Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T24 |
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Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-PRF-38535 Class Q |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
NOT SPECIFIED |
NOT SPECIFIED |
BICMOS |
5 V |
R-GDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
CMOS |
7 mA |
3.3 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
MIL-STD-883 |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
-40 Cel |
GOLD FLASH PALLADIUM |
DUAL |
2.65 mm |
7.49 mm |
15.365 mm |
CMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
e4 |
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Texas Instruments |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MIL-STD-883 Class B (Modified) |
IN-LINE |
DIP24,.3 |
125 Cel |
-55 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
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Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T24 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
3.6 V |
MIL-PRF-38535 |
3/3.3 |
FLATPACK |
FL24,.35 |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
2.29 mm |
9.09 mm |
14.36 mm |
CMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-GDFP-F |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
15.4 mm |
CMOS |
3 V |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
0 |
30 |
260 |
15.4 mm |
BICMOS |
18 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
15.4 mm |
CMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
3.6 V |
3/3.3 |
IN-LINE |
DIP24,.3 |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
32.005 mm |
CMOS |
3 V |
Other Microprocessor ICs |
2.54 mm |
R-CDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
MIL-STD-883 Class B |
IN-LINE |
4.75 V |
125 Cel |
-55 Cel |
DUAL |
CMOS |
5 V |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
4.4 mm |
0 |
30 |
260 |
7.8 mm |
BICMOS |
20 mA |
3 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MIL-STD-883 Class B (Modified) |
IN-LINE |
DIP24,.3 |
125 Cel |
-55 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-PRF-38535 |
5 |
IN-LINE |
DIP24,.3 |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
32.005 mm |
BICMOS |
18 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
0 |
30 |
260 |
15.4 mm |
BICMOS |
20 mA |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
MIL-PRF-38535 Class Q |
5 |
FLATPACK |
FL24,.4 |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
2.29 mm |
9.085 mm |
14.355 mm |
BICMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
R-GDFP-F24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
15.4 mm |
BICMOS |
5 V |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
0 |
30 |
260 |
15.4 mm |
BICMOS |
20 mA |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
3.6 V |
3/3.3 |
IN-LINE |
DIP24,.3 |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
32.005 mm |
CMOS |
7 mA |
3 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE |
SOP24,.4 |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
15.4 mm |
BICMOS |
18 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
SOP24,.4 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
1.27 mm |
R-PDSO-G24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
3.6 V |
38535Q/M;38534H;883B |
3.3 |
IN-LINE |
DIP24,.3 |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
32.005 mm |
CMOS |
7 mA |
3.3 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
SOP24,.4 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
1.27 mm |
R-PDSO-G24 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
4.4 mm |
0 |
30 |
260 |
7.8 mm |
BICMOS |
3.3 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T24 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
4.4 mm |
0 |
30 |
260 |
7.8 mm |
BICMOS |
20 mA |
3 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
2.65 mm |
7.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15.4 mm |
CMOS |
185 mA |
5 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
3.6 V |
MIL-PRF-38535 |
3.3 |
IN-LINE |
DIP24,.3 |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
32.05 mm |
CMOS |
3 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
.5 mm |
S-PQCC-N24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
.5 mm |
S-PQCC-N24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
.5 mm |
S-PQCC-N24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
.5 mm |
S-PQCC-N24 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CHIP CARRIER, VERY THIN PROFILE |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE |
4 mm |
CMOS |
.5 mm |
S-PQCC-N24 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.13SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.85 mm |
3.5 mm |
30 |
260 |
3.5 mm |
BICMOS |
.06 mA |
2.5 V |
Parallel IO Port |
.4 mm |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
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Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.4 V |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e0 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.62 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.8 mm |
3.5 mm |
30 |
260 |
3.5 mm |
BICMOS |
2.5 V |
.4 mm |
S-XQCC-N24 |
1 |
e3 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
MONITORS UP TO 64 KEYS |
30 |
260 |
4 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.5 mm |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.24 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.73 mm |
3.9 mm |
MONITORS UP TO 64 KEYS |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.