NXP Semiconductors - MCIMX283CVM4BR2

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MCIMX283CVM4BR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX283CVM4BR2
Description SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX283CVM4BR2 Datasheet
In Stock1,595
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.45 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.37 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 289
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B289
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.55 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA289,17X17,32
Length: 14 mm
Additional Features: IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.4,1.8
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