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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | NT3H2111W0FHKH |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVQCCN; Package Shape: SQUARE; |
Datasheet | NT3H2111W0FHKH Datasheet |
In Stock | 16,739 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.67 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .5 mm |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 8 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-PQCC-N8 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 105 Cel |
Package Code: | HVQCCN |
Width: | 1.6 mm |
Moisture Sensitivity Level (MSL): | 1 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 3.6 V |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
Length: | 1.6 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |