1369 Other Function uPs,uCs & Peripheral ICs 178

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVC1352-1LSINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC2802-1MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-1MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2802-2MLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1702-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVP1002-1LSINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVP1002-2MLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVP1002-2MSINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVP1002-2LLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVE2802-1LSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVP1052-2LLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVE2602-1LSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVE2802-1LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVE1752-2MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE2602-2MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVE2802-1MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVP1002-2LLENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVE1752-2LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE2802-2LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVE2802-1MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVE1752-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVP1052-2MLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVP1052-2MLENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVE2602-1MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVE2802-2LLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVE1752-2MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-2LLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVP1002-2MLENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVE2602-2MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVE1752-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVE2602-1LLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVE1752-1MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE2602-2MLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVP1052-2HSINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel	BOTTOM				CMOS	.88 V		R-PBGA-B1369
XCVP1052-1LSINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVE2802-1LLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVP1002-1MSINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVE2602-1LSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVP1052-1LSENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVP1052-1MLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVM1402-2LLENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	100 Cel	0 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-1MLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-1LLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1302-1LLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1402-1MSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2LSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1402-1LSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.