272 Other Function uPs,uCs & Peripheral ICs 13

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6Y1CVK05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6Y1CVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6G3CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6G2CVK05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6Y1DVK05AA	NXP Semiconductors	SoC	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6G3CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCIMX6Y1DVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
PCI9656-AA66BI	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES		2.5,3.3	GRID ARRAY	BGA272,20X20,50		85 Cel	-40 Cel	TIN LEAD	BOTTOM			ALSO REQUIRES 3.3V SUPPLY FOR I/O				CMOS	.05 mA	2.5 V	Bus Controllers	1.27 mm	S-PBGA-B272		Not Qualified	e0
L64388VG	Broadcom			BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES		3.3	GRID ARRAY	BGA272,20X20,50					BOTTOM							CMOS		3.3 V	Other uPs/uCs/Peripheral ICs	1.27 mm	S-PBGA-B272		Not Qualified
T-8110---BAL-DB	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY		3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	2.32 mm	27 mm		30	225	27 mm	CMOS		3.3 V		1.27 mm	S-PBGA-B272		Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.