1760 Other Function uPs,uCs & Peripheral ICs 326

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC2802-1LSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2602-1LLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVC2802-2MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2602-2MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2802-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2802-2MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2602-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2802-2MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVE2602-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2802-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2802-1LLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2602-1LSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVE2802-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2802-1MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC2602-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1052-1MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1002-1LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1052-2LLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1052-1LLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1002-1MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1002-2MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1002-1MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1052-2MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1002-2HSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B1760
XCVP1052-2MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1052-1MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1052-2MLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1052-1LSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1052-2MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1052-2LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1002-2MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XQZU29DR-L1FFRF1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			40	245		CMOS	.85 V		S-PBGA-B1760	4	e0
XCVC1802-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XQZU29DR-1FFRF1760M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM			40	245		CMOS	.85 V		S-PBGA-B1760	4	e0
XCVP1102-2LLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVC1902-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1802-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1902-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1102-1LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1102-2MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC1902-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1802-2LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1402-2LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVC1802-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1902-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1402-1LSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVP1402-1MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC1802-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.