Xilinx - XCVC1702-1LSENSVG1369

XCVC1702-1LSENSVG1369 by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XCVC1702-1LSENSVG1369
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;
Datasheet XCVC1702-1LSENSVG1369 Datasheet
In Stock270
NAME DESCRIPTION
Minimum Supply Voltage: .676 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .7 V
Maximum Supply Voltage: .724 V
Maximum Seated Height: 4 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 1369
Package Equivalence Code: BGA1369,37X37,36
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 35 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B1369
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: HBGA
Width: 35 mm
Terminal Pitch: .92 mm
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
270 - -

Popular Products

Category Top Products