Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-20 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
105 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
105 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK, LOW PROFILE |
4.35 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G32 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-20 Cel |
QUAD |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
105 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
5 mm |
NOT SPECIFIED |
260 |
5 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK, LOW PROFILE |
4.35 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G32 |
3 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.3 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
5 mm |
CMOS |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N32 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3.3 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
8 |
12.02 MHz |
40 |
260 |
5 mm |
CMOS |
5 V |
USB |
.5 mm |
S-XQCC-N32 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK, LOW PROFILE |
4.35 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
5 V |
.8 mm |
S-PQFP-G32 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
1 mm |
4 mm |
30 |
260 |
4 mm |
28672 |
CMOS |
3.3 V |
.4 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.3 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
40 |
260 |
5 mm |
CMOS |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
5 mm |
NOT SPECIFIED |
260 |
5 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
4 mm |
NOT SPECIFIED |
260 |
4 mm |
28672 |
CMOS |
3.3 V |
.4 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
1 mm |
4 mm |
30 |
260 |
4 mm |
28672 |
CMOS |
3.3 V |
.4 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
105 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.7 V |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
30 |
260 |
5 mm |
CMOS |
220 mA |
3.3 V |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
4 mm |
40 |
260 |
4 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N32 |
2 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
4 mm |
40 |
260 |
4 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N32 |
2 |
e3 |
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|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
4 mm |
NOT SPECIFIED |
260 |
4 mm |
28672 |
CMOS |
3.3 V |
.4 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
105 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.93 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
Microcontrollers |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.93 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
Microcontrollers |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
4 mm |
40 |
260 |
4 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N32 |
2 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
Microcontrollers |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
Microcontrollers |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
4 mm |
40 |
260 |
4 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N32 |
2 |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.