Xilinx - XC7Z030-2FFG676I

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XC7Z030-2FFG676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z030-2FFG676I
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
Datasheet XC7Z030-2FFG676I Datasheet
In Stock94
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Other Names: 122-1888
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SYSTEM ON CHIP
Nominal Supply Voltage: 1 V
Maximum Supply Voltage: 1.05 V
Maximum Seated Height: 3.24 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 676
Package Equivalence Code: BGA676,26X26,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 27 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B676
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 27 mm
Terminal Pitch: 1 mm
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