25 Other Function uPs,uCs & Peripheral ICs 25

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	Width	Additional Features	Boundary Scan	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES				CHIP CARRIER			40 Cel	0 Cel		BOTTOM		1.781 mm	3.18 mm				NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-PBCC-B25
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.98 V	128		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm				30	260	2.01 mm	CMOS	.03 mA	1.8 V		.4 mm		S-PBGA-B25	1		e1	20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.98 V	128		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm				30	260	2.01 mm	CMOS	.03 mA	1.8 V		.4 mm		S-PBGA-B25	1		e1	20
R3910-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel		UNSPECIFIED		1.525 mm	3.81 mm	SEATED HGT-NOM			30	260	5.59 mm	CMOS		1.25 V				R-XXMA-N25	3
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES				CHIP CARRIER	LGA25,3X8,27		40 Cel	0 Cel		BOTTOM		1.781 mm	3.18 mm		NO	4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V		.686 mm	FIXED POINT	R-PBCC-B25
LM8330TMX	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.98 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-30 Cel		BOTTOM		.675 mm	2.015 mm						2.015 mm	CMOS		1.8 V		.4 mm		S-PBGA-B25
DS3641B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			GRID ARRAY		3.3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	260		CMOS						S-PBGA-B25	3		e1
DS3641B+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			GRID ARRAY		3.3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	260		CMOS						S-PBGA-B25	3		e1
SA3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES				CHIP CARRIER			40 Cel	0 Cel		BOTTOM		1.781 mm	3.18 mm				NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-PBCC-B25
SB3230-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES				CHIP CARRIER			40 Cel	0 Cel		BOTTOM		1.781 mm	3.18 mm						5.59 mm	CMOS		1.25 V				R-PBCC-B25
SB3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel		UNSPECIFIED		1.525 mm	3.81 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-XXMA-N25
SB3231-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel		UNSPECIFIED		1.525 mm	3.81 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-XXMA-N25
SB3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel		UNSPECIFIED		1.525 mm	3.81 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-XXMA-N25
SB3231-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel		UNSPECIFIED		1.525 mm	3.81 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-XXMA-N25
R3910-CFAB-E1B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel		UNSPECIFIED		1.525 mm	3.81 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS		1.25 V				R-XXMA-N25
NHS3152UK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM		.54 mm	2.51 mm						2.51 mm	CMOS		3.3 V		.4 mm		S-PBGA-B25
NHS3100UK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.72 V	85 Cel	-40 Cel		BOTTOM		.54 mm	2.51 mm						2.51 mm	CMOS		3 V		.4 mm		S-PBGA-B25
CY8C4045FNI-S412	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.482 mm	1.932 mm						2.022 mm	CMOS		1.8 V		.35 mm		R-PBGA-B25			e1
CY8C4024FNI-S402	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.482 mm	1.932 mm						2.022 mm	CMOS		1.8 V		.35 mm		R-PBGA-B25			e1
CY8C4245FNI-DS402	Infineon Technologies	PROGRAMMABLE SoC		BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.8 V	85 Cel	-40 Cel		BOTTOM		.55 mm	2.07 mm						2.11 mm	CMOS		3 V		.4 mm		R-PBGA-B25
CY8C4025FNI-S402	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.482 mm	1.932 mm						2.022 mm	CMOS		1.8 V		.35 mm		R-PBGA-B25			e1
CY8C4025FNI-S412	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.482 mm	1.932 mm						2.022 mm	CMOS		1.8 V		.35 mm		R-PBGA-B25			e1
CY8C4024FNI-S412	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.482 mm	1.932 mm						2.022 mm	CMOS		1.8 V		.35 mm		R-PBGA-B25			e1
MAX7359EWA+	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		.69 mm	2.09 mm				30	260	2.09 mm	BICMOS	.06 mA	2.5 V	Parallel IO Port	.4 mm		S-PBGA-B25	1	Not Qualified	e2
MAX7359EWA+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED		YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		.69 mm	2.09 mm				30	260	2.09 mm	BICMOS		2.5 V		.4 mm		S-XBGA-B25	1		e2

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.