OTHER Multi-functional Peripherals 78

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Manufacturers
    • Analog Devices
    • Broadcom
    • Cypress Semiconductor
    • Digi International
    • Freescale Semiconductor
    • IXYS Corporation
    • Infineon Technologies
    • Intel
    • M/a-com Technology Solutions
    • Maxim Integrated
    • Microchip Technology
    • Motorola
    • NXP Semiconductors
    • National Semiconductor
    • Nuvoton Technology
    • Onsemi
    • Renesas Electronics
    • Rochester Electronics
    • STMicroelectronics
    • Silicon Labs
    • Teledyne E2v (Uk)
    • Texas Instruments
    • Toshiba
    • Xilinx
    • Xmos
Peripheral IC Type
    • MICROPROCESSOR, RISC
    • MULTIFUNCTION PERIPHERAL
    • SYSTEM ON CHIP
    • SoC
Temperature Grade (1)
    • OTHER
    • AUTOMOTIVE
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • MILITARY
Terminal Form
    • BALL
    • FLAT
    • GULL WING
    • J BEND
    • NO LEAD
    • PIN/PEG
    • THROUGH-HOLE
    • UNSPECIFIED
No. of Terminals
    • 100
    • 1020
    • 1071
    • 124
    • 128
    • 1284
    • 1313
    • 132
    • 144
    • 1517
    • 16
    • 20
    • 208
    • 21
    • 24
    • 256
    • 272
    • 28
    • 286
    • 289
    • 30
    • 316
    • 32
    • 338
    • 35
    • 36
    • 367
    • 372
    • 373
    • 387
    • 388
    • 40
    • 400
    • 404
    • 416
    • 417
    • 42
    • 421
    • 423
    • 44
    • 448
    • 45
    • 473
    • 48
    • 486
    • 503
    • 515
    • 516
    • 52
    • 529
    • 538
    • 541
    • 548
    • 552
    • 56
    • 569
    • 609
    • 621
    • 624
    • 625
    • 64
    • 652
    • 676
    • 68
    • 689
    • 72
    • 76
    • 760
    • 780
    • 784
    • 8
    • 80
    • 84
    • 989
    • 99
Package Code
    • BGA
    • DIP
    • FBGA
    • FQFP
    • HBGA
    • HQCCN
    • HTFQFP
    • HVQCCN
    • LBGA
    • LFBGA
    • LFQFP
    • LQFP
    • LSOP
    • LSSOP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SOP
    • SSOP
    • TFBGA
    • TFQFP
    • TQFP
    • VFBGA
    • VQCCN
    • WQCCJ
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • CERAMIC
    • CERAMIC, METAL-SEALED COFIRED
    • PLASTIC/EPOXY
    • UNSPECIFIED
Integrated Cache
    • NO
    • YES
Surface Mount
    • NO
    • YES
Maximum Supply Voltage
    • .9 V
    • .93 V
    • .945 V
    • 1 V
    • 1.03 V
    • 1.05 V
    • 1.08 V
    • 1.1 V
    • 1.11 V
    • 1.15 V
    • 1.155 V
    • 1.164 V
    • 1.2 V
    • 1.26 V
    • 1.3 V
    • 1.32 V
    • 1.365 V
    • 1.4 V
    • 1.4175 V
    • 1.5 V
    • 1.52 V
    • 1.55 V
    • 1.575 V
    • 1.89 V
    • 1.98 V
    • 2.625 V
    • 2.7 V
    • 2.75 V
    • 3.465 V
    • 3.6 V
    • 3.63 V
    • 3.75 V
    • 3.8 V
    • 5.25 V
    • 5.5 V
On Chip Data RAM Width
    • 32
    • 8
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • TS 16949
Address Bus Width
    • 0
    • 13
    • 14
    • 15
    • 16
    • 24
    • 26
    • 27
    • 32
    • 36
    • 4
    • 5
    • 64
DAC Channels
    • NO
    • YES
Bit Size
    • 16
    • 32
    • 64
    • 8
Power Supplies (V)
    • 1.05,1.5,1.8,3.3,5
    • 1.05,1.5,3.3,5
    • 1.3,1.8/3.3
    • 1.8,3.3
    • 1.8/3.3
    • 1.8/5
    • 1.8/5.5
    • 2.4/3.6
    • 2.5,3.3
    • 2.5/5
    • 2.7/5
    • 2/5
    • 3.3
    • 3.3,3.3/5,5
    • 3.3,5
    • 3.3/5
    • 3/3.3,5
    • 3/5
    • 3/5,5
    • 5
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • CHIP CARRIER, VERY THIN PROFILE
    • CHIP CARRIER, WINDOW
    • FLATPACK
    • FLATPACK, FINE PITCH
    • FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
    • FLATPACK, LOW PROFILE
    • FLATPACK, LOW PROFILE, FINE PITCH
    • FLATPACK, THIN PROFILE
    • FLATPACK, THIN PROFILE, FINE PITCH
    • GRID ARRAY
    • GRID ARRAY, FINE PITCH
    • GRID ARRAY, HEAT SINK/SLUG
    • GRID ARRAY, LOW PROFILE
    • GRID ARRAY, LOW PROFILE, FINE PITCH
    • GRID ARRAY, THIN PROFILE, FINE PITCH
    • GRID ARRAY, VERY THIN PROFILE, FINE PITCH
    • IN-LINE
    • MICROELECTRONIC ASSEMBLY
    • SMALL OUTLINE
    • SMALL OUTLINE, LOW PROFILE
    • SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
    • SMALL OUTLINE, SHRINK PITCH
Package Equivalence Code
    • BGA(UNSPEC)
    • BGA124,13X13,25
    • BGA16,4X4,14
    • BGA16,4X4,16
    • BGA30,5X6,14
    • BGA35,5X7,16
    • BGA367,22X22,25
    • BGA372,24X24,25
    • BGA373,23X23,20
    • BGA388,26X26,40
    • BGA388,26X26,50
    • BGA417,29X29,32
    • BGA448,30X30,30
    • BGA45,9X5,15
    • BGA486,27X27,20
    • BGA516,26X26,50
    • BGA529,23X23,32
    • BGA548,29X29,20
    • BGA609,35X35,32
    • BGA624,25X25,32
    • BGA625,25X25,32
    • BGA652,28X28,40
    • BGA676,29X29,40
    • BGA68,8X9,16
    • BGA72,8X9,20
    • BGA989(UNSPEC)
    • BGA99,9X11,20
    • DIP20,.3
    • DIP28,.3
    • DIP48,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC24,.16SQ,20
    • LCC32,.16SQ,16
    • LCC32,.2SQ,20
    • LCC40,.24SQ,20
    • LCC40,.2X.28,20
    • LCC44,.28SQ,20
    • LCC48,.24SQ,16
    • LCC48,.27SQ,20
    • LCC48,.28SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.32SQ,16
    • LCC68,.3SQ,40
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • PGA144,15X15
    • QFL144,1.1SQ,25
    • QFP100,.55X0.79
    • QFP100,.63SQ,20
    • QFP128,.67X.93,20
    • QFP144,.87SQ,20
    • QFP208,1.2SQ,20
    • QFP44,.47SQ,32
    • QFP48,.28SQ,20
    • QFP48,.35SQ,20
    • QFP64(UNSPEC)
    • QFP64,.47SQ,20
    • QFP64,.63SQ,32
    • QFP80,.64SQ
    • SOP16,.25
    • SOP20,.4
    • SOP28,.4
    • SOP8,.25
    • SSOP20,.3
    • SSOP28,.3
    • SSOP48,.4
    • SSOP56,.4
    • TQFP100,.63SQ
    • TQFP128,.63SQ,16
    • TQFP44,.47SQ,32
Minimum Supply Voltage
    • .805 V
    • .855 V
    • .87 V
    • .9 V
    • .95 V
    • .97 V
    • .998 V
    • 1 V
    • 1.02 V
    • 1.045 V
    • 1.05 V
    • 1.08 V
    • 1.096 V
    • 1.11 V
    • 1.14 V
    • 1.15 V
    • 1.2 V
    • 1.235 V
    • 1.25 V
    • 1.275 V
    • 1.2825 V
    • 1.3 V
    • 1.35 V
    • 1.38 V
    • 1.425 V
    • 1.7 V
    • 1.71 V
    • 1.8 V
    • 2.1 V
    • 2.25 V
    • 2.375 V
    • 2.4 V
    • 2.45 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 3.135 V
    • 3.15 V
    • 4.5 V
    • 4.75 V
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 115 Cel
    • 125 Cel
    • 45 Cel
    • 70 Cel
    • 85 Cel
    • 90 Cel
    • 95 Cel
CPU Family
    • 8051
    • CORTEX-M0
    • M8C
No. of External Interrupts
    • 8
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -30 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
    • 5 Cel
Terminal Finish
    • MATTE TIN
    • Matte Tin (Sn)
    • NICKEL PALLADIUM GOLD
    • NICKEL PALLADIUM GOLD SILVER
    • Nickel/Palladium/Gold (Ni/Pd/Au)
    • PURE TIN
    • TIN
    • TIN LEAD
    • TIN LEAD SILVER
    • TIN SILVER
    • TIN SILVER BISMUTH
    • TIN SILVER COPPER
    • TIN SILVER COPPER NICKEL
    • Tin (Sn)
    • Tin/Bismuth (Sn/Bi)
    • Tin/Lead (Sn/Pb)
    • Tin/Silver (Sn/Ag)
    • Tin/Silver/Copper (Sn/Ag/Cu)
ADC Channels
    • NO
    • YES
Ultraviolet Erasable
    • N
    • Y
Terminal Position
    • BOTTOM
    • DUAL
    • PERPENDICULAR
    • QUAD
    • UNSPECIFIED
DMA Channels
    • NO
Maximum Seated Height
    • .33 mm
    • .4 mm
    • .41 mm
    • .42 mm
    • .482 mm
    • .55 mm
    • .6 mm
    • .8 mm
    • .9 mm
    • 1 mm
    • 1.2 mm
    • 1.23 mm
    • 1.25 mm
    • 1.298 mm
    • 1.32 mm
    • 1.4 mm
    • 1.45 mm
    • 1.481 mm
    • 1.52 mm
    • 1.54 mm
    • 1.56 mm
    • 1.6 mm
    • 1.63 mm
    • 1.7 mm
    • 1.72 mm
    • 1.721 mm
    • 1.727 mm
    • 1.85 mm
    • 2 mm
    • 2.16 mm
    • 2.18 mm
    • 2.205 mm
    • 2.358 mm
    • 2.38 mm
    • 2.46 mm
    • 2.48 mm
    • 2.49 mm
    • 2.52 mm
    • 2.59 mm
    • 2.61 mm
    • 2.65 mm
    • 2.667 mm
    • 2.67 mm
    • 2.73 mm
    • 2.75 mm
    • 2.794 mm
    • 2.82 mm
    • 2.93 mm
    • 2.96 mm
    • 3.15 mm
    • 3.21 mm
    • 3.3 mm
    • 3.4 mm
    • 3.62 mm
    • 4.064 mm
    • 4.1 mm
    • 4.45 mm
    • 4.57 mm
    • 4.572 mm
    • 4.8 mm
    • 4.82 mm
    • 4.826 mm
    • 5.08 mm
    • 5.588 mm
ROM Words
    • 16384
    • 2048
    • 32768
    • 4096
    • 65536
    • 8192
    • 81920
RAM Words
    • 1024
    • 128
    • 128M
    • 139264
    • 147456
    • 16384
    • 16K
    • 1K
    • 1M
    • 2.5M
    • 2048
    • 229376
    • 256
    • 256K
    • 262144
    • 288K
    • 2K
    • 32768
    • 32K
    • 4096
    • 4K
    • 512
    • 512K
    • 524288
    • 64K
    • 65536
    • 6M
    • 73728
    • 8192
    • 81920
    • 888832
    • 8K
    • 98304
Width
    • 1.452 mm
    • 1.472 mm
    • 1.849 mm
    • 1.975 mm
    • 1.986 mm
    • 10 mm
    • 12 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16 mm
    • 17 mm
    • 19 mm
    • 19.1262 mm
    • 2.097 mm
    • 2.1 mm
    • 2.2 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.52 mm
    • 3.87 mm
    • 3.89 mm
    • 3.898 mm
    • 3.8985 mm
    • 31 mm
    • 33 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.25 mm
    • 4.87 mm
    • 4.907 mm
    • 40 mm
    • 5 mm
    • 5.192 mm
    • 5.3 mm
    • 6 mm
    • 7 mm
    • 7.5 mm
    • 7.505 mm
    • 7.5057 mm
    • 7.6 mm
    • 7.62 mm
    • 7.8 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
Data EEPROM Size
    • 0
Additional Features
    • -40 TO 100 OPERATING CASE TEMPERATURE
    • -40 TO 115 C OPERATING CASE TEMPERATURE
    • -40 TO 115 OPERATING CASE TEMPERATURE
    • 0 TO 100 OPERATING CASE TEMPERATURE
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ
    • 0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE
    • 128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
    • 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O
    • 24MHZ NOM CRYSTAL FREQ AVAILABLE
    • 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE
    • 32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 37.4 MHZ CRYSTAL FREQUENCY AVAILABLE
    • 64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • 64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD
    • ALSO OPERATES 1.3V AT 266MHZ
    • ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US
    • ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE
    • ALSO OPERATES AT 2.7V AND 3.3V SUPPLY
    • ALSO OPERATES AT 2.7V AND 3V SUPPLY
    • ALSO OPERATES AT 3V MINIMUM SUPPLY
    • ALSO OPERATES AT 3V SUPPLY
    • ALSO OPERATES AT 3V WITH 93KHZ
    • ALSO OPERATES AT 750 KHZ WITH 2.4 V
    • ALSO REQUIRES 3.3 V I/O SUPPLY
    • ALSO REQUIRES 3.3 V SUPPLY
    • ALSO REQUIRES 3.3V SUPPLY
    • IT ALSO OPERATES 93KHZ AT 3 V
    • IT ALSO OPERATES AT 2.4V AT 93KHZ
    • IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
    • IT ALSO OPERATES AT 3V AT 93KHZ
    • IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ
    • IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY
    • ITS ALSO HAVING 576KB SRAM FOR THE WIRELESS LAN SUBSYSTEM
    • MULTIPROTOCOL PARALLEL PORT TYPE
    • OPERATES BETWEEN 3 TO 3.6 V WHEN USB IS USED
    • PITCH_MINI
    • SEATED HGT-CALCULATED
    • SEATED HGT-NOM
    • SEATED HT-CALCULATED
    • lsio contains 8 GPIO lines
Boundary Scan
    • NO
    • YES
Peripherals
    • BROWN-OUT DETECT, COMPARATOR(2), POR, TIMER(5), WDT
    • TIMER, WDT
External Data Bus Width
    • 0
    • 128
    • 16
    • 32
    • 4
    • 64
    • 8
Maximum Clock Frequency
    • .032768 MHz
    • 10 MHz
    • 100 MHz
    • 12 MHz
    • 12.06 MHz
    • 12.6 MHz
    • 1200 MHz
    • 133.333 MHz
    • 14.318 MHz
    • 14.31818 MHz
    • 1400 MHz
    • 16 MHz
    • 20 MHz
    • 22 MHz
    • 24 MHz
    • 24.24 MHz
    • 24.6 MHz
    • 25 MHz
    • 25.2 MHz
    • 26 MHz
    • 27 MHz
    • 30 MHz
    • 32 MHz
    • 33 MHz
    • 33.33 MHz
    • 34.48 MHz
    • 35 MHz
    • 36 MHz
    • 38.4 MHz
    • 4 MHz
    • 40 MHz
    • 48 MHz
    • 5 MHz
    • 50 MHz
    • 52 MHz
    • 650 MHz
    • 66 MHz
    • 67 MHz
    • 75 MHz
    • 8 MHz
    • 80 MHz
    • 83.33 MHz
    • 900 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 220
    • 245
    • 250
    • 260
    • NOT SPECIFIED
Length
    • 1.559 mm
    • 1.579 mm
    • 10 mm
    • 10.2 mm
    • 12 mm
    • 12.8 mm
    • 12.8265 mm
    • 13 mm
    • 14 mm
    • 15 mm
    • 15.875 mm
    • 16 mm
    • 17 mm
    • 17.905 mm
    • 18.415 mm
    • 19 mm
    • 19.1262 mm
    • 2.309 mm
    • 2.32 mm
    • 2.582 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24.105 mm
    • 24.18 mm
    • 24.1808 mm
    • 25 mm
    • 25.527 mm
    • 27 mm
    • 28 mm
    • 29 mm
    • 29.3116 mm
    • 3 mm
    • 3.23 mm
    • 3.68 mm
    • 3.691 mm
    • 3.91 mm
    • 31 mm
    • 33 mm
    • 34.67 mm
    • 35 mm
    • 36 mm
    • 36.802 mm
    • 4 mm
    • 4.04 mm
    • 4.889 mm
    • 4.978 mm
    • 4.98 mm
    • 40 mm
    • 5 mm
    • 5.413 mm
    • 5.848 mm
    • 5.94 mm
    • 6 mm
    • 60.96 mm
    • 61.04 mm
    • 62.1 mm
    • 62.103 mm
    • 7 mm
    • 7.2 mm
    • 8 mm
    • 8.3 mm
    • 9 mm
    • 9.779 mm
    • 9.891 mm
    • 9.893 mm
ROM Bits Size
    • 1024 Bits
    • 1048576 Bits
    • 131072 Bits
    • 2097152 Bits
    • 256 Bits
    • 262144 Bits
    • 32768 Bits
    • 4096 Bits
    • 512 Bits
    • 524288 Bits
    • 65536 Bits
    • 8192 Bits
No. of Timers
    • 5
RAM Bytes
    • 1024
    • 2048
    • 256
    • 262144
    • 4096
    • 512
    • 8192
Technology
    • CHMOS
    • CMOS
    • HCMOS
    • MOS
    • NMOS
Analog To Digital Convertors
    • 1-Ch 12-Bit
Maximum Supply Current
    • .008 mA
    • .01 mA
    • .0255 mA
    • 1 mA
    • 12 mA
    • 1200 mA
    • 13.8 mA
    • 1320 mA
    • 14 mA
    • 14.5 mA
    • 1400 mA
    • 15 mA
    • 1500 mA
    • 18.5 mA
    • 180 mA
    • 2 mA
    • 2.5 mA
    • 200 mA
    • 2200 mA
    • 25 mA
    • 27 mA
    • 3.5 mA
    • 35 mA
    • 4 mA
    • 4.5 mA
    • 50 mA
    • 5000 mA
    • 6 mA
    • 6.85 mA
    • 7.2 mA
    • 70 mA
    • 78 mA
    • 8 mA
Nominal Supply Voltage
    • .85 V
    • .9 V
    • .95 V
    • 1 V
    • 1.05 V
    • 1.06 V
    • 1.1 V
    • 1.13 V
    • 1.15 V
    • 1.2 V
    • 1.25 V
    • 1.3 V
    • 1.35 V
    • 1.4 V
    • 1.45 V
    • 1.5 V
    • 1.8 V
    • 2.5 V
    • 2.7 V
    • 3 V
    • 3.3 V
    • 3.45 V
    • 4.75 V
    • 5 V
No. of DMA Channels
    • 1
PWM Channels
    • YES
No. of Serial I/Os
    • 0
    • 1
    • 11
    • 13
    • 16
    • 2
    • 3
    • 4
    • 5
    • 7
    • 8
Sub-Category
    • Bus Controllers
    • Digital Signal Processors
    • Microcontrollers
    • Microprocessors
    • Multifunction Peripherals
    • Other Microprocessor ICs
    • Other uPs/uCs/Peripheral ICs
Connectivity
    • I2C(2), SPI(2), UART(2)
ROM Programmability
    • FLASH
Bus Compatibility
    • 68000
    • 680X0; 88XXX; 80X86; SPARC; R4000; AXP
    • 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340
    • 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8
    • 80386
    • 8042; IBM PC-XT; IBM PC-AT; IRDA; PCI; SMBUS
    • 8051; CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • 8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN(2), I2C(2), QSPI, SPI(4), UART(3)
    • CAN(3), SAI(4), SPI(4), UART(6)
    • CAN, I2C, I2S, SPI, SSP, UART USB
    • CAN, SSP, UART(3)
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; I2S; IRDA; RS-485; RS-232; SPI; UART; USB
    • CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; PCI; SPI; UART; USB
    • CAN; ETHERNET; I2C; SPI; UART; USB
    • CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • CAN; I2C; IRDA; PCI; SPI; UART; USB
    • ETHERNET, I2C, I2S, PCI, SPI, UART, USB
    • ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
    • ETHERNET; I2C; PCI; SPI; UART; USB
    • I2C
    • I2C, I2S, IDE, SPI, UART
    • I2C, I2S, IRDA, SPI, UART, USART
    • I2C, I2S, SPI, UART
    • I2C, IDE, ISA, PCI, USB, VGA
    • I2C, IRDA, SPI, UART, USB
    • I2C, PCI, SPI, UART, USB
    • I2C, SAI, SPI, UART
    • I2C, SPI, UART
    • I2C, USB
    • I2C; I2S, LIN; PS/2; SPI, USB
    • I2C; I2S; IDE; IRDA; LIN; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART
    • I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS
    • I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS
    • I2C; I2S; SPI; UART
    • I2C; I2S; SPI; UART; IRDA; LIN; IDE
    • I2C; I2S; UART; SPI; USB; ETHERNET
    • I2C; IDE; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART
    • I2C; IRDA; LIN; SPI; UART; USB
    • I2C; IRDA; PCI; PS/2; SMBUS; SPI; UART
    • I2C; SPI; UART
    • I2C; SPI; UART; IRDA; IDE; CAN; LIN
    • I2C; SPI; UART; IRDA; IDE; LIN
    • I2C; SPI; UART; LPC; LIN; IRDA; IDE
    • I2C; SPI; UART; USB
    • I2C; USB
    • I2C; USB; LPC
    • I2C; USB; PS/2
    • I2C; USB; PS/2; 8051
    • IRDA, PC-AT, PC-XT, PS/2, PCI
    • LPC
    • MC68000
    • PC-AT; ISA; PS/2
    • PCI
    • PCI; I2C; 60X PROCESSOR
    • PCI; ISA
    • PCI; ISA; CARDBUS; PCMCIA; PC-AT; PS/2
    • PCI; RC32364; RC32134
    • PCI; SATA; SMBUS; UART; USB
    • PCI; USB; LPC
    • SPI, UART
    • SPI, USB
    • TX3922; ISA; PCMCIA; USB
    • USB
    • USB; PCI; I2C
    • USB; PCI; I2C; LPC; PS/2
    • USB; PCI; ISA
    • USB; PCI; ISA; PCMCIA
    • VR4100
    • Z84C00
Terminal Pitch
    • .35 mm
    • .37 mm
    • .38 mm
    • .4 mm
    • .5 mm
    • .6 mm
    • .635 mm
    • .65 mm
    • .75 mm
    • .76 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 2.54 mm
Format
    • FIXED POINT
    • FLOATING POINT
JESD-30 Code
    • R-CDIP-T48
    • R-PBGA-B1071
    • R-PBGA-B16
    • R-PBGA-B286
    • R-PBGA-B30
    • R-PBGA-B316
    • R-PBGA-B35
    • R-PBGA-B45
    • R-PBGA-B68
    • R-PBGA-B72
    • R-PBGA-B76
    • R-PBGA-B99
    • R-PDIP-T20
    • R-PDIP-T28
    • R-PDIP-T48
    • R-PDIP-T8
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G48
    • R-PDSO-G56
    • R-PDSO-G8
    • R-PQFP-G100
    • R-PQFP-G128
    • R-XQCC-N40
    • S-CPGA-P132
    • S-CQCC-J68
    • S-CQFP-F256
    • S-PBGA-B1020
    • S-PBGA-B124
    • S-PBGA-B1284
    • S-PBGA-B1313
    • S-PBGA-B1517
    • S-PBGA-B16
    • S-PBGA-B272
    • S-PBGA-B289
    • S-PBGA-B338
    • S-PBGA-B367
    • S-PBGA-B372
    • S-PBGA-B373
    • S-PBGA-B387
    • S-PBGA-B388
    • S-PBGA-B400
    • S-PBGA-B404
    • S-PBGA-B416
    • S-PBGA-B417
    • S-PBGA-B421
    • S-PBGA-B423
    • S-PBGA-B448
    • S-PBGA-B473
    • S-PBGA-B486
    • S-PBGA-B503
    • S-PBGA-B515
    • S-PBGA-B516
    • S-PBGA-B529
    • S-PBGA-B538
    • S-PBGA-B541
    • S-PBGA-B548
    • S-PBGA-B552
    • S-PBGA-B569
    • S-PBGA-B609
    • S-PBGA-B621
    • S-PBGA-B624
    • S-PBGA-B625
    • S-PBGA-B652
    • S-PBGA-B676
    • S-PBGA-B689
    • S-PBGA-B760
    • S-PBGA-B780
    • S-PBGA-B784
    • S-PBGA-B989
    • S-PDSO-G48
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N42
    • S-PQCC-N64
    • S-PQFP-G100
    • S-PQFP-G128
    • S-PQFP-G144
    • S-PQFP-G208
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XPGA-P144
    • S-XQCC-N16
    • S-XQCC-N24
    • S-XQCC-N32
    • S-XQCC-N36
    • S-XQCC-N40
    • S-XQCC-N44
    • S-XQCC-N48
    • S-XQCC-N56
    • S-XQCC-N68
    • S-XQFP-F144
    • S-XXMA-N21
Moisture Sensitivity Level (MSL)
    • 1
    • 2A
    • 3
    • 4
Qualification
    • Not Qualified
Speed
    • 100 rpm
    • 1000 rpm
    • 1176 rpm
    • 12 rpm
    • 12.6 rpm
    • 1200 rpm
    • 133 rpm
    • 1500 rpm
    • 1800 rpm
    • 24 rpm
    • 24.6 rpm
    • 24.96 rpm
    • 25.2 rpm
    • 300 rpm
    • 400 rpm
    • 454 rpm
    • 48 rpm
    • 500 rpm
    • 528 rpm
    • 60 rpm
    • 600 rpm
    • 650 rpm
    • 66 rpm
    • 67 rpm
    • 696 rpm
    • 720 rpm
    • 75 rpm
    • 750 rpm
    • 80 rpm
    • 800 rpm
    • 90 rpm
Low Power Mode
    • YES
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Standby Current
    • .000005 Amp
    • .00002 Amp
On Chip Program ROM Width
    • 8
No. of I/O Lines
    • 0
    • 1
    • 12
    • 126
    • 13
    • 136
    • 14
    • 16
    • 160
    • 17
    • 18
    • 186
    • 188
    • 19
    • 20
    • 21
    • 212
    • 215
    • 24
    • 247
    • 25
    • 27
    • 28
    • 29
    • 30
    • 31
    • 32
    • 33
    • 34
    • 36
    • 37
    • 38
    • 4
    • 40
    • 44
    • 45
    • 46
    • 48
    • 49
    • 5
    • 50
    • 51
    • 53
    • 54
    • 55
    • 57
    • 6
    • 62
    • 64
    • 68
    • 70
    • 72
    • 75
    • 76
    • 8
    • 98
    • 99
Maximum Access Time
    • .00000007 ns
    • .00000009 ns
    • .00000015 ns
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MIMX8ML8DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

MIMX8ML4DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

CC1111F32RSP

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

85 Cel

8051

0 Cel

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

4096

CMOS

.5 mm

S-PQCC-N36

3

Not Qualified

e4

21

MIMX8ML6DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

MIMX8ML3DVNLZAB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

548

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA548,29X29,20

.95 V

95 Cel

0 Cel

BOTTOM

1.481 mm

888832

15 mm

YES

0

24 MHz

40

260

15 mm

CMOS

2200 mA

1 V

16

ETHERNET, I2C, I2S, PCI, SPI, UART, USB

.5 mm

S-PBGA-B548

3

136

MCIMX6G2DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

14 mm

YES

16

40

260

14 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B289

3

528 rpm

YES

e1

STPCI2GDYI

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

2.5,3.3

GRID ARRAY

BGA516,26X26,50

2.45 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

14.31818 MHz

35 mm

CMOS

2.5 V

Other Microprocessor ICs

USB; PCI; ISA; PCMCIA

1.27 mm

S-PBGA-B516

Not Qualified

e0

24

CYONS2101-LBXC

Cypress Semiconductor

OTHER

NO LEAD

42

HQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

2.7 V

45 Cel

5 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

2.46 mm

1024

8.3 mm

SEATED HT-CALCULATED

NO

25.2 MHz

20

260

8.3 mm

CMOS

3.3 V

I2C; USB

.5 mm

S-PQCC-N42

3

Not Qualified

e4

28

CC1111F32RSPR

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

85 Cel

8051

0 Cel

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

4096

CMOS

.5 mm

S-PQCC-N36

3

Not Qualified

e4

21

MCIMX6G2DVK05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

95 Cel

0 Cel

BOTTOM

1.23 mm

9 mm

YES

16

40

260

9 mm

CMOS

.5 mm

FIXED POINT

S-PBGA-B272

3

528 rpm

YES

66AK2H06DAAW2

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

MCIMX27LVOP4AR2

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

404

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.52 V

26

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.38 V

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

17 mm

ALSO OPERATES 1.3V AT 266MHZ

YES

32

32 MHz

40

260

17 mm

CMOS

1.45 V

.65 mm

FIXED POINT

S-PBGA-B404

3

400 rpm

YES

e1

66AK2H06DAAW24

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

CC1111F16RSPR

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

CC1111F16RSP

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

AVCE6467TZUTL1

Texas Instruments

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

0

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

BOTTOM

3.3 mm

128

19 mm

YES

0

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

I2C; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

33

TFB2002BIPPM

Texas Instruments

OTHER

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

36

FLATPACK, FINE PITCH

4.75 V

85 Cel

-20 Cel

QUAD

4.1 mm

28 mm

YES

64

25 MHz

28 mm

CMOS

5 V

680X0; 88XXX; 80X86; SPARC; R4000; AXP

.5 mm

S-PQFP-G208

Not Qualified

0

66AK2H14DAAW24

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

66AK2H12DAAW24

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

CC1111F8RSP

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

85 Cel

8051

0 Cel

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

4096

CMOS

.5 mm

S-PQCC-N36

3

Not Qualified

e4

21

TFB2002BPPM

Texas Instruments

OTHER

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

36

FLATPACK, FINE PITCH

4.75 V

85 Cel

-20 Cel

QUAD

4.1 mm

28 mm

YES

64

25 MHz

28 mm

CMOS

5 V

680X0; 88XXX; 80X86; SPARC; R4000; AXP

.5 mm

S-PQFP-G208

Not Qualified

0

VCE6467TZUTL1

Texas Instruments

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

0

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

BOTTOM

3.3 mm

128

19 mm

YES

0

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

I2C; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

33

CC1111F8RSPR

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

66AK2H12DAAW2

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

32

GRID ARRAY

.95 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.62 mm

6M

40 mm

YES

128

30

245

40 mm

CMOS

1 V

ETHERNET; I2C; PCI; SPI; UART; USB

1 mm

S-PBGA-B1517

4

e1

32

OMAP3530ECBBLPD

Texas Instruments

MICROPROCESSOR, RISC

OTHER

BALL

515

VFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.4175 V

26

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.2825 V

90 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.9 mm

64K

12 mm

YES

16

38.4 MHz

NOT SPECIFIED

260

12 mm

CMOS

1.35 V

CAN; I2C; IRDA; PCI; SPI; UART; USB

.5 mm

FIXED POINT

S-PBGA-B515

3

720 rpm

YES

e1

188

STPCI2HDYC

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

2.5,3.3

GRID ARRAY

BGA516,26X26,50

2.45 V

85 Cel

0 Cel

BOTTOM

2.38 mm

35 mm

YES

32

14.31818 MHz

35 mm

CMOS

2.5 V

Other Microprocessor ICs

USB; PCI; ISA; PCMCIA

1.27 mm

S-PBGA-B516

Not Qualified

24

STPCC4HEBC

STMicroelectronics

MULTIFUNCTION PERIPHERAL

OTHER

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

3.3

GRID ARRAY

BGA388,26X26,40

2.45 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

Multifunction Peripherals

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

e0

STPCC4EEBC

STMicroelectronics

OTHER

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

GRID ARRAY

2.45 V

85 Cel

0 Cel

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

STPCC5HEBC

STMicroelectronics

MULTIFUNCTION PERIPHERAL

OTHER

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

3.3

GRID ARRAY

BGA388,26X26,40

2.45 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

Multifunction Peripherals

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

e0

STPCI2GEYC

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

GRID ARRAY

2.45 V

85 Cel

0 Cel

BOTTOM

2.38 mm

35 mm

YES

32

14.31818 MHz

35 mm

CMOS

2.5 V

USB; PCI; ISA; PCMCIA

1.27 mm

S-PBGA-B516

Not Qualified

24

STPCC4HDBC

STMicroelectronics

OTHER

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

GRID ARRAY

2.45 V

85 Cel

0 Cel

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

STPCI2HEYC

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

2.5,3.3

GRID ARRAY

BGA516,26X26,50

2.45 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

14.31818 MHz

35 mm

CMOS

2.5 V

Other Microprocessor ICs

USB; PCI; ISA; PCMCIA

1.27 mm

S-PBGA-B516

Not Qualified

e0

24

STPCI2GDYC

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

GRID ARRAY

2.45 V

85 Cel

0 Cel

BOTTOM

2.38 mm

35 mm

YES

32

14.31818 MHz

35 mm

CMOS

2.5 V

USB; PCI; ISA; PCMCIA

1.27 mm

S-PBGA-B516

Not Qualified

24

STPCI2HEYC1

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

13

GRID ARRAY

2.45 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

128M

35 mm

SEATED HGT-CALCULATED

YES

64

35 mm

CMOS

2.5 V

I2C, IDE, ISA, PCI, USB, VGA

1.27 mm

S-PBGA-B516

Not Qualified

e0

16

SCIMX6S5DVM10CC

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

BOTTOM

1.6 mm

147456

21 mm

YES

32

24 MHz

21 mm

CMOS

1320 mA

4

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B624

1000 rpm

YES

14

SCIMX6U5DVM10CB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

BOTTOM

1.6 mm

147456

21 mm

YES

64

24 MHz

21 mm

CMOS

2200 mA

4

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B624

1000 rpm

YES

14

SCIMX6S5DVM10CD

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

BOTTOM

1.6 mm

147456

21 mm

YES

32

24 MHz

21 mm

CMOS

1320 mA

4

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.8 mm

S-PBGA-B624

14

SCIMX6U5DVM10CD

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

BOTTOM

1.6 mm

147456

21 mm

YES

64

24 MHz

21 mm

CMOS

2200 mA

4

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.8 mm

S-PBGA-B624

14

SCIMX6U5DVM10CC

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

BOTTOM

1.6 mm

147456

21 mm

YES

64

24 MHz

21 mm

CMOS

2200 mA

4

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B624

1000 rpm

YES

14

SCIMX6S5DVM10CB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.5 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

BOTTOM

1.6 mm

147456

21 mm

YES

32

24 MHz

21 mm

CMOS

1320 mA

4

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B624

1000 rpm

YES

14

MCIMX6G3DVM05AB

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.3 V

26

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

14 mm

YES

16

40

260

14 mm

CMOS

.8 mm

FIXED POINT

S-PBGA-B289

3

528 rpm

YES

e1

LS1017ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.97 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

40

260

17 mm

CMOS

1 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

3

68

LS1027ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.97 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

40

260

17 mm

CMOS

1 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

3

68

LS1027ASE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.97 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

40

260

17 mm

CMOS

1 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

3

68

LS1027ASN7HQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

.93 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.87 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

17 mm

CMOS

.9 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

68

LS1017ASE7HQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.97 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

17 mm

CMOS

1 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

68

LS1027ASE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

.93 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.87 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

40

260

17 mm

CMOS

.9 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

3

68

LS1017ASE7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL

OTHER

BALL

448

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

14

GRID ARRAY, FINE PITCH

BGA448,30X30,30

.97 V

105 Cel

0 Cel

BOTTOM

2.61 mm

262144

17 mm

YES

32

40

260

17 mm

CMOS

1 V

8

I2C, SAI, SPI, UART

.75 mm

S-PBGA-B448

3

68

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.