1596 Other Function uPs,uCs & Peripheral ICs 98

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVM1402-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel	0 Cel	BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2HSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVC1802-2HSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVC1502-2MLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2MSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-1MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-2MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-1LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-1LLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2MLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-2MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1902-2MSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-1MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-1MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1902-2MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-1LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-2MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-1MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-1MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-1MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-1LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-2MLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1502-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1502-1MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-1LLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1702-1LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-1LSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1802-2MSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-2LLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1502-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1802-2MLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1702-1LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1502-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-1LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-1MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	40 mm	40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-2MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-1MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.