NXP Semiconductors - MCIMX6Y2CVK08AB

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MCIMX6Y2CVK08AB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6Y2CVK08AB
Description SoC; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet MCIMX6Y2CVK08AB Datasheet
In Stock861
NAME DESCRIPTION
Minimum Supply Voltage: 1.325 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: 1.5 V
Maximum Seated Height: 1.23 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 272
Package Equivalence Code: BGA272,17X17,20
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 9 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B272
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 260
Package Code: LFBGA
Width: 9 mm
Terminal Pitch: .5 mm
Moisture Sensitivity Level (MSL): 3
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