Intel - BD82QM57SLGZQ

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BD82QM57SLGZQ by Intel

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Manufacturer Intel
Manufacturer's Part Number BD82QM57SLGZQ
Description Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 1071; Package Code: HBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1071;
Datasheet BD82QM57SLGZQ Datasheet
In Stock123
NAME DESCRIPTION
Minimum Supply Voltage: .998 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.05 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Supply Voltage: 1.1 V
Maximum Seated Height: 2.358 mm
Boundary Scan: YES
External Data Bus Width: 32
Surface Mount: YES
No. of Terminals: 1071
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 32
Length: 27 mm
Technology: CMOS
JESD-30 Code: R-PBGA-B1071
Maximum Clock Frequency: 14.318 MHz
Package Shape: RECTANGULAR
Terminal Form: BALL
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: HBGA
Bus Compatibility: USB; PCI; I2C; LPC; PS/2
Width: 25 mm
Terminal Pitch: .6 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
123 $48.000 $5,904.000

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