Micron Technology - MTFC8GLCDM-1MWTES

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MTFC8GLCDM-1MWTES by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFC8GLCDM-1MWTES
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR;
Datasheet MTFC8GLCDM-1MWTES Datasheet
In Stock1,466
NAME DESCRIPTION
Minimum Supply Voltage: 1.65 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: 1.95 V
Maximum Seated Height: 1.2 mm
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
No. of Terminals: 153
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Length: 13 mm
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Additional Features: IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: TFBGA
Width: 11.5 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
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