RECTANGULAR Multi-functional Peripherals 233

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Manufacturers
    • Analog Devices
    • Broadcom
    • Cypress Semiconductor
    • Digi International
    • Freescale Semiconductor
    • IXYS Corporation
    • Infineon Technologies
    • Intel
    • M/a-com Technology Solutions
    • Maxim Integrated
    • Microchip Technology
    • Motorola
    • NXP Semiconductors
    • National Semiconductor
    • Nuvoton Technology
    • Onsemi
    • Renesas Electronics
    • Rochester Electronics
    • STMicroelectronics
    • Silicon Labs
    • Teledyne E2v (Uk)
    • Texas Instruments
    • Toshiba
    • Xilinx
    • Xmos
Peripheral IC Type
    • MICROPROCESSOR, RISC
    • MULTIFUNCTION PERIPHERAL
    • SYSTEM ON CHIP
    • SoC
Temperature Grade
    • AUTOMOTIVE
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • MILITARY
    • OTHER
Terminal Form
    • BALL
    • FLAT
    • GULL WING
    • J BEND
    • NO LEAD
    • PIN/PEG
    • THROUGH-HOLE
    • UNSPECIFIED
No. of Terminals
    • 100
    • 1020
    • 1071
    • 124
    • 128
    • 1284
    • 1313
    • 132
    • 144
    • 1517
    • 16
    • 20
    • 208
    • 21
    • 24
    • 256
    • 272
    • 28
    • 286
    • 289
    • 30
    • 316
    • 32
    • 338
    • 35
    • 36
    • 367
    • 372
    • 373
    • 387
    • 388
    • 40
    • 400
    • 404
    • 416
    • 417
    • 42
    • 421
    • 423
    • 44
    • 448
    • 45
    • 473
    • 48
    • 486
    • 503
    • 515
    • 516
    • 52
    • 529
    • 538
    • 541
    • 548
    • 552
    • 56
    • 569
    • 609
    • 621
    • 624
    • 625
    • 64
    • 652
    • 676
    • 68
    • 689
    • 72
    • 76
    • 760
    • 780
    • 784
    • 8
    • 80
    • 84
    • 989
    • 99
Package Code
    • BGA
    • DIP
    • FBGA
    • FQFP
    • HBGA
    • HQCCN
    • HTFQFP
    • HVQCCN
    • LBGA
    • LFBGA
    • LFQFP
    • LQFP
    • LSOP
    • LSSOP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SOP
    • SSOP
    • TFBGA
    • TFQFP
    • TQFP
    • VFBGA
    • VQCCN
    • WQCCJ
Package Shape (1)
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • CERAMIC
    • CERAMIC, METAL-SEALED COFIRED
    • PLASTIC/EPOXY
    • UNSPECIFIED
Integrated Cache
    • NO
    • YES
Surface Mount
    • NO
    • YES
Maximum Supply Voltage
    • .9 V
    • .93 V
    • .945 V
    • 1 V
    • 1.03 V
    • 1.05 V
    • 1.08 V
    • 1.1 V
    • 1.11 V
    • 1.15 V
    • 1.155 V
    • 1.164 V
    • 1.2 V
    • 1.26 V
    • 1.3 V
    • 1.32 V
    • 1.365 V
    • 1.4 V
    • 1.4175 V
    • 1.5 V
    • 1.52 V
    • 1.55 V
    • 1.575 V
    • 1.89 V
    • 1.98 V
    • 2.625 V
    • 2.7 V
    • 2.75 V
    • 3.465 V
    • 3.6 V
    • 3.63 V
    • 3.75 V
    • 3.8 V
    • 5.25 V
    • 5.5 V
On Chip Data RAM Width
    • 32
    • 8
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • TS 16949
Address Bus Width
    • 0
    • 13
    • 14
    • 15
    • 16
    • 24
    • 26
    • 27
    • 32
    • 36
    • 4
    • 5
    • 64
DAC Channels
    • NO
    • YES
Bit Size
    • 16
    • 32
    • 64
    • 8
Power Supplies (V)
    • 1.05,1.5,1.8,3.3,5
    • 1.05,1.5,3.3,5
    • 1.3,1.8/3.3
    • 1.8,3.3
    • 1.8/3.3
    • 1.8/5
    • 1.8/5.5
    • 2.4/3.6
    • 2.5,3.3
    • 2.5/5
    • 2.7/5
    • 2/5
    • 3.3
    • 3.3,3.3/5,5
    • 3.3,5
    • 3.3/5
    • 3/3.3,5
    • 3/5
    • 3/5,5
    • 5
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • CHIP CARRIER, VERY THIN PROFILE
    • CHIP CARRIER, WINDOW
    • FLATPACK
    • FLATPACK, FINE PITCH
    • FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
    • FLATPACK, LOW PROFILE
    • FLATPACK, LOW PROFILE, FINE PITCH
    • FLATPACK, THIN PROFILE
    • FLATPACK, THIN PROFILE, FINE PITCH
    • GRID ARRAY
    • GRID ARRAY, FINE PITCH
    • GRID ARRAY, HEAT SINK/SLUG
    • GRID ARRAY, LOW PROFILE
    • GRID ARRAY, LOW PROFILE, FINE PITCH
    • GRID ARRAY, THIN PROFILE, FINE PITCH
    • GRID ARRAY, VERY THIN PROFILE, FINE PITCH
    • IN-LINE
    • MICROELECTRONIC ASSEMBLY
    • SMALL OUTLINE
    • SMALL OUTLINE, LOW PROFILE
    • SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
    • SMALL OUTLINE, SHRINK PITCH
Package Equivalence Code
    • BGA(UNSPEC)
    • BGA124,13X13,25
    • BGA16,4X4,14
    • BGA16,4X4,16
    • BGA30,5X6,14
    • BGA35,5X7,16
    • BGA367,22X22,25
    • BGA372,24X24,25
    • BGA373,23X23,20
    • BGA388,26X26,40
    • BGA388,26X26,50
    • BGA417,29X29,32
    • BGA448,30X30,30
    • BGA45,9X5,15
    • BGA486,27X27,20
    • BGA516,26X26,50
    • BGA529,23X23,32
    • BGA548,29X29,20
    • BGA609,35X35,32
    • BGA624,25X25,32
    • BGA625,25X25,32
    • BGA652,28X28,40
    • BGA676,29X29,40
    • BGA68,8X9,16
    • BGA72,8X9,20
    • BGA989(UNSPEC)
    • BGA99,9X11,20
    • DIP20,.3
    • DIP28,.3
    • DIP48,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC24,.16SQ,20
    • LCC32,.16SQ,16
    • LCC32,.2SQ,20
    • LCC40,.24SQ,20
    • LCC40,.2X.28,20
    • LCC44,.28SQ,20
    • LCC48,.24SQ,16
    • LCC48,.27SQ,20
    • LCC48,.28SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.32SQ,16
    • LCC68,.3SQ,40
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • PGA144,15X15
    • QFL144,1.1SQ,25
    • QFP100,.55X0.79
    • QFP100,.63SQ,20
    • QFP128,.67X.93,20
    • QFP144,.87SQ,20
    • QFP208,1.2SQ,20
    • QFP44,.47SQ,32
    • QFP48,.28SQ,20
    • QFP48,.35SQ,20
    • QFP64(UNSPEC)
    • QFP64,.47SQ,20
    • QFP64,.63SQ,32
    • QFP80,.64SQ
    • SOP16,.25
    • SOP20,.4
    • SOP28,.4
    • SOP8,.25
    • SSOP20,.3
    • SSOP28,.3
    • SSOP48,.4
    • SSOP56,.4
    • TQFP100,.63SQ
    • TQFP128,.63SQ,16
    • TQFP44,.47SQ,32
Minimum Supply Voltage
    • .805 V
    • .855 V
    • .87 V
    • .9 V
    • .95 V
    • .97 V
    • .998 V
    • 1 V
    • 1.02 V
    • 1.045 V
    • 1.05 V
    • 1.08 V
    • 1.096 V
    • 1.11 V
    • 1.14 V
    • 1.15 V
    • 1.2 V
    • 1.235 V
    • 1.25 V
    • 1.275 V
    • 1.2825 V
    • 1.3 V
    • 1.35 V
    • 1.38 V
    • 1.425 V
    • 1.7 V
    • 1.71 V
    • 1.8 V
    • 2.1 V
    • 2.25 V
    • 2.375 V
    • 2.4 V
    • 2.45 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 3.135 V
    • 3.15 V
    • 4.5 V
    • 4.75 V
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 115 Cel
    • 125 Cel
    • 45 Cel
    • 70 Cel
    • 85 Cel
    • 90 Cel
    • 95 Cel
CPU Family
    • 8051
    • CORTEX-M0
    • M8C
No. of External Interrupts
    • 8
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -30 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
    • 5 Cel
Terminal Finish
    • MATTE TIN
    • Matte Tin (Sn)
    • NICKEL PALLADIUM GOLD
    • NICKEL PALLADIUM GOLD SILVER
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • PURE TIN
    • TIN
    • TIN LEAD
    • TIN LEAD SILVER
    • TIN SILVER
    • TIN SILVER BISMUTH
    • TIN SILVER COPPER
    • TIN SILVER COPPER NICKEL
    • Tin (Sn)
    • Tin/Bismuth (Sn/Bi)
    • Tin/Lead (Sn/Pb)
    • Tin/Silver (Sn/Ag)
    • Tin/Silver/Copper (Sn/Ag/Cu)
ADC Channels
    • NO
    • YES
Ultraviolet Erasable
    • N
    • Y
Terminal Position
    • BOTTOM
    • DUAL
    • PERPENDICULAR
    • QUAD
    • UNSPECIFIED
DMA Channels
    • NO
Maximum Seated Height
    • .33 mm
    • .4 mm
    • .41 mm
    • .42 mm
    • .482 mm
    • .55 mm
    • .6 mm
    • .8 mm
    • .9 mm
    • 1 mm
    • 1.2 mm
    • 1.23 mm
    • 1.25 mm
    • 1.298 mm
    • 1.32 mm
    • 1.4 mm
    • 1.45 mm
    • 1.481 mm
    • 1.52 mm
    • 1.54 mm
    • 1.56 mm
    • 1.6 mm
    • 1.63 mm
    • 1.7 mm
    • 1.72 mm
    • 1.721 mm
    • 1.727 mm
    • 1.85 mm
    • 2 mm
    • 2.16 mm
    • 2.18 mm
    • 2.205 mm
    • 2.358 mm
    • 2.38 mm
    • 2.46 mm
    • 2.48 mm
    • 2.49 mm
    • 2.52 mm
    • 2.59 mm
    • 2.61 mm
    • 2.65 mm
    • 2.667 mm
    • 2.67 mm
    • 2.73 mm
    • 2.75 mm
    • 2.794 mm
    • 2.82 mm
    • 2.93 mm
    • 2.96 mm
    • 3.15 mm
    • 3.21 mm
    • 3.3 mm
    • 3.4 mm
    • 3.62 mm
    • 4.064 mm
    • 4.1 mm
    • 4.45 mm
    • 4.57 mm
    • 4.572 mm
    • 4.8 mm
    • 4.82 mm
    • 4.826 mm
    • 5.08 mm
    • 5.588 mm
ROM Words
    • 16384
    • 2048
    • 32768
    • 4096
    • 65536
    • 8192
    • 81920
RAM Words
    • 1024
    • 128
    • 128M
    • 139264
    • 147456
    • 16384
    • 16K
    • 1K
    • 1M
    • 2.5M
    • 2048
    • 229376
    • 256
    • 256K
    • 262144
    • 288K
    • 2K
    • 32768
    • 32K
    • 4096
    • 4K
    • 512
    • 512K
    • 524288
    • 64K
    • 65536
    • 6M
    • 73728
    • 8192
    • 81920
    • 888832
    • 8K
    • 98304
Width
    • 1.452 mm
    • 1.472 mm
    • 1.849 mm
    • 1.975 mm
    • 1.986 mm
    • 10 mm
    • 12 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16 mm
    • 17 mm
    • 19 mm
    • 19.1262 mm
    • 2.097 mm
    • 2.1 mm
    • 2.2 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.52 mm
    • 3.87 mm
    • 3.89 mm
    • 3.898 mm
    • 3.8985 mm
    • 31 mm
    • 33 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.25 mm
    • 4.87 mm
    • 4.907 mm
    • 40 mm
    • 5 mm
    • 5.192 mm
    • 5.3 mm
    • 6 mm
    • 7 mm
    • 7.5 mm
    • 7.505 mm
    • 7.5057 mm
    • 7.6 mm
    • 7.62 mm
    • 7.8 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
Data EEPROM Size
    • 0
Additional Features
    • -40 TO 100 OPERATING CASE TEMPERATURE
    • -40 TO 115 C OPERATING CASE TEMPERATURE
    • -40 TO 115 OPERATING CASE TEMPERATURE
    • 0 TO 100 OPERATING CASE TEMPERATURE
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE
    • 128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O
    • 24MHZ NOM CRYSTAL FREQ AVAILABLE
    • 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE
    • 32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 37.4 MHZ CRYSTAL FREQUENCY AVAILABLE
    • 64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • ALSO OPERATES 1.3V AT 266MHZ
    • ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US
    • ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE
    • ALSO OPERATES AT 2.7V AND 3.3V SUPPLY
    • ALSO OPERATES AT 2.7V AND 3V SUPPLY
    • ALSO OPERATES AT 3V MINIMUM SUPPLY
    • ALSO OPERATES AT 3V SUPPLY
    • ALSO OPERATES AT 3V WITH 93KHZ
    • ALSO OPERATES AT 750 KHZ WITH 2.4 V
    • ALSO REQUIRES 3.3 V I/O SUPPLY
    • ALSO REQUIRES 3.3 V SUPPLY
    • ALSO REQUIRES 3.3V SUPPLY
    • IT ALSO OPERATES 93KHZ AT 3 V
    • IT ALSO OPERATES AT 2.4V AT 93KHZ
    • IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
    • IT ALSO OPERATES AT 3V AT 93KHZ
    • IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ
    • IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY
    • ITS ALSO HAVING 576KB SRAM FOR THE WIRELESS LAN SUBSYSTEM
    • MULTIPROTOCOL PARALLEL PORT TYPE
    • OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED
    • PITCH_MINI
    • SEATED HGT-CALCULATED
    • SEATED HGT-NOM
    • SEATED HT-CALCULATED
    • lsio contains 8 GPIO lines
Boundary Scan
    • NO
    • YES
Peripherals
    • BROWN-OUT DETECT, COMPARATOR(2), POR, TIMER(5), WDT
    • TIMER, WDT
External Data Bus Width
    • 0
    • 128
    • 16
    • 32
    • 4
    • 64
    • 8
Maximum Clock Frequency
    • .032768 MHz
    • 10 MHz
    • 100 MHz
    • 12 MHz
    • 12.06 MHz
    • 12.6 MHz
    • 1200 MHz
    • 133.333 MHz
    • 14.318 MHz
    • 14.31818 MHz
    • 1400 MHz
    • 16 MHz
    • 20 MHz
    • 22 MHz
    • 24 MHz
    • 24.24 MHz
    • 24.6 MHz
    • 25 MHz
    • 25.2 MHz
    • 26 MHz
    • 27 MHz
    • 30 MHz
    • 32 MHz
    • 33 MHz
    • 33.33 MHz
    • 34.48 MHz
    • 35 MHz
    • 36 MHz
    • 38.4 MHz
    • 4 MHz
    • 40 MHz
    • 48 MHz
    • 5 MHz
    • 50 MHz
    • 52 MHz
    • 650 MHz
    • 66 MHz
    • 67 MHz
    • 75 MHz
    • 8 MHz
    • 80 MHz
    • 83.33 MHz
    • 900 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 220
    • 245
    • 250
    • 260
    • NOT SPECIFIED
Length
    • 1.559 mm
    • 1.579 mm
    • 10 mm
    • 10.2 mm
    • 12 mm
    • 12.8 mm
    • 12.8265 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.875 mm
    • 16 mm
    • 17 mm
    • 17.905 mm
    • 18.415 mm
    • 19 mm
    • 19.1262 mm
    • 2.309 mm
    • 2.32 mm
    • 2.582 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 25.527 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.23 mm
    • 3.68 mm
    • 3.691 mm
    • 3.91 mm
    • 31 mm
    • 33 mm
    • 34.67 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.04 mm
    • 4.889 mm
    • 4.978 mm
    • 4.98 mm
    • 40 mm
    • 5 mm
    • 5.413 mm
    • 5.848 mm
    • 5.94 mm
    • 6 mm
    • 60.96 mm
    • 61.04 mm
    • 62.1 mm
    • 62.103 mm
    • 7 mm
    • 7.2 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
    • 9.779 mm
    • 9.891 mm
    • 9.893 mm
ROM Bits Size
    • 1024 Bits
    • 1048576 Bits
    • 131072 Bits
    • 2097152 Bits
    • 256 Bits
    • 262144 Bits
    • 32768 Bits
    • 4096 Bits
    • 512 Bits
    • 524288 Bits
    • 65536 Bits
    • 8192 Bits
No. of Timers
    • 5
RAM Bytes
    • 1024
    • 2048
    • 256
    • 262144
    • 4096
    • 512
    • 8192
Technology
    • CHMOS
    • CMOS
    • HCMOS
    • MOS
    • NMOS
Analog To Digital Convertors
    • 1-Ch 12-Bit
Maximum Supply Current
    • .008 mA
    • .01 mA
    • .0255 mA
    • 1 mA
    • 12 mA
    • 1200 mA
    • 13.8 mA
    • 1320 mA
    • 14 mA
    • 14.5 mA
    • 1400 mA
    • 15 mA
    • 1500 mA
    • 18.5 mA
    • 180 mA
    • 2 mA
    • 2.5 mA
    • 200 mA
    • 2200 mA
    • 25 mA
    • 27 mA
    • 3.5 mA
    • 35 mA
    • 4 mA
    • 4.5 mA
    • 50 mA
    • 5000 mA
    • 6 mA
    • 6.85 mA
    • 7.2 mA
    • 70 mA
    • 78 mA
    • 8 mA
Nominal Supply Voltage
    • .85 V
    • .9 V
    • .95 V
    • 1 V
    • 1.05 V
    • 1.06 V
    • 1.1 V
    • 1.13 V
    • 1.15 V
    • 1.2 V
    • 1.25 V
    • 1.3 V
    • 1.35 V
    • 1.4 V
    • 1.45 V
    • 1.5 V
    • 1.8 V
    • 2.5 V
    • 2.7 V
    • 3 V
    • 3.3 V
    • 3.45 V
    • 4.75 V
    • 5 V
No. of DMA Channels
    • 1
PWM Channels
    • YES
No. of Serial I/Os
    • 0
    • 1
    • 11
    • 13
    • 16
    • 2
    • 3
    • 4
    • 5
    • 7
    • 8
Sub-Category
    • Bus Controllers
    • Digital Signal Processors
    • Microcontrollers
    • Microprocessors
    • Multifunction Peripherals
    • Other Microprocessor ICs
    • Other uPs/uCs/Peripheral ICs
Connectivity
    • I2C(2), SPI(2), UART(2)
ROM Programmability
    • FLASH
Bus Compatibility
    • 68000
    • 680X0; 88XXX; 80X86; SPARC; R4000; AXP
    • 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340
    • 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8
    • 80386
    • 8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS
    • 8051; CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN(2), I2C(2), QSPI, SPI(4), UART(3)
    • CAN(3), SAI(4), SPI(4), UART(6)
    • CAN, I2C, I2S, SPI, SSP, UART USB
    • CAN, SSP, UART(3)
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; RS-485; RS-232; SPI; UART; USB
    • CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; SPI; UART; USB
    • CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN; I2C; IRDA; PCI; SPI; UART; USB
    • ETHERNET, I2C, I2S, PCI, SPI, UART, USB
    • ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
    • ETHERNET; I2C; PCI; SPI; UART; USB
    • I2C
    • I2C, I2S, IDE, SPI, UART
    • I2C, I2S, IRDA, SPI, UART, USART
    • I2C, I2S, SPI, UART
    • I2C, IDE, ISA, PCI, USB, VGA
    • I2C, IRDA, SPI, UART, USB
    • I2C, PCI, SPI, UART, USB
    • I2C, SAI, SPI, UART
    • I2C, SPI, UART
    • I2C, USB
    • I2C; I2S, LIN; PS/2; SPI, USB
    • I2C; I2S; IDE; IRDA; LIN; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS
    • I2C; I2S; SPI; UART
    • I2C; I2S; SPI; UART; IRDA; LIN; IDE
    • I2C; I2S; UART; SPI; USB; ETHERNET
    • I2C; IDE; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART; USB
    • I2C; IRDA; PCI; PS/2; SMBUS; SPI; UART
    • I2C; SPI; UART
    • I2C; SPI; UART; IRDA; IDE; CAN; LIN
    • I2C; SPI; UART; IRDA; IDE; LIN
    • I2C; SPI; UART; LPC; LIN; IRDA; IDE
    • I2C; SPI; UART; USB
    • I2C; USB
    • I2C; USB; LPC
    • I2C; USB; PS/2
    • I2C; USB; PS/2; 8051
    • IRDA, PC-AT, PC-XT, PS/2, PCI
    • LPC
    • MC68000
    • PC-AT; ISA; PS/2
    • PCI
    • PCI; I2C; 60X PROCESSOR
    • PCI; ISA
    • PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2
    • PCI; RC32364; RC32134
    • PCI; SATA; SMBUS; UART; USB
    • PCI; USB; LPC
    • SPI, UART
    • SPI, USB
    • TX3922; ISA; PCMCIA; USB
    • USB
    • USB; PCI; I2C
    • USB; PCI; I2C; LPC; PS/2
    • USB; PCI; ISA
    • USB; PCI; ISA; PCMCIA
    • VR4100
    • Z84C00
Terminal Pitch
    • .35 mm
    • .37 mm
    • .38 mm
    • .4 mm
    • .5 mm
    • .6 mm
    • .635 mm
    • .65 mm
    • .75 mm
    • .76 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 2.54 mm
Format
    • FIXED POINT
    • FLOATING POINT
JESD-30 Code
    • R-CDIP-T48
    • R-PBGA-B1071
    • R-PBGA-B16
    • R-PBGA-B286
    • R-PBGA-B30
    • R-PBGA-B316
    • R-PBGA-B35
    • R-PBGA-B45
    • R-PBGA-B68
    • R-PBGA-B72
    • R-PBGA-B76
    • R-PBGA-B99
    • R-PDIP-T20
    • R-PDIP-T28
    • R-PDIP-T48
    • R-PDIP-T8
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G48
    • R-PDSO-G56
    • R-PDSO-G8
    • R-PQFP-G100
    • R-PQFP-G128
    • R-XQCC-N40
    • S-CPGA-P132
    • S-CQCC-J68
    • S-CQFP-F256
    • S-PBGA-B1020
    • S-PBGA-B124
    • S-PBGA-B1284
    • S-PBGA-B1313
    • S-PBGA-B1517
    • S-PBGA-B16
    • S-PBGA-B272
    • S-PBGA-B289
    • S-PBGA-B338
    • S-PBGA-B367
    • S-PBGA-B372
    • S-PBGA-B373
    • S-PBGA-B387
    • S-PBGA-B388
    • S-PBGA-B400
    • S-PBGA-B404
    • S-PBGA-B416
    • S-PBGA-B417
    • S-PBGA-B421
    • S-PBGA-B423
    • S-PBGA-B448
    • S-PBGA-B473
    • S-PBGA-B486
    • S-PBGA-B503
    • S-PBGA-B515
    • S-PBGA-B516
    • S-PBGA-B529
    • S-PBGA-B538
    • S-PBGA-B541
    • S-PBGA-B548
    • S-PBGA-B552
    • S-PBGA-B569
    • S-PBGA-B609
    • S-PBGA-B621
    • S-PBGA-B624
    • S-PBGA-B625
    • S-PBGA-B652
    • S-PBGA-B676
    • S-PBGA-B689
    • S-PBGA-B760
    • S-PBGA-B780
    • S-PBGA-B784
    • S-PBGA-B989
    • S-PDSO-G48
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N42
    • S-PQCC-N64
    • S-PQFP-G100
    • S-PQFP-G128
    • S-PQFP-G144
    • S-PQFP-G208
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XPGA-P144
    • S-XQCC-N16
    • S-XQCC-N24
    • S-XQCC-N32
    • S-XQCC-N36
    • S-XQCC-N40
    • S-XQCC-N44
    • S-XQCC-N48
    • S-XQCC-N56
    • S-XQCC-N68
    • S-XQFP-F144
    • S-XXMA-N21
Moisture Sensitivity Level (MSL)
    • 1
    • 2A
    • 3
    • 4
Qualification
    • Not Qualified
Speed
    • 100 rpm
    • 1000 rpm
    • 1176 rpm
    • 12 rpm
    • 12.6 rpm
    • 1200 rpm
    • 133 rpm
    • 1500 rpm
    • 1800 rpm
    • 24 rpm
    • 24.6 rpm
    • 24.96 rpm
    • 25.2 rpm
    • 300 rpm
    • 400 rpm
    • 454 rpm
    • 48 rpm
    • 500 rpm
    • 528 rpm
    • 60 rpm
    • 600 rpm
    • 650 rpm
    • 66 rpm
    • 67 rpm
    • 696 rpm
    • 720 rpm
    • 75 rpm
    • 750 rpm
    • 80 rpm
    • 800 rpm
    • 90 rpm
Low Power Mode
    • YES
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Standby Current
    • .000005 Amp
    • .00002 Amp
On Chip Program ROM Width
    • 8
No. of I/O Lines
    • 0
    • 1
    • 12
    • 126
    • 13
    • 136
    • 14
    • 16
    • 160
    • 17
    • 18
    • 186
    • 188
    • 19
    • 20
    • 21
    • 212
    • 215
    • 24
    • 247
    • 25
    • 27
    • 28
    • 29
    • 30
    • 31
    • 32
    • 33
    • 34
    • 36
    • 37
    • 38
    • 4
    • 40
    • 44
    • 45
    • 46
    • 48
    • 49
    • 5
    • 50
    • 51
    • 53
    • 54
    • 55
    • 57
    • 6
    • 62
    • 64
    • 68
    • 70
    • 72
    • 75
    • 76
    • 8
    • 98
    • 99
Maximum Access Time
    • .00000007 ns
    • .00000009 ns
    • .00000015 ns
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C24223-24PI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

8

3.3/5

IN-LINE

DIP20,.3

3 V

85 Cel

M8C

-40 Cel

TIN LEAD

DUAL

4.826 mm

4096

256

7.62 mm

NO

0

24.24 MHz

25.527 mm

256

CMOS

8 mA

3.3 V

Microcontrollers

FLASH

2.54 mm

R-PDIP-T20

Not Qualified

24 rpm

e0

16

CY8C5888FNI-LP210

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

33 MHz

260

5.94 mm

CMOS

1.8 V

I2C; USB

.5 mm

R-PBGA-B99

1

e4

62

CY8C24423A-24PXI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

8

2.7/5

IN-LINE

DIP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

4.82 mm

4096

256

7.62 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

40

260

34.67 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

2.54 mm

R-PDIP-T28

1

Not Qualified

24 rpm

e4

24

CY8C29666-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

32768

1024

7.505 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

15.875 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.635 mm

R-PDSO-G48

3

Not Qualified

24 rpm

e4

44

BD82QM57SLGZQ

Intel

BALL

1071

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.1 V

32

GRID ARRAY, HEAT SINK/SLUG

.998 V

BOTTOM

2.358 mm

25 mm

YES

32

14.318 MHz

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1.05 V

USB; PCI; I2C; LPC; PS/2

.6 mm

R-PBGA-B1071

CY8C24223A-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

4096

256

5.3 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

30

260

7.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

CY8C20534-12PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

3 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

8192

512

5.3 mm

IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ

NO

0

12 MHz

20

260

10.2 mm

512

CMOS

2.5 mA

4.75 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G28

3

Not Qualified

12 rpm

e4

24

CY8C4127FNI-BL483T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

68

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA68,8X9,16

1.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

8192

3.52 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

NO

30

260

3.91 mm

CMOS

25 mA

3.3 V

I2C, SPI, UART

.4 mm

R-PBGA-B68

1

e1

36

CY8C29466-24PXI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

8

3.3/5

IN-LINE

DIP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

4.82 mm

32768

1024

7.62 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

40

260

34.67 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

2.54 mm

R-PDIP-T28

1

Not Qualified

24 rpm

e4

24

CY8C4124FNI-443T

Infineon Technologies

INDUSTRIAL

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.482 mm

2048

2.097 mm

NO

0

48 MHz

2.582 mm

CMOS

3.3 V

I2C; SPI; UART

.35 mm

R-PBGA-B35

1

31

CY8C26233-24SXI

Cypress Semiconductor

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

3.3/5

SMALL OUTLINE

SOP20,.4

3 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

N

DUAL

2.667 mm

256

7.505 mm

NO

0

.032768 MHz

20

260

12.8265 mm

8192 Bits

CMOS

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G20

3

Not Qualified

e4

.000005 Amp

16

CY8C27143-24PXI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

8

3.3/5

IN-LINE

DIP8,.3

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

4.572 mm

16384

256

7.62 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

260

9.779 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

2.54 mm

R-PDIP-T8

1

Not Qualified

24 rpm

e3

6

CY8C27243-24SXI

Cypress Semiconductor

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE

SOP20,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.667 mm

16384

256

7.505 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

12.8265 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

1.27 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

CY8C27443-24PXI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

8

3.3/5

IN-LINE

DIP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

4.82 mm

16384

256

7.62 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

40

260

34.67 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

2.54 mm

R-PDIP-T28

1

Not Qualified

24 rpm

e4

24

CY8C29466-24PVXA

Cypress Semiconductor

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

32768

1024

5.3 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

10.2 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C5488FNI-LP212

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

33 MHz

5.94 mm

CMOS

1.8 V

I2C; USB

.5 mm

R-PBGA-B99

62

CYBL10563-68FNXI

Infineon Technologies

INDUSTRIAL

BALL

68

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.55 mm

8192

3.52 mm

YES

48 MHz

NOT SPECIFIED

NOT SPECIFIED

3.91 mm

CMOS

1.8 V

I2C; USB

.4 mm

R-PBGA-B68

36

PC87351-IBW/VLA

National Semiconductor

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, FINE PITCH

QFP128,.67X.93,20

4.5 V

70 Cel

0 Cel

TIN LEAD

QUAD

3.15 mm

256

14 mm

NO

8

48 MHz

30

220

20 mm

CMOS

50 mA

5 V

Other Microprocessor ICs

PC-AT; ISA; PS/2

.5 mm

R-PQFP-G128

2A

Not Qualified

e0

8

CY8C25122-24PI

Cypress Semiconductor

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

0

3.3/5

IN-LINE

DIP8,.3

3 V

85 Cel

-40 Cel

TIN LEAD

N

DUAL

4.572 mm

256

7.62 mm

NO

0

.032768 MHz

9.779 mm

4096 Bits

CMOS

3.3 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T8

Not Qualified

e0

.000005 Amp

6

CY8C27243-24SXIT

Cypress Semiconductor

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE

SOP20,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.667 mm

16384

256

7.505 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

12.8265 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

1.27 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

LPC47M112-MW

Microchip Technology

MULTIFUNCTION PERIPHERAL

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

TS 16949

FLATPACK

QFP100,.55X0.79

2.97 V

70 Cel

0 Cel

MATTE TIN

QUAD

3.4 mm

256

14 mm

NO

0

20 mm

CMOS

15 mA

3.3 V

2

IRDA, PC-AT, PC-XT, PS/2, PCI

.65 mm

R-PQFP-G100

Not Qualified

e3

45

SCH5027E-NW

Microchip Technology

COMMERCIAL

GULL WING

128

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

FLATPACK

70 Cel

0 Cel

QUAD

NO

NOT SPECIFIED

NOT SPECIFIED

CMOS

8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS

R-PQFP-G128

25

AXM0F243-1-TX30

Onsemi

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

1.8 V

85 Cel

-40 Cel

QUAD

1 mm

4096

5 mm

NO

50 MHz

7 mm

CMOS

6.85 mA

3 V

3

I2C; SPI; UART

.5 mm

R-XQCC-N40

20

AXM0F243-1-TB05

Onsemi

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

1.8 V

85 Cel

-40 Cel

QUAD

1 mm

4096

5 mm

NO

50 MHz

7 mm

CMOS

6.85 mA

3 V

3

I2C; SPI; UART

.5 mm

R-XQCC-N40

20

MK68901N04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

5.588 mm

15.24 mm

NO

8

4 MHz

62.103 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

TS68HC901CP5

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.8 mm

15.24 mm

NO

8

5 MHz

61.04 mm

HCMOS

6 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

MK68901P04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.064 mm

15.24 mm

NO

8

4 MHz

60.96 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-CDIP-T48

Not Qualified

e0

8

TS68HC901CP4

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.8 mm

15.24 mm

NO

8

4 MHz

61.04 mm

HCMOS

6 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

68901N05

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.064 mm

15.24 mm

NO

8

5 MHz

62.1 mm

CMOS

5 V

68000

2.54 mm

R-PDIP-T48

Not Qualified

8

MK68901N05

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

5.588 mm

15.24 mm

NO

8

5 MHz

62.103 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

68901N04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.064 mm

15.24 mm

NO

8

4 MHz

62.1 mm

CMOS

5 V

68000

2.54 mm

R-PDIP-T48

Not Qualified

8

68901P04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

5

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.064 mm

15.24 mm

NO

8

4 MHz

60.96 mm

CMOS

5 V

68000

2.54 mm

R-CDIP-T48

Not Qualified

8

MK68901P05

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.064 mm

15.24 mm

NO

8

5 MHz

60.96 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-CDIP-T48

Not Qualified

e0

8

TS68HC901CP8

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.8 mm

15.24 mm

NO

8

8 MHz

61.04 mm

HCMOS

6 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

68901P05

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

5

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.064 mm

15.24 mm

NO

8

5 MHz

60.96 mm

CMOS

5 V

68000

2.54 mm

R-CDIP-T48

Not Qualified

8

CYW43907KWBG

Infineon Technologies

MULTIFUNCTION PERIPHERAL

OTHER

BALL

316

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.26 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.14 V

85 Cel

-30 Cel

TIN SILVER

BOTTOM

.33 mm

1M

4.907 mm

ITS ALSO HAVING 576KB SRAM FOR THE WIRELESS LAN SUBSYSTEM

YES

0

52 MHz

5.848 mm

CMOS

1.2 V

I2C; I2S; UART; SPI; USB; ETHERNET

R-PBGA-B316

e2

17

CYW4390DKWBG

Infineon Technologies

OTHER

BALL

286

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.26 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.14 V

85 Cel

-30 Cel

BOTTOM

.41 mm

229376

4.87 mm

37.4 MHZ CRYSTAL FREQUENCY AVAILABLE

YES

0

5.413 mm

CMOS

1.2 V

I2C; I2S; SPI; UART

R-PBGA-B286

24

BTS6460SFXUMA1

Infineon Technologies

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

3 V

DUAL

2.65 mm

7.6 mm

NO

0

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

CMOS

5 V

.65 mm

R-PDSO-G36

0

BTS5460SFXUMA1

Infineon Technologies

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

3 V

DUAL

2.65 mm

7.6 mm

NO

0

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

CMOS

5 V

.65 mm

R-PDSO-G36

BTS6460SF

Infineon Technologies

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

3 V

DUAL

2.65 mm

7.6 mm

NO

0

260

12.8 mm

CMOS

5 V

.65 mm

R-PDSO-G36

3

0

BTS5460SF

Infineon Technologies

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

3 V

MATTE TIN

DUAL

2.65 mm

7.6 mm

NO

0

12.8 mm

CMOS

5 V

.65 mm

R-PDSO-G36

e3

CYBL10573-76FNXI

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.55 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

R-PBGA-B76

36

CYBL11573-76FNXI

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.55 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

R-PBGA-B76

36

CYBL11573-76FLXI

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.4 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

R-PBGA-B76

36

CYBL11573-76FNXQ

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

105 Cel

-40 Cel

BOTTOM

.55 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

3.3 V

I2C; I2S; IDE; IRDA; LIN; SPI; UART

.4 mm

R-PBGA-B76

36

CY8C3646PVE-171

Infineon Technologies

MULTIFUNCTION PERIPHERAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.8 V

125 Cel

-40 Cel

DUAL

2.794 mm

8192

7.5057 mm

YES

67 MHz

15.875 mm

CMOS

3.3 V

I2C

.635 mm

R-PDSO-G48

29

CY8C4128FNI-BL573T

Infineon Technologies

INDUSTRIAL

BALL

76

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

.55 mm

16384

3.87 mm

NO

0

48 MHz

4.04 mm

CMOS

1.8 V

I2C; SPI; UART

.4 mm

R-PBGA-B76

1

e4

36

CY8C3246PVE-147

Infineon Technologies

AUTOMOTIVE

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

AEC-Q100

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

DUAL

2.794 mm

4096

7.5057 mm

YES

33 MHz

30

260

15.875 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.635 mm

R-PDSO-G48

3

Not Qualified

e4

31

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.