2197 Other Function uPs,uCs & Peripheral ICs 150

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVC1702-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVC1902-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVC1702-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM2202-2MLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1502-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2502-1MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1802-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2502-1LSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM2502-1LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM2202-2MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1802-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM2202-1MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1502-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2202-1MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM2502-1MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1502-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2502-2LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM2502-2MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1502-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2502-2MLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM2202-1LSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM1802-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1802-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM2202-3HSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B2197
XCVM2502-2MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1502-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2502-2MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM2502-3HSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B2197
XCVM2502-1MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1502-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V	.92 mm	S-PBGA-B2197
XCVM1502-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197
XCVM1802-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM2202-1LLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM2202-1LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM2502-2LLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVM2202-1MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM2202-2MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVM1802-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVM1502-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.