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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | HCC40108BF |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | HCC40108BF Datasheet |
| In Stock | 1,056 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | CERAMIC, GLASS-SEALED |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Supply Voltage: | 18 V |
| Maximum Seated Height: | 5.715 mm |
| Surface Mount: | NO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| No. of Terminals: | 24 |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Length: | 31.75 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-GDIP-T24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 125 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | DIP |
| Width: | 15.24 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
