NXP Semiconductors - MIMX8QX6AVLFZAC

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MIMX8QX6AVLFZAC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MIMX8QX6AVLFZAC
Description SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MIMX8QX6AVLFZAC Datasheet
In Stock171
NAME DESCRIPTION
Minimum Supply Voltage: 1.05 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.52 mm
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 609
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B609
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.15 V
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA609,35X35,32
Length: 21 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
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