Infineon Technologies Multi-functional Peripherals 795

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CY8C6247FDI-D02T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C624AFNI-S2D43T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C24123A-24SXIT

Infineon Technologies

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE

SOP8,.25

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

DUAL

1.727 mm

4096

256

3.8985 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

20

260

4.889 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

1.27 mm

R-PDSO-G8

3

Not Qualified

24 rpm

e3

6

CY8C4025LQI-S401T

Infineon Technologies

NICKEL PALLADIUM GOLD

30

260

3

e4

CY8C4147AZI-S443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4246AZI-L445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

8K

10 mm

YES

0

48 MHz

10 mm

CMOS

14.5 mA

1.8 V

I2C; USB; LPC

.5 mm

S-PQFP-G64

3

53

CY8C4247AZI-L423T

Infineon Technologies

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

FLATPACK, LOW PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

8192

7 mm

NO

0

48 MHz

7 mm

CMOS

1.8 V

I2C; SPI; UART

.5 mm

S-PQFP-G48

3

38

CY8C5888FNI-LP210

Infineon Technologies

INDUSTRIAL

BALL

99

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.6 mm

32768

5.192 mm

YES

33 MHz

260

5.94 mm

CMOS

1.8 V

I2C; USB

.5 mm

R-PBGA-B99

1

e4

62

CY8C4024LQI-S413T

Infineon Technologies

PURE TIN

3

CY8C5667AXI-LP006

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

MATTE TIN

N

QUAD

1.6 mm

16384

14 mm

YES

33 MHz

30

260

14 mm

1048576 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

e3

72

CY8C24794-24LTXI

Infineon Technologies

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

4.75 V

85 Cel

M8C

-40 Cel

MATTE TIN

QUAD

1 mm

16384

512

8 mm

IT ALSO OPERATES AT 3 V MINIMUM SUPPLY

NO

0

24 MHz

20

260

8 mm

1024

CMOS

27 mA

5 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-XQCC-N56

3

Not Qualified

24.96 rpm

e3

50

CY8C22545-24AXI

Infineon Technologies

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

16384

512

10 mm

NO

0

24 MHz

20

260

10 mm

1024

CMOS

12 mA

5 V

Microcontrollers

FLASH

.8 mm

S-PQFP-G44

3

Not Qualified

24.6 rpm

e4

38

CY8C29666-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

48

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP48,.4

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.794 mm

32768

1024

7.505 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

15.875 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.635 mm

R-PDSO-G48

3

Not Qualified

24 rpm

e4

44

CY8C20234-12LKXI

Infineon Technologies

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

2.7/5

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

8192

512

3 mm

IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ

NO

0

12 MHz

20

260

3 mm

512

CMOS

2.5 mA

4.75 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N16

3

Not Qualified

12 rpm

e4

13

CY8C20636A-24LTXI

Infineon Technologies

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

512

7 mm

NO

0

25.2 MHz

20

260

7 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N48

3

Not Qualified

25.2 rpm

e4

36

CY8C22545-24AXIT

Infineon Technologies

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

16384

512

10 mm

NO

0

24 MHz

20

260

10 mm

1024

CMOS

12 mA

5 V

Microcontrollers

FLASH

.8 mm

S-PQFP-G44

3

Not Qualified

24.6 rpm

e4

38

CY8C27543-24AXI

Infineon Technologies

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

0

8

3.3/5

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

16384

256

10 mm

ALSO OPERATES AT 3V WITH 93KHZ

NO

0

24 MHz

20

260

10 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

I2C; USB

.8 mm

S-PQFP-G44

3

Not Qualified

24 rpm

e4

40

CY8C24223A-24PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

4096

256

5.3 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

30

260

7.2 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G20

3

Not Qualified

24 rpm

e4

16

CY8C3666LTI-027

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

8051

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

65536

4096

8 mm

YES

0

67 MHz

30

260

8 mm

8192

CMOS

3.3 V

Microcontrollers

FLASH

I2C; USB

.4 mm

S-XQCC-N68

3

Not Qualified

67 rpm

e4

38

CY8C4024LQI-S411T

Infineon Technologies

NICKEL PALLADIUM GOLD

30

260

3

e4

CY8C20534-12PVXI

Infineon Technologies

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

0

8

2.7/5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

3 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

8192

512

5.3 mm

IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ

NO

0

12 MHz

20

260

10.2 mm

512

CMOS

2.5 mA

4.75 V

Microcontrollers

FLASH

USB

.65 mm

R-PDSO-G28

3

Not Qualified

12 rpm

e4

24

CY8C24423A-24LTXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

2.7/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4096

256

5 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

40

260

5 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N32

3

Not Qualified

24 rpm

e4

24

CY8C3246AXI-138T

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

4096

14 mm

YES

0

33 MHz

14 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

.5 mm

S-PQFP-G100

3

Not Qualified

62

CY8C4125AZI-473

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.28SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

1.6 mm

2048

7 mm

NO

0

24 MHz

7 mm

CMOS

7.2 mA

1.8 V

0

I2C, I2S, SPI, UART

.5 mm

S-PQFP-G48

3

36

CY8C4126AZI-S445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4127FNI-BL483T

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

68

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA68,8X9,16

1.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.55 mm

8192

3.52 mm

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

NO

30

260

3.91 mm

CMOS

25 mA

3.3 V

I2C, SPI, UART

.4 mm

R-PBGA-B68

1

e1

36

CYW43907KWBGT

Infineon Technologies

1

CY8C29666-24LTXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

32768

1024

7 mm

ALSO OPERATES AT 3V SUPPLY

NO

0

24 MHz

20

260

7 mm

2048

CMOS

14 mA

5 V

Microcontrollers

FLASH

.5 mm

S-XQCC-N48

3

Not Qualified

24 rpm

e4

44

CY8C3666LTI-201

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

4096

8 mm

YES

33 MHz

30

260

8 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.4 mm

S-XQCC-N68

3

Not Qualified

e4

46

CY8C3866AXI-208

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

4096

14 mm

YES

33 MHz

14 mm

524288 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2; 8051

.5 mm

S-PQFP-G100

3

Not Qualified

72

CY8C4124FNI-443T

Infineon Technologies

INDUSTRIAL

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

0

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.71 V

85 Cel

-40 Cel

BOTTOM

.482 mm

2048

2.097 mm

NO

0

48 MHz

2.582 mm

CMOS

3.3 V

I2C; SPI; UART

.35 mm

R-PBGA-B35

1

31

CY8C4125PVI-PS421

Infineon Technologies

MULTIFUNCTION PERIPHERAL

NICKEL PALLADIUM GOLD

3

e4

CY8C4126AXI-M443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

4096

10 mm

NO

48 MHz

10 mm

CMOS

7.2 mA

7

I2C; IRDA; LIN; SPI; UART

.8 mm

S-PQFP-G44

3

e4

36

CY8C4126LTI-M445

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG

LCC68,.32SQ,16

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4096

8 mm

NO

48 MHz

8 mm

CMOS

7.2 mA

7

I2C; IRDA; LIN; SPI; UART

.4 mm

S-XQCC-N68

3

e4

55

CY8C5468AXI-LP042

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

0

33 MHz

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB; PS/2

.5 mm

S-PQFP-G100

3

Not Qualified

72

CY8C5488AXI-LP120

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1.8/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

N

QUAD

1.6 mm

32768

14 mm

YES

33 MHz

14 mm

2097152 Bits

CMOS

1.8 V

Other uPs/uCs/Peripheral ICs

I2C; USB

.5 mm

S-PQFP-G100

3

Not Qualified

62

CY8C20236A-24LKXI

Infineon Technologies

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

8192

512

3 mm

NO

0

25.2 MHz

30

260

3 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N16

3

Not Qualified

25.2 rpm

e4

13

CY8C20636A-24LTXIT

Infineon Technologies

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

512

7 mm

NO

0

25.2 MHz

20

260

7 mm

1024

CMOS

4 mA

3 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N48

3

Not Qualified

25.2 rpm

e4

36

CY8C24423A-24LTXI

Infineon Technologies

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

2.7/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4096

256

5 mm

ALSO OPERATES AT 2.7V AND 3.3V SUPPLY

NO

0

24.6 MHz

40

260

5 mm

256

CMOS

8 mA

5 V

Microcontrollers

FLASH

USB

.5 mm

S-XQCC-N32

3

Not Qualified

24 rpm

e4

24

CY8C28643-24LTXI

Infineon Technologies

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

0

8

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

4.75 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

1024

7 mm

ALSO OPERATES AT 3V MINIMUM SUPPLY

NO

0

24 MHz

20

260

7 mm

1024

CMOS

14 mA

5 V

Microcontrollers

FLASH

I2C, IRDA, SPI, UART, USB

.5 mm

S-XQCC-N48

3

Not Qualified

24 rpm

e4

44

CY8C3666AXI-052

Infineon Technologies

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

0

8

2/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.71 V

85 Cel

8051

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

65536

4096

14 mm

YES

0

67 MHz

40

260

14 mm

8192

CMOS

3.3 V

Microcontrollers

FLASH

I2C; USB

.5 mm

S-PQFP-G100

3

Not Qualified

67 rpm

e4

62

CY8C3866LTI-030

Infineon Technologies

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

0

2/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.3SQ,40

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

N

QUAD

1 mm

4096

8 mm

YES

0

67 MHz

30

260

8 mm

65536 Bits

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

.4 mm

S-XQCC-N68

3

Not Qualified

e4

48

CY8C4013SXI-411T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4014FNI-421AT

Infineon Technologies

TIN SILVER COPPER

1

e1

CY8C4125AXI-483T

Infineon Technologies

NOT SPECIFIED

NOT SPECIFIED

CY8C4126AXI-M443T

Infineon Technologies

PURE TIN

3

CY8C4127AXI-S443

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

CY8C4145AZI-PS433

Infineon Technologies

MULTIFUNCTION PERIPHERAL

PURE TIN

3

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.