Infineon Technologies Multi-functional Peripherals 795

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C3666AXI-037T

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

4096

14 mm

YES

0

33 MHz

14 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

8051; CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

62

CY8C4024LQI-S401T

Infineon Technologies

NICKEL PALLADIUM GOLD

30

260

3

e4

CY8C4248LTI-L485

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

8 mm

NO

48 MHz

8 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

CY8C5667LTI-LP041

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

16384

8 mm

YES

33 MHz

30

260

8 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C4025AZI-S413T

Infineon Technologies

PURE TIN

3

CY8C28243-24PVXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

16384

1024

5.3 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

30

260

7.2 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

I2C, IRDA, SPI, UART, USB

.65 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

CY8C28243-24PVXIT

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

16384

1024

5.3 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

30

260

7.2 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

I2C, IRDA, SPI, UART, USB

.65 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

CY8C3246PVI-147T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

8192

7.505 mm

YES

0

25 MHz

15.875 mm

CMOS

18.5 mA

3.3 V

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.635 mm

R-PDSO-G48

3

e4

25

CY8C4147AZI-S453

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C5668AXI-LP010

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

30

260

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

CY8C4147AZI-S455

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4248AZI-L475

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

16384

10 mm

NO

48 MHz

10 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.5 mm

S-PQFP-G64

3

53

CY8C5468LTI-LP026

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

BGA99,9X11,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

32768

8 mm

YES

33 MHz

30

260

8 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C20536A-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

8

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

8192

512

7.505 mm

NO

0

25.2 MHz

20

260

15.875 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.635 mm

R-PDSO-G48

3

Not Qualified

25.2 rpm

e4

34

CY8C20536A-24PVXIT

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

8

1.8/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

8192

512

7.505 mm

NO

0

25.2 MHz

20

260

15.875 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.635 mm

R-PDSO-G48

3

Not Qualified

25.2 rpm

e4

34

CY8C4246AZI-M445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64(UNSPEC)

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

4096

10 mm

NO

48 MHz

10 mm

CMOS

13.8 mA

11

I2C; SPI; UART; IRDA; IDE; LIN

.5 mm

S-PQFP-G64

3

e4

51

CY8C5688AXI-LP099

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB

.5 mm

S-PQFP-G100

3

Not Qualified

62

CY8C4125LTI-M445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

2048

8 mm

NO

48 MHz

8 mm

CMOS

7.2 mA

7

I2C; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N68

3

e4

55

CY8C624ABZI-S2D44T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4013LQI-411T

Infineon Technologies

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

1024

3 mm

NO

0

16 MHz

3 mm

CMOS

3.3 V

I2C

.5 mm

S-XQCC-N16

3

e4

12

CY8C4125AXI-473

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

1.71 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

2048

10 mm

NO

0

24 MHz

20

260

10 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.8 mm

S-PQFP-G44

3

Not Qualified

e3

36

CY8C4745FNI-S412T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C20436A-24LQXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

8192

512

5 mm

NO

0

25.2 MHz

40

260

5 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N32

3

Not Qualified

25.2 rpm

e4

28

CY8C4145LQI-PS423

Infineon Technologies

MULTIFUNCTION PERIPHERAL

NICKEL PALLADIUM GOLD

3

e4

CY8C4247AZI-L423

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

1.8 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

8192

7 mm

NO

48 MHz

7 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.5 mm

S-PQFP-G48

3

38

CY8C6247FDI-D32T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4145LQI-PS433

Infineon Technologies

MULTIFUNCTION PERIPHERAL

NICKEL PALLADIUM GOLD

3

e4

CY8C5288FNI-LP213T

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.6 mm

32768

5.192 mm

YES

0

33 MHz

5.94 mm

CMOS

3.3 V

I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.5 mm

R-PBGA-B99

1

e1

62

CY8C6347FMI-BLD43T

Infineon Technologies

TIN SILVER COPPER

1

e1

CY8C27243-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

16384

256

5.3 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

30

260

7.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

.65 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

CY8C4014LQI-412

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

24

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC24,.16SQ,20

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.55 mm

1024

4 mm

NO

16 MHz

30

260

4 mm

CMOS

4.5 mA

3.3 V

I2C

.5 mm

S-XQCC-N24

3

e4

20

CY8C5868AXI-LP031

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

30

260

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

70

CY8C3865AXI-019

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1.6 mm

2048

14 mm

YES

0

67 MHz

40

260

14 mm

32768 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-PQFP-G100

3

Not Qualified

e4

72

CY8C4014SXI-420

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

SOP8,.25

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.727 mm

2K

3.8985 mm

NO

16 MHz

30

260

4.978 mm

CMOS

4.5 mA

3.3 V

I2C; USB

1.27 mm

R-PDSO-G8

3

e4

5

CY8C4124LQI-443T

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

CHIP CARRIER, HEAT SINK/SLUG

1.71 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

2048

10 mm

NO

0

24 MHz

10 mm

CMOS

1.8 V

I2C; SPI; UART

.8 mm

S-XQCC-N56

3

e4

34

CY8C4248LTI-L475

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

8 mm

NO

48 MHz

8 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

CY8C5888FNI-LP214

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

33 MHz

260

5.94 mm

CMOS

1.8 V

I2C; USB

.5 mm

R-PBGA-B99

1

e4

62

CY8C20236A-24LKXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

8192

512

3 mm

NO

0

25.2 MHz

30

260

3 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N16

3

Not Qualified

25.2 rpm

e4

13

CY8C3866PVI-070

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

2/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

DUAL

2.794 mm

4096

7.505 mm

YES

0

67 MHz

20

260

15.875 mm

65536 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.635 mm

R-PDSO-G48

3

Not Qualified

e4

29

CY8C4014SXI-411

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

1.8 V

85 Cel

-40 Cel

DUAL

1.727 mm

1024

3.8985 mm

NO

16 MHz

30

260

9.893 mm

CMOS

3.3 V

I2C; USB

1.27 mm

R-PDSO-G16

3

13

CY8C4045FNI-DS402T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4045LQI-S412T

Infineon Technologies

PURE TIN

3

CY8C24423A-24SXI

Infineon Technologies

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE

SOP28,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.67 mm

4096

256

7.505 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

20

260

17.905 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

1.27 mm

R-PDSO-G28

3

Not Qualified

24 rpm

e4

24

CY8C4013LQI-411

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

16

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC16,.12SQ,20

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

1024

3 mm

NO

16 MHz

30

260

3 mm

CMOS

4.5 mA

3.3 V

I2C

.5 mm

S-XQCC-N16

3

e4

12

CY8C4013SXI-400

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

8

LSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, LOW PROFILE

SOP8,.25

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.727 mm

1024

3.89 mm

NO

16 MHz

30

260

4.889 mm

CMOS

4.5 mA

3.3 V

I2C

1.27 mm

R-PDSO-G8

3

e4

5

CY8C4125LQI-PS423

Infineon Technologies

MULTIFUNCTION PERIPHERAL

NICKEL PALLADIUM GOLD

3

e4

CY8C4246AZI-M475

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

QFP64(UNSPEC)

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

8K

10 mm

NO

0

48 MHz

10 mm

CMOS

13.8 mA

3.3 V

11

I2C; SPI; UART; IRDA; IDE; LIN

.5 mm

S-PQFP-G64

3

e4

51

CY8C4247LTI-L485

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

8 mm

NO

48 MHz

8 mm

CMOS

14.5 mA

I2C; IRDA; LIN; SPI; UART; USB

.4 mm

S-XQCC-N68

3

e4

57

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.