1760 Other Function uPs,uCs & Peripheral ICs 326

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU11EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-L1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU19EG-2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU17EG-1FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-L2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCVM1802-1MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.775 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

e1

XCZU19EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCVC1902-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.854 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.88 V

.92 mm

S-PBGA-B1760

XCZU17EG-2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU11EG-1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-L2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU49DR-2FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU11EG-3FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1760

4

e1

XCZU19EG-2FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-2FFVF1760E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU29DR-1FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-1FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCVC1902-2MLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.775 V

110 Cel

0 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

XCZU19EG-1FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-1FSVF1760E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCVM1802-1LSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.676 V

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 mm

40 mm

40 mm

CMOS

.7 V

.92 mm

S-PBGA-B1760

e1

XCZU17EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-3FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1760

4

e1

XCZU49DR-1FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-2FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-L2FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCVP1052-2HSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1760

XCVP1002-2LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-1LLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-1MSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1052-1LSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

100 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-2MLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1002-2MLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1002-1LSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-2LLIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1052-1MSEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

100 Cel

0 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B1760

XCVP1052-2LLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVP1002-2LLEVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

0 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B1760

XCVC1902-1MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.775 V

100 Cel

0 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

XCVC1902-2MSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.775 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

XCVC1902-1LSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.676 V

100 Cel

0 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.7 V

.92 mm

S-PBGA-B1760

XCVC1902-2LLIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.676 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.7 V

.92 mm

S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.