STMicroelectronics - HCC40108BF

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HCC40108BF by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCC40108BF
Description MICROPROCESSOR CIRCUIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet HCC40108BF Datasheet
In Stock1,056
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: CERAMIC, GLASS-SEALED
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Supply Voltage: 18 V
Maximum Seated Height: 5.715 mm
Surface Mount: NO
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
No. of Terminals: 24
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 31.75 mm
Technology: CMOS
JESD-30 Code: R-GDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: DIP
Width: 15.24 mm
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
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