AT 3V AT 93KHZ

NO

24 MHz

20

260

10.2 mm

1024

CMOS

12 mA

5 V

Microcontrollers

FLASH

I2C; USB

.65 mm

R-PDSO-G28

3

Not Qualified

24.6 rpm

e4

24

CY8C22213A-24SXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

2.5/5

SMALL OUTLINE

SOP20,.4

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2048

20

260

256

CMOS

8 mA

Microcontrollers

FLASH

1.27 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

CY8C27466-24SXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

3.3,5

SMALL OUTLINE

SOP28,.4

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

32768

20

260

1024

CMOS

14 mA

Microcontrollers

FLASH

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

CY8C22213A-24PXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

8

2.5/5

IN-LINE

DIP20,.3

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2048

40

260

256

CMOS

8 mA

Microcontrollers

FLASH

2.54 mm

R-PDIP-T20

1

Not Qualified

24 rpm

e4

CY8C4A25FNI-473

Infineon Technologies

INDUSTRIAL

BALL

45

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.482 mm

2048

1.975 mm

NO

0

16 MHz

3.68 mm

CMOS

3.3 V

I2C; SPI; UART; LPC; LIN; IRDA; IDE

.38 mm

R-PBGA-B45

38

CY8C20634-12FDXI

Infineon Technologies

INDUSTRIAL

BALL

30

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA30,5X6,14

3 V

85 Cel

M8C

-40 Cel

TIN SILVER COPPER

BOTTOM

.4 mm

8192

512

1.849 mm

IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ

NO

0

12 MHz

260

2.309 mm

512

CMOS

2.5 mA

4.75 V

Microcontrollers

FLASH

USB

.37 mm

R-PBGA-B30

1

Not Qualified

12 rpm

e1

27

CY8C4124PVQ-432

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

2048

5.3 mm

NO

0

24 MHz

10.2 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.65 mm

R-PDSO-G28

3

e4

24

CY8C20536-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

8

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

M8C

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

2.794 mm

8192

512

7.505 mm

NO

0

25.2 MHz

20

260

15.875 mm

1024

CMOS

4 mA

3.3 V

Microcontrollers

FLASH

USB

.635 mm

R-PDSO-G48

3

Not Qualified

25.2 rpm

e4

34

CY8C22113A-24SXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

2.5/5

SMALL OUTLINE

SOP8,.25

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

2048

20

260

256

CMOS

8 mA

Microcontrollers

FLASH

1.27 mm

R-PDSO-G8

3

Not Qualified

24 rpm

e3

CY8C29666-24PVXIT

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

32768

1024

7.505 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

15.875 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.635 mm

R-PDSO-G48

3

Not Qualified

24 rpm

e4

44

CY8C3245PVE-134

Infineon Technologies

AUTOMOTIVE

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

DUAL

2.794 mm

2048

7.5057 mm

YES

33 MHz

30

260

15.875 mm

262144 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

e4

29

CY8C4244PVA-442Z

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

1.71 V

85 Cel

-40 Cel

DUAL

2 mm

2048

5.3 mm

NO

0

48 MHz

10.2 mm

CMOS

1.8 V

I2C; SPI; UART

.65 mm

R-PDSO-G28

24

CY8C4244PVQ-432

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

2048

5.3 mm

NO

48 MHz

10.2 mm

CMOS

13.8 mA

3.3 V

2

I2C; IDE; IRDA; LIN; SPI; UART

.65 mm

R-PDSO-G28

3

e4

24

CY8C20746A-24FDXCT

Infineon Technologies

INDUSTRIAL

BALL

30

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

8

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA30,5X6,14

1.71 V

85 Cel

M8C

-40 Cel

TIN SILVER COPPER

BOTTOM

.4 mm

16384

512

2.2 mm

NO

0

25.2 MHz

2.32 mm

2048

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.38 mm

R-PBGA-B30

Not Qualified

e1

27

CY8C22113-24SXI

Infineon Technologies

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

SMALL OUTLINE

4.75 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.727 mm

256

3.8985 mm

NO

0

24.24 MHz

4.889 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

3

Not Qualified

e4

6

CY8C3866FNI-210T

Infineon Technologies

INDUSTRIAL

BALL

72

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.6 mm

4096

4.25 mm

YES

0

33 MHz

4.98 mm

CMOS

1.8 V

I2C; USB; PS/2; 8051

.5 mm

R-PBGA-B72

1

e1

38

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.