153 Other Function uPs,uCs & Peripheral ICs 10

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
MTFC4GMDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153	e1
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153	e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	2.7 V	85 Cel	-25 Cel		BOTTOM	1 mm	11.5 mm				13 mm	CMOS	3.3 V	.5 mm	R-PBGA-B153
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153	e1
MTFC4GMVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS			13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153	e1
THGBM5G6A2JBAIR	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	2.7 V	85 Cel	-25 Cel		BOTTOM	1 mm	11.5 mm				13 mm	CMOS	3.3 V	.5 mm	R-PBGA-B153
MTFC8GLCDM-1MWT	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153
MTFC4GMCDM-1MWTES	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153
MTFC4GMCDM-1MWT	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153
MTFC8GLCDM-1MWTES	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V	GRID ARRAY, THIN PROFILE, FINE PITCH	1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V	.5 mm	R-PBGA-B153

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.