208 Other Function uPs,uCs & Peripheral ICs 17

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	External Data Bus Width	Maximum Clock Frequency	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
S6J32GEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS		1.2 V			.5 mm	S-PQFP-G208
AGB75LC04-QU-E	Amulet Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V			FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.08 V	85 Cel	-40 Cel		QUAD	4.1 mm	28 mm			28 mm	CMOS		1.2 V			.5 mm	S-PQFP-G208	3
TFB2002B	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V			FLATPACK		4.75 V	70 Cel	0 Cel		QUAD						CMOS		5 V				S-PQFP-G208		Not Qualified
TFB2051PPM	Texas Instruments			GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK	QFP208,1.2SQ,20					QUAD						BICMOS			Other Microprocessor ICs		.5 mm	S-PQFP-G208		Not Qualified
FIDO1100BGA208IR1	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC	YES	2.75 V			GRID ARRAY	BGA208,18X18,20	2.25 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	10 mm	16	2.6 MHz	10 mm			2.5 V		SPI; UART	.5 mm	S-PBGA-B208
STG2000XC	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, FINE PITCH		3 V	85 Cel	0 Cel		QUAD	4.07 mm	28 mm			28 mm	CMOS		3.3 V			.5 mm	S-PQFP-G208		Not Qualified
STA2059	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V			FLATPACK		1.71 V	85 Cel	-40 Cel		QUAD						CMOS		1.8 V				S-PQFP-G208		Not Qualified
LH79524N0E100A0	NXP Semiconductors		INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA208,16X16,32		85 Cel	-40 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B208		Not Qualified
LH79524	NXP Semiconductors		INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA208,16X16,32		85 Cel	-40 Cel		BOTTOM									Other Microprocessor ICs		.8 mm	S-PBGA-B208		Not Qualified
CY82C690-NC	Infineon Technologies		COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3,5	FLATPACK	QFP208,1.2SQ,20		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD									Other Microprocessor ICs		.5 mm	S-PQFP-G208		Not Qualified	e0
S6J32EEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS		1.2 V			.5 mm	S-PQFP-G208
S6J32GEKSMSE2000A	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS		1.2 V			.5 mm	S-PQFP-G208
S6J32FEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS		1.2 V			.5 mm	S-PQFP-G208
S6J32JEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	125 Cel	-40 Cel		QUAD	1.7 mm	28 mm			28 mm	CMOS		1.2 V			.5 mm	S-PQFP-G208
VRC4372-1	Renesas Electronics		COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel	0 Cel		QUAD							600 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQFP-G208		Not Qualified
S3C4510B01-QE80	Samsung		COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel	0 Cel		QUAD							230 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQFP-G208		Not Qualified
S3C4510B01-QER0	Samsung		COMMERCIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3	FLATPACK	QFP208,1.2SQ,20		70 Cel	0 Cel		QUAD							230 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQFP-G208		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.