NXP Semiconductors - MCIMX6X4EVM10AC

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MCIMX6X4EVM10AC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6X4EVM10AC
Description SoC; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
Datasheet MCIMX6X4EVM10AC Datasheet
In Stock337
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.52 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 529
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B529
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Package Equivalence Code: BGA529,23X23,32
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
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