32 Other Function uPs,uCs & Peripheral ICs 248

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ST33HTPH2X32AHD4

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

105 Cel

-40 Cel

QUAD

1 mm

5 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

NOT SPECIFIED

NOT SPECIFIED

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

CC1310F64RHBT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

NOT SPECIFIED

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

EFR32MG21A010F1024IM32-B

Silicon Labs

SYSTEM ON CHIP

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

1.71 V

125 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

4 mm

40

260

4 mm

CMOS

3 V

.4 mm

S-XQCC-N32

2

e3

ZL30250LDG1

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

5 mm

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

EFR32MG21A010F768IM32-B

Silicon Labs

SYSTEM ON CHIP

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

1.71 V

125 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

4 mm

40

260

4 mm

CMOS

3 V

.4 mm

S-XQCC-N32

2

e3

SLB9670XQ2.0

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER

LCC32,.2SQ,20

1.65 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N32

1

FCM8531QY

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

5 V

I2C; SPI; UART

.8 mm

S-PQFP-G32

SLI9670AQ20FW1311XUMA1

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.95 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.65 V

105 Cel

-40 Cel

NICKEL GOLD PALLADIUM SILVER

QUAD

.9 mm

5 mm

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

3

SLB9670XQ20FW763XUMA2

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER

LCC32,.2SQ,20

1.65 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N32

ST33HTPH2032AHD1

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

5 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

30

260

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

1

e4

SLB9670XQ12FW640XUMA1

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.65 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N32

ST33HTPH2032AAF3

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

105 Cel

-40 Cel

QUAD

1 mm

5 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

NOT SPECIFIED

NOT SPECIFIED

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

CY8C4025LQI-S412

Infineon Technologies

PSoC

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

5 mm

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

3

e4

CC1310F64RSMT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

4 mm

NOT SPECIFIED

260

4 mm

28672

CMOS

3.3 V

.4 mm

S-PQCC-N32

3

e4

CC1310F64RHBR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

NOT SPECIFIED

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

SLB9670VQ12FW643XUMA2

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.65 V

85 Cel

-20 Cel

NICKEL GOLD PALLADIUM SILVER

QUAD

.9 mm

5 mm

ALSO OPERATES WITH 3.3V NOM SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N32

3

CC2543RHBR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

5 mm

0

30

260

5 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

I2C; SPI; UART; USART

.5 mm

S-PQCC-N32

3

Not Qualified

e4

CC1310F32RHBT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

NOT SPECIFIED

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

MPXY8500DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

ST33HTPH2E32AHD0

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

105 Cel

-40 Cel

QUAD

1 mm

5 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

NOT SPECIFIED

NOT SPECIFIED

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

CC1310F32RSMR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

4 mm

NOT SPECIFIED

260

4 mm

28672

CMOS

3.3 V

.4 mm

S-PQCC-N32

3

e4

EFR32MG13P632F512GM32-DR

Silicon Labs

SYSTEM ON CHIP

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

TDA8029HL/C207,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8/5,3/5

FLATPACK

QFP32,.35SQ,32

90 Cel

-40 Cel

QUAD

260

Other Microprocessor ICs

.8 mm

S-PQFP-G32

1

Not Qualified

TDA8029HL/C207

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

FLATPACK, LOW PROFILE

2.7 V

90 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.8 mm

S-PQFP-G32

CY8C4045LQI-S412

Infineon Technologies

PSoC

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

-40 Cel

PURE TIN

QUAD

.6 mm

5 mm

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

3

FCM8531RQY

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

5 V

I2C; SPI; UART

.8 mm

S-PQFP-G32

MFRC53101T/0FE,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3/5,5

SMALL OUTLINE

SOP32,.4

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

30

250

150 mA

Other Microprocessor ICs

1.27 mm

R-PDSO-G32

1

Not Qualified

e4

SLB9645VQ12FW13333XUMA1

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.98 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.62 V

85 Cel

-20 Cel

NICKEL GOLD PALLADIUM SILVER

QUAD

.9 mm

5 mm

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

5 mm

CMOS

1.8 V

.5 mm

S-PQCC-N32

3

ST33HTPH2X32AHC5

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

105 Cel

-40 Cel

QUAD

1 mm

5 mm

ALSO AVAILABLE WITH 3.3V NOM SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

STWBCTR

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

105 Cel

-40 Cel

QUAD

1 mm

5 mm

5 mm

CMOS

5 V

.5 mm

S-XQCC-N32

EFR32MG13P632F512GM32-D

Silicon Labs

SYSTEM ON CHIP

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG21B020F1024IM32-B

Silicon Labs

SYSTEM ON CHIP

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

1.71 V

125 Cel

-40 Cel

QUAD

.9 mm

4 mm

4 mm

CMOS

3 V

.4 mm

S-XQCC-N32

FT245BM

FTDI

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK, LOW PROFILE

4.35 V

70 Cel

0 Cel

TIN LEAD

QUAD

1.6 mm

7 mm

250

7 mm

CMOS

5 V

.8 mm

S-PQFP-G32

3

Not Qualified

e0

TDA8035HN/C1,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

85 Cel

-25 Cel

QUAD

1 mm

5 mm

260

5 mm

CMOS

220 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

ZL30250LDF1

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

5 mm

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

SLB9665VQ20FW563XUMA3

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3 V

85 Cel

-20 Cel

NICKEL GOLD PALLADIUM SILVER

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

EFR32MG21B020F512IM32-B

Silicon Labs

SYSTEM ON CHIP

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

1.71 V

125 Cel

-40 Cel

QUAD

.9 mm

4 mm

4 mm

CMOS

3 V

.4 mm

S-XQCC-N32

EFR32FG1P131F256GM32-C0R

Silicon Labs

SoC

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.85 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG1B132F256GM32-C0

Silicon Labs

SoC

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.85 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG21B010F512IM32-B

Silicon Labs

SYSTEM ON CHIP

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.16SQ,16

1.71 V

125 Cel

-40 Cel

QUAD

.9 mm

4 mm

4 mm

CMOS

3 V

.4 mm

S-XQCC-N32

SI8250-IQ

Silicon Labs

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

2.75 V

FLATPACK, LOW PROFILE

2.25 V

125 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

2.5 V

.8 mm

S-PQFP-G32

Not Qualified

SI8251-IQ

Silicon Labs

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

2.75 V

FLATPACK, LOW PROFILE

2.25 V

125 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

2.5 V

.8 mm

S-PQFP-G32

Not Qualified

ADUCM330WFSBCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

18 V

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.24SQ,20

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

CMOS

SPI

.5 mm

S-XQCC-N32

EFR32BG13P632F512GM32-DR

Silicon Labs

SoC

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG13P732F512GM32-DR

Silicon Labs

SYSTEM ON CHIP

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG13P732F512IM32-DR

Silicon Labs

SYSTEM ON CHIP

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.8 V

125 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG1B232F256GM32-C0R

Silicon Labs

SoC

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.85 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

EFR32MG1V132F256GM32-C0

Silicon Labs

SoC

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.85 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3.3 V

.5 mm

S-XQCC-N32

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.