36 Other Function uPs,uCs & Peripheral ICs 14

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ATWINC3400-MR210CA122-T

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.087 mm

14.732 mm

SEATED HGT-CALCULATED

NOT SPECIFIED

NOT SPECIFIED

22.428 mm

CMOS

3.6 V

1.204 mm

R-XXMA-N36

FSC-BT802

Shenzhen Feasycom

SoC

NO LEAD

36

QMA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

QUAD

9.7 mm

BOX PACKAGE METHOD IS AVAILABLE WITH 2000PCS OF PACKAGE QUANTITY

11.5 mm

CMOS

3.3 V

1 mm

R-XQMA-N36

ATWINC3400-MR210UA122

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.087 mm

14.732 mm

SEATED HGT-CALCULATED

NOT SPECIFIED

NOT SPECIFIED

22.428 mm

CMOS

3.6 V

1.204 mm

R-XXMA-N36

ATWINC3400-MR210CA131-T

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

2.5 V

85 Cel

-40 Cel

UNSPECIFIED

2.0874 mm

14.732 mm

SEATED HGT-CALCULATED

NOT SPECIFIED

NOT SPECIFIED

22.3774 mm

CMOS

3.6 V

1.204 mm

R-XXMA-N36

LM8322JGR8/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.62 V

85 Cel

-40 Cel

TIN

BOTTOM

1.1 mm

3.5 mm

3.5 mm

CMOS

1.8 V

.5 mm

S-PBGA-B36

1

Not Qualified

e3

LM8322JGR8X/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.62 V

85 Cel

-40 Cel

TIN

BOTTOM

1.1 mm

3.5 mm

3.5 mm

CMOS

1.8 V

.5 mm

S-PBGA-B36

1

Not Qualified

e3

LM8322JGR8

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.62 V

85 Cel

-40 Cel

BOTTOM

1.1 mm

3.5 mm

3.5 mm

CMOS

1.8 V

.5 mm

S-PBGA-B36

Not Qualified

LM8322JGR8X

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.62 V

85 Cel

-40 Cel

BOTTOM

1.1 mm

3.5 mm

3.5 mm

CMOS

1.8 V

.5 mm

S-PBGA-B36

Not Qualified

LM8323JGR8AXM/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1.8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA36,6X6,20

1.62 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.1 mm

3.5 mm

0

30

260

3.5 mm

CMOS

3 mA

1.9 V

Other Microprocessor ICs

I2C

.5 mm

S-PBGA-B36

1

Not Qualified

e1

LM8323JGR8AXMX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1.8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA36,6X6,20

1.62 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.1 mm

3.5 mm

0

30

260

3.5 mm

CMOS

3 mA

1.9 V

Other Microprocessor ICs

I2C

.5 mm

S-PBGA-B36

1

Not Qualified

e1

L99MM70XP

STMicroelectronics

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

36

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

18 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

6 V

125 Cel

-40 Cel

Tin (Sn)

DUAL

2.45 mm

7.5 mm

30

260

10.3 mm

CMOS

13.5 V

.5 mm

R-PDSO-G36

3

e3

L99MM70XPTR

STMicroelectronics

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

36

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

18 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

6 V

125 Cel

-40 Cel

Tin (Sn)

DUAL

2.45 mm

7.5 mm

30

260

10.3 mm

CMOS

13.5 V

.5 mm

R-PDSO-G36

3

e3

TDA18204HN/C1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.47 V

CHIP CARRIER

3.13 V

QUAD

CMOS

3.3 V

S-PQCC-N36

BCM20707UA2EKUBGT

Infineon Technologies

MICROPROCESSOR CIRCUIT

OTHER

BALL

36

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.14 V

85 Cel

-30 Cel

BOTTOM

.55 mm

2.51 mm

2.77 mm

CMOS

1.2 V

.4 mm

R-PBGA-B36

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.