Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
MONITORS UP TO 64 KEYS |
30 |
260 |
4 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.5 mm |
S-XQCC-N24 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.24 |
2.4 V |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.73 mm |
3.9 mm |
30 |
260 |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
18 V |
IN-LINE |
3 V |
125 Cel |
-55 Cel |
DUAL |
5.715 mm |
15.24 mm |
NOT SPECIFIED |
NOT SPECIFIED |
31.75 mm |
CMOS |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
SMALL OUTLINE |
3 V |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
18 V |
IN-LINE |
3 V |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
5.71 mm |
15.24 mm |
CMOS |
5 V |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
SMALL OUTLINE |
3 V |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
SMALL OUTLINE |
3 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
15 V |
IN-LINE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
15.24 mm |
CMOS |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
5 |
IN-LINE |
DIP24,.3 |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.953 mm |
7.62 mm |
31.75 mm |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
20 V |
SMALL OUTLINE |
3 V |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
15 V |
IN-LINE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
15.24 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.72 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
3 V |
.5 mm |
S-PQCC-N24 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.5,3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
85 Cel |
-40 Cel |
DUAL |
260 |
Other Microprocessor ICs |
.635 mm |
R-PDSO-G24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N24 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.75 V |
125 Cel |
-40 Cel |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
4 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
4 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N24 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
8192 |
4 mm |
30 |
260 |
4 mm |
1024 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
.5 mm |
S-XQCC-N24 |
3 |
Not Qualified |
25.2 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
IT ALSO OPERATES AT 2 TO 5.5V SUPPLY |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
IT ALSO OPERATES IN 2V TO 5.5V SUPPLY VOLTAGE |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
IT ALSO OPERATES IN 2V TO 5.5V SUPPLY VOLTAGE |
30 |
260 |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
IT ALSO OPERATES AT 2 TO 5.5V SUPPLY |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
4 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
4 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N24 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
8192 |
4 mm |
30 |
260 |
4 mm |
1024 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
.5 mm |
S-XQCC-N24 |
3 |
Not Qualified |
25.2 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
105 Cel |
-40 Cel |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
4 mm |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.24 |
2.4 V |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1.73 mm |
3.9 mm |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.45 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.15 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.45 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.15 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.8 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.5 mm |
BICMOS |
2.5 V |
.4 mm |
S-XQCC-N24 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.62 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
3.5 mm |
30 |
260 |
3.5 mm |
BICMOS |
2.5 V |
.4 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.